专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP1267594A3 Transfer material, method for producing the same and wiring substrate produced by using the same 审中-公开
标题翻译：转印材料，其制备和由此制造连接衬底
公开(公告)号：EP1267594A3
公开(公告)日：2003-01-02
申请号：EP02013908.5
申请日：2001-02-09
申请人： Matsushita Electric Industrial Co., Ltd.
发明人： Sugaya, Yasuhiro , Komatsu, Shingo , Hirano, Koichi , Nakatani, Seiichi , Matsuoka, Yasuyuki , Asahi, Toshiyuki , Yamashita, Yoshihisa
IPC分类号： H01L21/48 , H05K3/02
CPC分类号： H05K3/20 , H01L2221/68345 , H01L2221/68359 , H01L2221/68363 , H01L2924/0002 , H01L2924/0102 , H01L2924/01078 , H05K1/0306 , H05K1/16 , H05K1/162 , H05K1/165 , H05K1/167 , H05K3/205 , H05K3/4061 , H05K3/4069 , H05K2203/1461 , Y10T29/49149 , Y10T29/49179 , Y10T29/49208 , Y10T29/49213 , Y10T428/12486 , H01L2924/00
摘要： A transfer material capable of transferring a fine wiring pattern to a substrate reliably and easily. The transfer material includes at least three layers of a first metal layer 101 as a carrier, a second metal layer 103 that is transferred to the substrate as a wiring pattern, and a peel layer 102 adhering the first and second metal layers releasably. On the surface portion of the 'first metal layer 101, a concave and convex portion corresponding to the wiring pattern is formed, and the peel layer 102 and the second metal layer 103 are formed on a region of the convex portions.

2. 发明公开

EP1213952A2 Circuit substrate and manufacturing method thereof 审中-公开
标题翻译：其生产电路衬底和方法
公开(公告)号：EP1213952A2
公开(公告)日：2002-06-12
申请号：EP01128763.8
申请日：2001-12-03
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Tomekawa, Satoru , Yamashita, Yoshihisa , Suzuki, Takeshi , Kawakita, Yoshihiro , Nakamura, Tadashi
IPC分类号： H05K3/40 , H05K3/46
CPC分类号： H05K3/4069 , H05K1/0271 , H05K3/0035 , H05K3/20 , H05K3/384 , H05K3/386 , H05K3/4614 , H05K3/4652 , H05K3/4658 , H05K2201/0355 , H05K2201/09109 , H05K2203/0361 , H05K2203/1461 , Y10T428/24
摘要： A connecting strength at a bonding site between a wiring layer 1c and a conductor 1d is enhanced by comparing a bonding strength between a wiring layer 14 provided by covering the conductor 1d on an insulating base 1a and the conductor 1d with a bonding strength between the wiring layer 1c and the insulating base 1a in an adjacency of the conductor to set the latter relatively lower.

3. 发明公开

EP1895584A1 Thermally conductive substrate with leadframe and heat radiation plate and manufacturing method thereof 有权
标题翻译：一种用于与引线框和导热板制备导热基板的制造方法
公开(公告)号：EP1895584A1
公开(公告)日：2008-03-05
申请号：EP07021191.7
申请日：2001-05-30
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Yamashita, Yoshihisa , Hirano, Koichi , Nakatani, Seiichi , Matsuo, Mitsuhiro
IPC分类号： H01L23/433 , H01L23/498 , H01L21/48
CPC分类号： H05K1/0256 , H01L23/367 , H01L23/498 , H01L23/49861 , H01L23/60 , H01L2924/0002 , H05K1/0373 , H05K1/056 , H05K3/202 , H05K2201/0209 , H05K2201/0355 , H05K2201/09145 , H01L2924/00
摘要： The present invention relates to a thermally conductive substrate, wherein a lead frame (100) is provided on one surface of an insulator sheet (101) containing an inorganic filler and a radiation plate (102) is provided on the other surface of the insulator sheet (101) that is opposite to the one surface, wherein the lead frame (100) is embedded in the sheet (101) in such a way that only the surface of the lead frame (100) is exposed; a part of the lead frame (100) extends to an edge portion of the insulator sheet (101); and an edge portion of the radiation plate (102) located on and near the edge portion of the insulator sheet (101) to which the lead frame extends, is provided at a position away from the edge portion of the insulator sheet (101) inside of the insulator sheet (101) in a plane direction of the insulator sheet (101), and wherein an external radiation structure is plane-boned to an outer surface of said radiation plate (102), and at least a part of a region along a side surface of said radiation plate (102) in a thickness direction of said radiation plate (102) is exposed from said insulator sheet (101) over an entire periphery of said radiation plate.
摘要翻译：本发明涉及一种导热基底，worin引线框架（100）被设置在含有无机填料和辐射板（102）的一个绝缘片（101）的一个表面上设置在绝缘体板的另一个表面上（101）确实是相反的一个表面上，worin引线框架（100）在寻求一种方式并仅在引线框架的表面（100）被暴露嵌入在片（101）; 引线框架（100）的一部分延伸到在所述绝缘片（101）的边缘部分; 和在位于与绝缘体片（101）与引线框架延伸的边缘部分附近的辐射板（102）的边缘部分，在从所述绝缘片（101）的边缘部离开的位置的内侧设置在绝缘片（101）和worin到外部辐射结构的平面方向上的绝缘片（101）是平的剔骨在所述辐射板的外表面（102）和至少一个沿一区域的一部分，以在所述辐射板（102）的厚度方向上所述辐射板（102）的侧表面上从所述绝缘片（101）上，在所述辐射板的整个外周露出。

4. 发明公开

EP1265463A2 Method for manufacturing circuit board and circuit board and power conversion module using the same 审中-公开
标题翻译：一种用于生产印刷电路板的过程，并使用相同的印刷电路板和电力转换模块
公开(公告)号：EP1265463A2
公开(公告)日：2002-12-11
申请号：EP02012716.3
申请日：2002-06-07
申请人： Matsushita Electric Industrial Co., Ltd.
发明人： Hirano, Koichi , Yamashita, Yoshihisa , Nakatani, Seiichi
IPC分类号： H05K1/03 , H05K3/00
CPC分类号： H05K1/0373 , H01L2224/48091 , H01L2224/48227 , H01L2924/19105 , H05K3/022 , H05K2201/0129 , H05K2201/0209 , H05K2201/0355 , H05K2203/0156 , Y10S428/901 , Y10T428/24917 , H01L2924/00014
摘要： A method for manufacturing a circuit board with high thermal dissipation includes the following steps: preparing a thermal conductive resin composition including 70 to 95 mass% of an inorganic filler and 5 to 30 mass% of a resin composition that includes a liquid thermosetting resin, a thermoplastic resin powder, and a latent curing agent; bonding the thermal conductive resin composition and a metal foil together by heating at a temperature lower than a temperature at which the thermosetting resin starts to cure while applying pressure so that the thermal conductive resin composition increases in viscosity and thus is solidified irreversibly; providing holes and curing the thermosetting resin to form an insulating substrate; and forming through holes and a circuit pattern. This method can achieve improved productivity and low cost in processing the holes. It is preferable that the thermal conductive resin composition is integral with a reinforcing material.
摘要翻译：一种用于电路板具有高的热耗散的制造方法，包括以下步骤：制备导热性树脂（21）组合物包括70至95％的无机填料和5质量％至30％由一种树脂组合物的质量做了包括液体热固性树脂，热塑性树脂粉末，和潜在性固化剂; 导热性树脂组合物（21）和金属箔（22）一起通过加热在比温度的温度下在其中热固性树脂开始固化，同时施加压力，以便做的导热性树脂组合物（21）接合在粘度增加从而不可逆地凝固; 设置孔（25）和固化所述热固性树脂以形成上绝缘基板（26）; 和形成电路图案（27）。这种方法可以在处理中的孔（25）实现改进的生产率和低成本。优选做的导热性树脂组合物（21）是与增强材料是一体的。

5. 发明公开

EP1933376A2 Transfer material, method for producing the same and wiring substrate produced by using the same 审中-公开
标题翻译： Übertragungsmaterial，Verfahren zu dessen Herstellung und Verdrahtungssubstrat，so hergestellt
公开(公告)号：EP1933376A2
公开(公告)日：2008-06-18
申请号：EP08153272.3
申请日：2001-02-09
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD
发明人： Sugaya, Yasuhiro , Komatsu, Shingo , Hirano, Koichi , Nakatini, Seiichi , Matsuoka, Yasuyuki , Asahi, Toshiyuki , Yamashita, Yoshihisa
IPC分类号： H01L21/48 , H05K3/02 , H05K3/20
CPC分类号： H05K3/20 , H01L2221/68345 , H01L2221/68359 , H01L2221/68363 , H01L2924/0002 , H01L2924/0102 , H01L2924/01078 , H05K1/0306 , H05K1/16 , H05K1/162 , H05K1/165 , H05K1/167 , H05K3/205 , H05K3/4061 , H05K3/4069 , H05K2203/1461 , Y10T29/49149 , Y10T29/49179 , Y10T29/49208 , Y10T29/49213 , Y10T428/12486 , H01L2924/00
摘要： A transfer material capable of transferring a fine wiring pattern to a substrate reliably and easily. The transfer material includes at least three layers of a first metal layer 101 as a carrier, a second metal layer 103 that is transferred to the substrate as a wiring pattern, and a peel layer 102 adhering the first and second metal layers releasably. On the surface portion of the first metal layer 101, a concave and convex portion corresponding to the wiring pattern is formed, and the peel layer 102 and the second metal layer 103 are formed on a region of the convex portions.
摘要翻译：能够可靠且容易地将精细布线图案转印到基板的转印材料。转印材料包括至少三层作为载体的第一金属层101，作为布线图案转印到基板的第二金属层103和可释放地粘附第一和第二金属层的剥离层102。在第一金属层101的表面部分上，形成与布线图形对应的凹凸部分，并且在凸部的区域上形成剥离层102和第二金属层103。

6. 发明公开

EP1213952A3 Circuit substrate and manufacturing method thereof 审中-公开
标题翻译：电路基板及其制造方法
公开(公告)号：EP1213952A3
公开(公告)日：2004-06-30
申请号：EP01128763.8
申请日：2001-12-03
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Tomekawa, Satoru , Yamashita, Yoshihisa , Suzuki, Takeshi , Kawakita, Yoshihiro , Nakamura, Tadashi
IPC分类号： H05K3/40 , H05K3/46
CPC分类号： H05K3/4069 , H05K1/0271 , H05K3/0035 , H05K3/20 , H05K3/384 , H05K3/386 , H05K3/4614 , H05K3/4652 , H05K3/4658 , H05K2201/0355 , H05K2201/09109 , H05K2203/0361 , H05K2203/1461 , Y10T428/24
摘要： A connecting strength at a bonding site between a wiring layer (1c) and a conductor (1d) is enhanced by comparing a bonding strength between a wiring layer (1c) and the conductor (1d) with a bonding strength between the wiring layer (1c) and the insulating base (1a) in an adjacency of the conductor (1d) to set the latter relatively lower.
摘要翻译：通过比较布线层（1c）和导体（1d）之间的接合强度以及布线层（1c）和布线层（1c）之间的接合强度，增强布线层）和导体（1d）邻近处的绝缘基体（1a），以使导体（1d）相对较低。

7. 发明公开

EP1160861A3 Thermally conductive substrate with leadframe and heat radiation plate and manufacturing method thereof 有权
标题翻译：导热基板具有用于其制备的引线框架和散热板和过程
公开(公告)号：EP1160861A3
公开(公告)日：2004-03-03
申请号：EP01113188.5
申请日：2001-05-30
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Yamashita, Yoshihisa , Hirano, Koichi , Nakatani, Seiichi , Matsuo, Mitsuhiro
IPC分类号： H01L23/433 , H01L23/498 , H01L21/48
CPC分类号： H05K1/0256 , H01L23/367 , H01L23/498 , H01L23/49861 , H01L23/60 , H01L2924/0002 , H05K1/0373 , H05K1/056 , H05K3/202 , H05K2201/0209 , H05K2201/0355 , H05K2201/09145 , H01L2924/00
摘要： A lead frame (100) is provided on a top surface of an electrically insulating sheet (101). A radiation plate (102) is attached to the bottom surface of the insulating sheet. By locating end portions of the radiation plate inside the periphery of the insulator sheet, it is possible to ensure a sufficiently large creeping distance between the lead frame and the radiation plate without decreasing a lead frame area on which components can be actually mounted. This arrangement acts to prevent electrical discharge between the lead frame and the radiation plate.
摘要翻译：的引线框架（100）被设置在电绝缘薄片（101）的顶表面上。辐射板（102）被附连到绝缘片的底表面上。通过定位绝缘体板的周边之内的辐射板的端部，所以可以确保引线框和所述辐射板之间的足够大的蠕变距离，而不降低在其上的部件可以实际安装在引线框架的区域。这种布置起到防止引线框架和散热板之间的放电。

8. 发明公开

EP1154469A1 Transfer material, method for producing the same and wiring substrate produced by using the same 审中-公开
标题翻译：转印材料，其制备和由此制造连接衬底
公开(公告)号：EP1154469A1
公开(公告)日：2001-11-14
申请号：EP01102797.6
申请日：2001-02-09
申请人： Matsushita Electric Industrial Co., Ltd.
发明人： Sugaya, Yasuhiro , Komatsu, Shingo , Hirano, Koichi , Nakatani, Seiichi , Matsuoka, Yasuyuki , Asahi, Toshiyuki , Yamashita, Yoshihisa
IPC分类号： H01L21/48 , H05K3/02
CPC分类号： H05K3/20 , H01L2221/68345 , H01L2221/68359 , H01L2221/68363 , H01L2924/0002 , H01L2924/0102 , H01L2924/01078 , H05K1/0306 , H05K1/16 , H05K1/162 , H05K1/165 , H05K1/167 , H05K3/205 , H05K3/4061 , H05K3/4069 , H05K2203/1461 , Y10T29/49149 , Y10T29/49179 , Y10T29/49208 , Y10T29/49213 , Y10T428/12486 , H01L2924/00
摘要： A transfer material capable of transferring a fine wiring pattern to a substrate reliably and easily. The transfer material includes at least three layers of a first metal layer 101 as a carrier, a second metal layer 103 that is transferred to the substrate as a wiring pattern, and a peel layer 102 adhering the first and second metal layers releasably. On the surface portion of the first metal layer 101, a concave and convex portion corresponding to the wiring pattern is formed, and the peel layer 102 and the second metal layer 103 are formed on a region of the convex portions.

9. 发明公开

EP1578178A1 Flexible substrate, multilayer flexible substrate and process for producing the same 有权
标题翻译：柔性衬底上，多层柔性基板和其制造方法
公开(公告)号：EP1578178A1
公开(公告)日：2005-09-21
申请号：EP05005701.7
申请日：2005-03-16
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Yamashita, Yoshihisa , Fujii, Toshio , Nakatani, Seiichi , Ichiryu, Takashi , Tomekawa, Satoru , Yabe, Hiroki
IPC分类号： H05K1/03 , H05K1/16 , H05K3/46 , H05K3/42 , H05K3/20
CPC分类号： H05K3/386 , H01L51/424 , H01L2924/0002 , H05K1/16 , H05K3/20 , H05K3/4069 , H05K3/4614 , H05K2201/0191 , H05K2201/0376 , Y10T29/49124 , Y10T29/49126 , Y10T29/49165 , H01L2924/00
摘要： A flexible substrate (100,110,120) comprising:

(i) a film (1);
(ii) an insulating resin layer (2a,2b) formed on each of front face of said film (1) and rear face of said film (1), said rear face being opposite to said front face.;
(iii) a front-sided wiring pattern (3a) embedded in the insulating resin layer (2a) formed on said front face of said film (1), and a rear-sided wiring pattern (3b) embedded in the insulating resin layer (2b) formed on said rear face of said film (1); and
(iv) a via (4) which is located between the front-sided wiring pattern (3a) and the rear-sided wiring pattern (3b) and serves to electrically connect said front-sided wiring pattern (3a) and said rear-sided wiring pattern (3b);
wherein said insulating resin layer (2a,2b) formed on each of said front face and said rear face of the said film (1) is thicker than said film (1).

10. 发明公开

EP1482543A2 Transfer material, method for producing the same and wiring substrate produced by using the same 审中-公开
标题翻译： Transfermaterial，seine Herstellung und damit hergestelltes Verbindungssubstrat
公开(公告)号：EP1482543A2
公开(公告)日：2004-12-01
申请号：EP04021133.6
申请日：2001-02-09
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Sugaya, Yasuhiro , Komatsu, Shingo , Hirano, Koichi , Nakatani, Seiichi , Matsuoka, Yasuyuki , Asahi, Toshiyuki , Yamashita, Yoshihisa
IPC分类号： H01L21/48 , H05K3/02
CPC分类号： H05K3/20 , H01L2221/68345 , H01L2221/68359 , H01L2221/68363 , H01L2924/0002 , H01L2924/0102 , H01L2924/01078 , H05K1/0306 , H05K1/16 , H05K1/162 , H05K1/165 , H05K1/167 , H05K3/205 , H05K3/4061 , H05K3/4069 , H05K2203/1461 , Y10T29/49149 , Y10T29/49179 , Y10T29/49208 , Y10T29/49213 , Y10T428/12486 , H01L2924/00
摘要： A transfer material capable of transferring a fine wiring pattern to a substrate reliably and easily. The transfer material includes at least three layers of a first metal layer 101 as a carrier, a second metal layer 103 that is transferred to the substrate as a wiring pattern, and a peel layer 102 adhering the first and second metal layers releasably. On the surface portion of the first metal layer 101, a concave and convex portion corresponding to the wiring pattern is formed, and the peel layer 102 and the second metal layer 103 are formed on a region of the convex portions.
摘要翻译：转印材料包括载体层，布线图案和可释放地粘附金属层的剥离层。转印材料包括作为载体的第一金属层（101）第二金属层（103）作为布线图案; 以及夹在第一和第二金属层之间的剥离层（102）。剥离层允许第一和第二金属层可剥离地粘合。在第一金属层的表面部分上形成与布线图形对应的凸部。剥离层和第二金属层形成在凸部的区域上。还包括（A）转移材料的制造方法的独立权利要求书，包括：（i）在第一金属层上形成剥离层，（ii）在剥离层上形成第二金属层，（iii）蚀刻第二金属层，剥离层和第一金属层的表面部分，通过化学蚀刻工艺形成第二金属层和剥离层成为布线图案，同时（iv）形成凸形和凹形具有与第一金属层的表面部分上的布线图形对应的凸部的部分; （B）包括电绝缘基板的布线基板和通过使用转印材料的转印方法形成在电绝缘基板的主平面上的布线图案; （C）使用转印材料的布线基板的制造方法，包括：在未固化的基材片的主面上形成包含第二金属层的布线图案金属层的转印材料侧，并剥离从第二金属层粘附到第二金属层的第一金属层，从而将布线图案金属层转印到基材片上。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式