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1. 发明授权

EP2232594B1 SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME 有权
标题翻译：半导体轻组分及其制备方法
公开(公告)号：EP2232594B1
公开(公告)日：2016-03-02
申请号：EP08863776.4
申请日：2008-12-17
申请人： LG Innotek Co., Ltd.
发明人： JEONG, Hwan Hee
IPC分类号： H01L33/24 , H01L33/22 , H01L33/00 , H01L33/32
CPC分类号： H01L33/24 , H01L33/0079 , H01L33/22 , H01L33/32

2. 发明授权

EP2860771B1 LIGHT-EMITTING DEVICE 有权转让
公开(公告)号：EP2860771B1
公开(公告)日：2020-08-05
申请号：EP13799862.1
申请日：2013-06-04
申请人： LG Innotek Co., Ltd.
发明人： JEONG, Hwan Hee
IPC分类号： H01L33/38 , H01L33/40 , H01L33/62 , H01L33/00 , H01L33/22 , H01L33/44

3. 发明授权

EP3422408B1 LIGHT-EMITTING DEVICE PACKAGE AND DISPLAY DEVICE HAVING SAME 有权转让
公开(公告)号：EP3422408B1
公开(公告)日：2019-12-25
申请号：EP17756831.8
申请日：2017-02-23
申请人： LG Innotek Co., Ltd.
发明人： LIM, Chang Man , LEE, Sang Hoon , JEONG, Hwan Hee
IPC分类号： H01L25/075 , H01L33/48 , H01L33/52 , H01L33/62 , G09F9/33

4. 发明公开

EP2860774A1 LIGHT-EMITTING DEVICE, LIGHT-EMITTING DEVICE PACKAGE, AND LIGHT UNIT 有权转让
标题翻译：发光器件，发光装置及照明封装，UNITY
公开(公告)号：EP2860774A1
公开(公告)日：2015-04-15
申请号：EP13801010.3
申请日：2013-05-24
申请人： LG Innotek Co., Ltd.
发明人： JEONG, Hwan Hee
IPC分类号： H01L33/36 , G02F1/13357
CPC分类号： H01L33/405 , H01L33/06 , H01L33/14 , H01L33/32 , H01L33/38 , H01L33/382 , H01L33/40 , H01L33/42 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2933/0016 , H01L2924/00014
摘要： A light-emitting device, according to one embodiment, comprises: a light-emitting structure comprising a first conductive semiconductor layer, an active layer which is underneath the first conductive semiconductor layer, and a second conductive semiconductor layer which is underneath the active layer; a reflective electrode, which is arranged under the light-emitting structure; and an electrode which is arranged inside the first conductive semiconductor layer and comprises a conductive ion injection layer.
摘要翻译：一种发光器件，雅丁一个实施例，包括：发光结构包括第一导电半导体层到活性层中的所有其是第一导电半导体层下方;以及第二导电半导体层中的所有其是有源层下方; 其在发光结构下排列的反射电极，所有; 和到电极的所有其在第一半导体层内设置的导电和包括导电离子注入层。

5. 发明公开

EP2860773A1 LIGHT-EMITTING DEVICE, LIGHT-EMITTING DEVICE PACKAGE, AND LIGHT UNIT 有权转让
标题翻译：发光器件，发光器件封装和发光单元
公开(公告)号：EP2860773A1
公开(公告)日：2015-04-15
申请号：EP13800692.9
申请日：2013-05-24
申请人： LG Innotek Co., Ltd.
发明人： JEONG, Hwan Hee
IPC分类号： H01L33/36 , H01L33/46 , H01L33/48 , G02F1/13357
CPC分类号： H01L33/10 , F21K9/232 , F21V3/061 , F21V3/062 , F21V29/74 , F21Y2101/00 , F21Y2107/30 , F21Y2113/00 , F21Y2115/10 , H01L33/0079 , H01L33/22 , H01L33/36 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A light-emitting device, according to one embodiment, comprises: a light-emitting structure comprising a first conductive semiconductor layer, an active layer which is underneath the first conductive semiconductor layer, and a second conductive semiconductor layer which is underneath the active layer; a first electrode which is arranged under the light-emitting structure and is electrically connected to the second conductive semiconductor layer; a reflection layer which is arranged inside the second conductive semiconductor layer and arranged apart from the first electrode and the active layer; and a second electrode which is electrically connected to the first conductive semiconductor layer.
摘要翻译：根据一个实施例的发光器件包括：发光结构，其包括第一导电半导体层，位于第一导电半导体层下方的有源层以及位于有源层下方的第二导电半导体层; 第一电极，其布置在所述发光结构下方并且电连接到所述第二导电半导体层; 反射层，其布置在所述第二导电半导体层内并且与所述第一电极和所述有源层分开布置; 以及电连接到第一导电半导体层的第二电极。

6. 发明公开

EP2860771A1 LIGHT-EMITTING DEVICE, LIGHT-EMITTING DEVICE PACKAGE, AND LIGHT UNIT 有权转让
标题翻译：发光器件，发光装置及照明封装，UNITY
公开(公告)号：EP2860771A1
公开(公告)日：2015-04-15
申请号：EP13799862.1
申请日：2013-06-04
申请人： LG Innotek Co., Ltd.
发明人： JEONG, Hwan Hee
IPC分类号： H01L33/36
摘要： A light-emitting device, according to one embodiment, comprises: a light-emitting structure comprising a first conductive semiconductor layer, an active layer which is underneath the first conductive semiconductor layer, and a second conductive semiconductor layer which is underneath the active layer; a reflective electrode which is arranged under the light-emitting structure; a first metal layer which is arranged under the reflective electrode and is electrically connected to the second conductive semiconductor layer; a second metal layer which is arranged under the reflective electrode and is insulated from the first metal layer; and a contact portion for electrically connecting the second metal layer and the first conductive semiconductor layer.
摘要翻译：一种发光器件，雅丁一个实施例，包括：发光结构包括第一导电半导体层到活性层中的所有其是第一导电半导体层下方;以及第二导电半导体层中的所有其是有源层下方; 反射电极的所有其在发光结构下排列; 的第一金属层中的所有被反射电极之下设置并电连接到所述第二半导体层的导电; 的第二金属层中的所有被反射电极下方排列，并从所述第一金属层电绝缘; 以及用于电连接所述第二金属层和所述第一半导体层的导电的接触部分。

7. 发明公开

EP2306530A2 SEMICONDUCTOR LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF 有权转让
标题翻译：一种半导体发光元件及其制造方法
公开(公告)号：EP2306530A2
公开(公告)日：2011-04-06
申请号：EP09800538.2
申请日：2009-07-17
申请人： LG Innotek Co., Ltd
发明人： JEONG, Hwan Hee
IPC分类号： H01L33/36
CPC分类号： H01L27/15 , H01L33/0079 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor light emitting device is provided. The semiconductor light emitting device according to the embodiment comprises a second electrode layer; a light emitting unit comprising a plurality of compound semiconductor layers under one side of the second electrode layer; a first insulating layer under the other side of the second electrode; an electrostatic protection unit comprising a plurality of compound semiconductor layer under the first insulating layer; a first electrode layer electrically connecting the light emitting unit to the electrostatic protection unit; and a wiring layer electrically connecting the electrostatic protection unit to the second electrode layer.

8. 发明授权

EP2860772B1 LIGHT-EMITTING DEVICE, LIGHT-EMITTING DEVICE PACKAGE, AND LIGHT UNIT 有权转让
公开(公告)号：EP2860772B1
公开(公告)日：2020-03-11
申请号：EP13799963.7
申请日：2013-05-22
申请人： LG Innotek Co., Ltd.
发明人： JEONG, Hwan Hee
IPC分类号： H01L33/36 , H01L33/42 , H01L33/48 , G02F1/13357

9. 发明公开

EP3422408A1 LIGHT-EMITTING ELEMENT PACKAGE AND DISPLAY DEVICE HAVING SAME 有权转让
公开(公告)号：EP3422408A1
公开(公告)日：2019-01-02
申请号：EP17756831.8
申请日：2017-02-23
申请人： LG Innotek Co., Ltd.
发明人： LIM, Chang Man , LEE, Sang Hoon , JEONG, Hwan Hee
IPC分类号： H01L25/075 , G09F9/33 , H01L33/48 , H01L33/52 , H01L33/58 , H01L33/62
摘要： An embodiment relates to a light emitting element package and display device. The light emitting element package according to the embodiment comprises: a substrate; a first light emitting element disposed on the substrate and emitting a red wavelength; a second light emitting element disposed in parallel with the first light emitting element in a first direction and emitting a blue or green wavelength; a third light emitting device disposed in parallel with the first and second light emitting elements in a second direction that is orthogonal to the first direction and emitting a green or blue wavelength; and a molding part covering the first to third light emitting elements, wherein a first upper electrode connected to the first light emitting element, a second upper electrode connected to the second light emitting element, a third upper electrode connected to the third light emitting element, and a fourth upper electrode commonly connected to the first to third light emitting elements are included on the substrate, the first to third light emitting elements are arranged to be misaligned in the first direction, and the centers of the first to third light emitting elements can be arranged within a curvature range having a curvature radius of 250 µ m from the center of the substrate. The light emitting element package according to the embodiment can provide full colors, implement uniform color and uniform brightness, and increase a bonding force between the molding part and the substrate. In the embodiment, a configuration can be simplified and slimness can be implemented.

10. 发明授权

EP2338181B1 SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权转让
标题翻译：发光半导体器件及其制造方法
公开(公告)号：EP2338181B1
公开(公告)日：2014-07-02
申请号：EP09820792.1
申请日：2009-10-16
申请人： LG Innotek Co., Ltd
发明人： JEONG, Hwan Hee
IPC分类号： H01L33/38
CPC分类号： H01L33/38 , H01L33/48 , H01L33/642 , H01L2933/0016

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