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1. 发明公开

EP3910929A1 CAMERA MODULE, AND CAMERA APPARATUS COMPRISING SAME 审中-公开
公开(公告)号：EP3910929A1
公开(公告)日：2021-11-17
申请号：EP20738316.7
申请日：2020-01-08
申请人： LG Innotek Co., Ltd.
发明人： PAIK, Jee Heum , PARK, Duck Hoon
IPC分类号： H04N5/232 , H04N5/225 , H05K1/11 , H05K1/18
摘要： A camera module according to an embodiment includes a first driving part disposed on a lower surface of an image sensor substrate; and a second driving part disposed on a lower surface of the housing to face a lower surface of the first driving part, wherein the first driving part comprises a first driving part of a first group configured to move the image sensor substrate in a first direction with respect to the lens barrel; and a second driving part of a second group configured to move the image sensor substrate in a second direction intersecting the first direction with respect to the lens barrel, wherein the second driving part comprises a second driving part of a first group disposed overlapping the first driving part of the first group in a vertical direction; and a second driving part of a second group disposed overlapping the first driving part of the second group in the vertical direction.

2. 发明公开

EP4339322A2 METALLIC MATERIAL DEPOSITION MASK FOR OLED PIXEL DEPOSITION, AND METHOD FOR PRODUCING SAME 审中-实审
公开(公告)号：EP4339322A2
公开(公告)日：2024-03-20
申请号：EP24155790.9
申请日：2018-08-24
申请人： LG Innotek Co., Ltd.
发明人： PAIK, Jee Heum , KIM, Hae Sik , JO, Yeong Deuk , LEE, Sang Yu , CHO, Su Hyeon , SON, Hyo Won
IPC分类号： C23C14/12
摘要： A metallic material deposition mask for OLED pixel deposition according to an embodiment of the present invention includes a deposition region for forming a deposition pattern and a non-deposition region other than the deposition region. The deposition region includes a plurality of effective portions spaced apart in the longitudinal direction and non-effective portions other than the effective portions. The effective portions include: a plurality of small-area holes formed on one surface; a plurality of large-area holes formed on the reverse surface on the opposite side to the one surface; through-holes through which the small-area holes and large-area holes communicate; and island parts between the plurality of through-holes, wherein the through-holes have a dimeter of no greater than 33 um, the distance between the centers of two neighboring through-holes among the through-holes is no greater than 48 um, which corresponds to a resolution of 500 PPI, the inclination angle of the large-area holes with respect to the reverse surface is 40 degrees to 55 degrees, the average center-line average surface roughness of the non-deposition region in the longitudinal direction and average center-line average surface roughness of the non-deposition region in the widthwise direction are 0.1 um to 0.3 um, the average 10-point average surface roughness (Rz) of the non-deposition region in the longitudinal direction and average 10-point average surface roughness of the non-deposition region in the widthwise direction are 0.5 um to 2.0 um, the deviation of the average center-line average surface roughness value in the longitudinal direction with respect to the average center-line average surface roughness in the widthwise direction is less than 50%, and the deviation of the average 10-point average surface roughness value in the longitudinal direction with respect to the average 10-point average surface roughness in the widthwise direction is less than 50%.

3. 发明公开

EP3940113A1 METAL PLATE, DEPOSITION MASK, AND MANUFACTURING METHOD THEREFOR 审中-公开
公开(公告)号：EP3940113A1
公开(公告)日：2022-01-19
申请号：EP21193813.9
申请日：2018-03-08
申请人： LG INNOTEK CO. LTD
发明人： PAIK, Jee Heum , KIM, Yoon Tai
IPC分类号： C23F1/02 , C23F1/04 , C23F1/28 , C25D5/12 , C25D5/50 , C25D7/06 , C23C14/04 , H01L51/00 , C23C14/14
摘要： A metal plate for use in manufacture of a deposition mask according to an embodiment is a multilayer metal plate having a thickness of 30µm or less and containing an alloy of nickel (Ni) and iron (Fe), and comprises: a first outer portion occupying an area corresponding to 20% or less of the total thickness of the metal plate from one surface thereof; a second outer portion occupying an area corresponding to 20% or less of the total thickness from the other surface opposite to the one surface; and a central portion except the first outer portion and the second outer portion, wherein the first outer portion and the second outer portion each have a larger nickel content than that of the central portion. The multilayer metal plate for use in manufacture of a deposition mask according to an embodiment is a multilayer metal plate containing an alloy of nickel (Ni) and iron (Fe), and is manufactured by a method comprising the steps of: forming a nickel-plated layer; forming an iron-plated layer on the nickel-plated layer; forming a multilayer-plated plate in which the nickel-plated layer and the iron-plated layer are alternately and repeatedly arranged; and heat-treating the multilayer-plated plate at a temperature of 300°C or higher.

4. 发明公开

EP4339322A3 METALLIC MATERIAL DEPOSITION MASK FOR OLED PIXEL DEPOSITION, AND METHOD FOR PRODUCING SAME 审中-实审
公开(公告)号：EP4339322A3
公开(公告)日：2024-06-12
申请号：EP24155790.9
申请日：2018-08-24
申请人： LG Innotek Co., Ltd.
发明人： PAIK, Jee Heum , KIM, Hae Sik , JO, Yeong Deuk , LEE, Sang Yu , CHO, Su Hyeon , SON, Hyo Won
IPC分类号： C23C14/04 , C23C14/12 , H10K59/35 , H10K71/16
CPC分类号： C23C14/042 , C23C14/12 , H10K71/166 , H10K59/35
摘要： A metallic material deposition mask for OLED pixel deposition according to an embodiment of the present invention includes a deposition region for forming a deposition pattern and a non-deposition region other than the deposition region. The deposition region includes a plurality of effective portions spaced apart in the longitudinal direction and non-effective portions other than the effective portions. The effective portions include: a plurality of small-area holes formed on one surface; a plurality of large-area holes formed on the reverse surface on the opposite side to the one surface; through-holes through which the small-area holes and large-area holes communicate; and island parts between the plurality of through-holes, wherein the through-holes have a dimeter of no greater than 33 um, the distance between the centers of two neighboring through-holes among the through-holes is no greater than 48 um, which corresponds to a resolution of 500 PPI, the inclination angle of the large-area holes with respect to the reverse surface is 40 degrees to 55 degrees, the average center-line average surface roughness of the non-deposition region in the longitudinal direction and average center-line average surface roughness of the non-deposition region in the widthwise direction are 0.1 um to 0.3 um, the average 10-point average surface roughness (Rz) of the non-deposition region in the longitudinal direction and average 10-point average surface roughness of the non-deposition region in the widthwise direction are 0.5 um to 2.0 um, the deviation of the average center-line average surface roughness value in the longitudinal direction with respect to the average center-line average surface roughness in the widthwise direction is less than 50%, and the deviation of the average 10-point average surface roughness value in the longitudinal direction with respect to the average 10-point average surface roughness in the widthwise direction is less than 50%.

5. 发明公开

EP4145963A1 CIRCUIT BOARD 审中-实审
公开(公告)号：EP4145963A1
公开(公告)日：2023-03-08
申请号：EP21796075.6
申请日：2021-04-26
申请人： LG Innotek Co., Ltd.
发明人： KIM, Hae Sik , PAIK, Jee Heum
IPC分类号： H05K1/11 , H05K3/24 , H04N5/225 , G03B13/36 , G03B5/00
摘要： A circuit board according to an embodiment includes an insulating layer; and a lead pattern portion disposed on the insulating layer, wherein the lead pattern portion includes: a first portion disposed on the insulating layer; and a second portion extending from one end of the first portion; wherein the first portion is disposed overlapping the insulating layer in a vertical direction, wherein the second portion is disposed in an outer region of the insulating layer and does not overlap the insulating layer; and wherein the lead pattern portion has a centerline average roughness in a range of 0.05 µm to 0.5 µm or a 10-point average roughness in a range of 1.0 µm to 5.0 µm.

6. 发明公开

EP4234759A3 MASK FOR DEPOSITION OF METALLIC MATERIAL FOR DEPOSITING OLED PIXELS AND MANUFACTURING METHOD THEREOF 审中-实审
公开(公告)号：EP4234759A3
公开(公告)日：2023-10-04
申请号：EP23177768.1
申请日：2018-08-24
申请人： LG Innotek Co., Ltd.
发明人： KIM, Hae Sik , PAIK, Jee Heum
IPC分类号： C23F1/02 , C23F1/04 , C23C14/04 , C23C14/12 , H10K71/16
摘要： A metal mask for deposition comprises a deposition region and a non-deposition region. The deposition region includes an effective portion and an ineffective portion. The effective portion includes a plurality of through-holes. Each the through-hole includes a small surface hole on one surface. A large surface hole is disposed on the other surface opposite to the one surface and a communication portion in where an inner surface of the small surface hole meets an inner surface of the large surface hole. An island portion is disposed between the plurality of large surface holes. A height from the communication portion to the one surface is 3 µm or less. The small surface hole has a hole diameter (W1) in the horizontal direction on one surface thereof.

7. 发明公开

EP4044774A1 SUBSTRATE FOR IMAGE SENSOR 审中-实审
公开(公告)号：EP4044774A1
公开(公告)日：2022-08-17
申请号：EP20873457.4
申请日：2020-10-08
申请人： LG Innotek Co., Ltd.
发明人： SON, Young Joon , PAIK, Jee Heum , KIM, Hye Eun
IPC分类号： H05K1/11 , H05K1/14 , G02B7/04 , H04N5/232
摘要： A substrate according to an embodiment includes an insulating layer; a first pattern portion disposed on the insulating layer; and a second pattern portion disposed on the insulating layer and spaced apart from the first pattern portion, wherein the insulating layer includes a first insulating portion including a first open region; and a second insulating portion disposed to surround an outside of the first insulating part and spaced apart from the first insulating portion with a second open region therebetween; wherein the first pattern portion includes a first lead pattern portion disposed on the first insulating portion; a second lead pattern portion disposed on the second insulating portion; and a connection pattern portion having one end connected to the first lead pattern portion and the other end connected to the second lead pattern portion, and disposed on the second open region; wherein the connection pattern portion includes a bent portion positioned on a corner of the second open region.

8. 发明公开

EP3923332A1 SUBSTRATE FOR IMAGE SENSOR 审中-实审
公开(公告)号：EP3923332A1
公开(公告)日：2021-12-15
申请号：EP20752924.9
申请日：2020-02-06
申请人： LG Innotek Co., Ltd.
发明人： PARK, Duck Hoon , PAIK, Jee Heum , SON, Young Joon
IPC分类号： H01L27/146 , H04N5/225
摘要： An image sensor substrate according to an embodiment includes: an insulating layer; and a conductive pattern part disposed on the insulating layer, wherein the insulating layer includes: a first insulating part: and a second insulating part disposed surrounding a periphery of the first insulating part and spaced apart from the first insulating part with a first open region interposed therebetween, and the conductive pattern part includes: a first conductive pattern part disposed on the first insulating part; a second conductive pattern part disposed on the second insulating part; and an extension pattern part disposed on the first open region and interconnecting the first and second conductive pattern parts, wherein the extension pattern part includes a bent portion disposed on a corner region of the first open region.

9. 发明公开

EP3886170A1 SUBSTRATE FOR IMAGE SENSOR 审中-公开
公开(公告)号：EP3886170A1
公开(公告)日：2021-09-29
申请号：EP19886532.1
申请日：2019-11-14
申请人： LG Innotek Co., Ltd.
发明人： PARK, Duck Hoon , PAIK, Jee Heum , SON, Young Joon
IPC分类号： H01L27/146 , H04N5/232 , H04N5/225 , H05K1/18
摘要： A substrate for an image sensor according to an embodiment includes an insulating layer; and a conductive pattern portion disposed on the insulating layer, wherein the insulating layer comprises: a first insulating part; and a second insulating part surrounding the first insulating part and spaced apart from the first insulating part with an open region therebetween, wherein the conductive pattern portion comprises a first lead pattern part disposed on the first insulating part; a second lead pattern part disposed on the second insulating part; and an extension pattern part disposed on the open region of the insulating layer to connect the first lead pattern part with the second lead pattern part and including a bent portion.

10. 发明公开

EP3680949A2 METALLIC MATERIAL DEPOSITION MASK FOR OLED PIXEL DEPOSITION, AND METHOD FOR PRODUCING SAME 有权
公开(公告)号：EP3680949A2
公开(公告)日：2020-07-15
申请号：EP18853058.8
申请日：2018-08-24
申请人： LG Innotek Co., Ltd.
发明人： PAIK, Jee Heum , KIM, Hae Sik , JO, Yeong Deuk , LEE, Sang Yu , CHO, Su Hyeon , SON, Hyo Won
IPC分类号： H01L51/56 , H01L51/00 , H01L21/02 , C23C14/22 , H01L21/66 , H01L27/32 , H01L21/027
摘要： A metallic material deposition mask for OLED pixel deposition according to an embodiment of the present invention includes a deposition region for forming a deposition pattern and a non-deposition region other than the deposition region. The deposition region includes a plurality of effective portions spaced apart in the longitudinal direction and non-effective portions other than the effective portions. The effective portions include: a plurality of small-area holes formed on one surface; a plurality of large-area holes formed on the reverse surface on the opposite side to the one surface; through-holes through which the small-area holes and large-area holes communicate; and island parts between the plurality of through-holes, wherein the through-holes have a dimeter of no greater than 33 um, the distance between the centers of two neighboring through-holes among the through-holes is no greater than 48 um, which corresponds to a resolution of 500 PPI, the inclination angle of the large-area holes with respect to the reverse surface is 40 degrees to 55 degrees, the average center-line average surface roughness of the non-deposition region in the longitudinal direction and average center-line average surface roughness of the non-deposition region in the widthwise direction are 0.1 um to 0.3 um, the average 10-point average surface roughness (Rz) of the non-deposition region in the longitudinal direction and average 10-point average surface roughness of the non-deposition region in the widthwise direction are 0.5 um to 2.0 um, the deviation of the average center-line average surface roughness value in the longitudinal direction with respect to the average center-line average surface roughness in the widthwise direction is less than 50%, and the deviation of the average 10-point average surface roughness value in the longitudinal direction with respect to the average 10-point average surface roughness in the widthwise direction is less than 50%.

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