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1. 发明公开

EP2930501A1 SENSOR 有权
标题翻译：传感器
公开(公告)号：EP2930501A1
公开(公告)日：2015-10-14
申请号：EP15162645.4
申请日：2015-04-07
申请人： Innochips Technology Co., Ltd.
发明人： Park, In Kil , Noh, Tae Hyung , Park, Sung Cheol , Kwon, Ki Beom , Lee, Seung Hwan , Jung, Jun Ho
IPC分类号： G01N27/12
CPC分类号： G01N27/12
摘要： Provided is a sensor including an insulating layer (100), at least two heater patterns (210, 220, 230) separated in one direction in the insulating layer and electrically connected to each other, at least two sensing electrode patterns (310, 320, 330) insulated form the heater patterns, separated in the one direction in the insulating layer, and electrically connected to each other, and a sensing material (400), at least a part of which is buried in the insulating layer to contact the sensing electrode patterns.
摘要翻译：提供了一种传感器，其包括绝缘层（100），至少两个在绝缘层中在一个方向上分离并彼此电连接的加热器图案（210,220,230），至少两个感测电极图案（310,320， 330），绝缘层绝缘形成在绝缘层中沿一个方向分离并彼此电连接的加热器图案，以及感测材料（400），其至少一部分埋在绝缘层中以接触感测电极图案。

2. 发明公开

EP3070722A1 LAMINATED CHIP DEVICE 有权
标题翻译： LAMINIERTE CHIP-VORRICHTUNG
公开(公告)号：EP3070722A1
公开(公告)日：2016-09-21
申请号：EP16160526.6
申请日：2016-03-15
申请人： Innochips Technology Co., Ltd.
发明人： Park, In Kil , Noh, Tae Hyung , Kim, Gyeong Tae , Lee, Myung Ho , Seo, Tae Geun , Lee, Min Soo , Lee, Song Yeon
IPC分类号： H01F17/00 , H01G4/40 , H01G4/232 , H01G4/30
CPC分类号： H03H1/00 , H01F17/0013 , H01F27/2804 , H01F2017/002 , H01F2017/0026 , H01F2027/2809 , H01G4/005 , H01G4/232 , H01G4/30 , H01G4/40 , H03H7/0115 , H03H2001/0085
摘要： Provided is a laminated chip device including a first laminate in which a plurality of conductor patterns formed on a plurality of sheets are connected to each other through a via formed to penetrate at least a sheet, and a second laminate provided over or below the first laminate and having a plurality of internal electrode patterns formed on a plurality of sheets, and the internal electrode patterns have a non-conductive region in at least a portion of an area corresponding to the via.
摘要翻译：提供了一种层叠芯片装置，其包括：第一层压体，其中形成在多个片材上的多个导体图案通过形成为穿透至少一个片材的通孔彼此连接;以及第二层压体，设置在第一层压体上或下方并且具有形成在多个片材上的多个内部电极图案，并且内部电极图案在与通孔对应的区域的至少一部分中具有非导电区域。

3. 发明公开

EP2963679A3 HEAT RADIATION SHEET 有权
标题翻译：热辐射膜
公开(公告)号：EP2963679A3
公开(公告)日：2016-02-10
申请号：EP15175256.5
申请日：2015-07-03
申请人： Innochips Technology Co., Ltd.
发明人： Noh, Tae Hyung , Park, In Kil , Kim, Dae Kyum
IPC分类号： H01L23/373 , B32B15/00 , C09J7/00 , G06F1/20 , H01L23/42
CPC分类号： H05K7/2039 , B32B7/12 , B32B15/046 , B32B2307/302 , C09J7/26 , C09J7/35 , F28F13/18 , G06F1/20 , H01L23/373 , H01L23/3733 , H01L23/3735 , H01L23/3737 , H01L23/42 , H01L2924/0002 , H01L2924/00
摘要： Provided is a heat-radiating sheet including a heat-radiating layer having a porous structure with multiple pores, a filler including multiple thermally conductive particles and filling the pores inside the heat-radiating layer, and an adhesive layer disposed on at least one surface of the heat-radiating layer.

4. 发明公开

EP2963679A2 HEAT RADIATION SHEET 有权
标题翻译：热辐射片
公开(公告)号：EP2963679A2
公开(公告)日：2016-01-06
申请号：EP15175256.5
申请日：2015-07-03
申请人： Innochips Technology Co., Ltd.
发明人： Noh, Tae Hyung , Park, In Kil , Kim, Dae Kyum
IPC分类号： H01L23/373 , B32B15/00 , C09J7/00 , G06F1/20 , H01L23/42
CPC分类号： H05K7/2039 , B32B7/12 , B32B15/046 , B32B2307/302 , C09J7/26 , C09J7/35 , F28F13/18 , G06F1/20 , H01L23/373 , H01L23/3733 , H01L23/3735 , H01L23/3737 , H01L23/42 , H01L2924/0002 , H01L2924/00
摘要： Provided is a heat-radiating sheet including a heat-radiating layer having a porous structure with multiple pores, a filler including multiple thermally conductive particles and filling the pores inside the heat-radiating layer, and an adhesive layer disposed on at least one surface of the heat-radiating layer.
摘要翻译：本发明提供一种散热片，该散热片包括具有多孔的多孔结构的散热层，包含多个导热颗粒并填充散热层内部的孔的填充物，以及设置在散热层的至少一个表面上的粘合剂层散热层。

5. 发明公开

EP2903158A2 Stacked chip device 有权
标题翻译： Chipstapelvorrichtung
公开(公告)号：EP2903158A2
公开(公告)日：2015-08-05
申请号：EP15152490.7
申请日：2015-01-26
申请人： Innochips Technology Co., Ltd.
发明人： Park, In Kil , Noh, Tae Hyung , Kim, Gyeong Tae , Seo, Tae Geun , Lee, Myung Ho , Lee, Min Soo
IPC分类号： H03H7/01 , H03H1/00
CPC分类号： H03H7/0115 , H03H2001/0085
摘要： The present disclosure relates to a stacked chip device (11) including a first stack unit (B) comprising a plurality of electrode patterns (111, 112) respectively disposed for a unit device region and common electrode patterns (121) formed to be connected to overlap the unit device regions, a second stack unit (A) disposed on a top portion of the first stack unit (B) and comprising a plurality of first conductor patterns (211-216), and a third stack unit (C) disposed on a bottom portion of the first stack unit (B) and comprising a plurality of second conductor patterns (311-316), wherein the first and second conductor patterns (211-216; 311-316) are formed on a plurality of sheets (201-206; 301-306), the first and second conductor patterns formed on one sheet are formed across a plurality of unit device regions, and the first and second conductor patterns (211-216; 311-316) are connected vertically through vias (511, 512, 521, 522) formed penetrating through at least some of the sheets.
摘要翻译：本公开涉及一种堆叠式芯片装置（11），包括：第一堆叠单元（B），包括分别设置用于单位装置区域的多个电极图案（111,112）和形成为连接到与所述单元设备区域重叠;第二堆叠单元（A），设置在所述第一堆叠单元（B）的顶部并且包括多个第一导体图案（211-216）;以及第三堆叠单元（C）第一堆叠单元（B）的底部并且包括多个第二导体图案（311-316），其中第一和第二导体图案（211-216; 311-316）形成在多个片材（201 -206; 301-306），形成在一个片材上的第一和第二导体图案横跨多个单元器件区域形成，并且第一和第二导体图案（211-216; 311-316）通过通孔垂直连接 511,512,521,522）穿透至少一些片材。

6. 发明公开

EP2869597A3 Sound amplification box and sound amplification device including the same 审中-公开
标题翻译：声音放大盒和包括它的声音放大装置
公开(公告)号：EP2869597A3
公开(公告)日：2015-07-01
申请号：EP14191358.2
申请日：2014-10-31
申请人： Innochips Technology Co., Ltd.
发明人： Park, In Kil , Noh, Tae Hyung , Park, Sung Cheol , Kim, Young Sul , Choi, Soon Dong , Jung, In Seob , Park, Wan
IPC分类号： A45C11/00 , H04R17/00 , H04B1/38 , G10K11/04
CPC分类号： G10K11/04 , A45C11/00 , H04M1/035 , H04M1/04 , H04M1/185 , H04M1/6016 , H04R1/2811 , H04R17/00 , H04R2201/029 , H04R2205/021 , H04R2217/00 , H04R2499/11
摘要： Provided are a sound amplification box and a sound amplification device. The sound amplification box includes a body including a predetermined resonance space therein and having a surface contacting an electronic device, a resonance hole formed in at least one surface of the body, and a vibration transmission part in a predetermined region of the surface contacting the electronic device.
摘要翻译：提供了一种扩音盒和扩音装置。所述扩音盒包括其中具有预定共振空间并且具有接触电子装置的表面的主体，形成在所述主体的至少一个表面中的共振孔，以及在接触所述电子装置的所述表面的预定区域中的振动传递部分设备。

7. 发明授权

EP3070722B1 LAMINATED CHIP DEVICE 有权
公开(公告)号：EP3070722B1
公开(公告)日：2018-06-20
申请号：EP16160526.6
申请日：2016-03-15
申请人： Innochips Technology Co., Ltd.
发明人： Park, In Kil , Noh, Tae Hyung , Kim, Gyeong Tae , Lee, Myung Ho , Seo, Tae Geun , Lee, Min Soo , Lee, Song Yeon
IPC分类号： H01F17/00 , H01F27/28 , H01G4/232 , H01G4/30 , H03H1/00 , H03H7/01 , H01G4/00 , H01G4/40 , H01G4/005
CPC分类号： H03H1/00 , H01F17/0013 , H01F27/2804 , H01F2017/002 , H01F2017/0026 , H01F2027/2809 , H01G4/005 , H01G4/232 , H01G4/30 , H01G4/40 , H03H7/0115 , H03H2001/0085
摘要： Provided is a laminated chip device including a first laminate in which a plurality of conductor patterns formed on a plurality of sheets are connected to each other through a via formed to penetrate at least a sheet, and a second laminate provided over or below the first laminate and having a plurality of internal electrode patterns formed on a plurality of sheets, and the internal electrode patterns have a non-conductive region in at least a portion of an area corresponding to the via.

8. 发明公开

EP2903158A3 Stacked chip device 有权
标题翻译：堆叠芯片设备
公开(公告)号：EP2903158A3
公开(公告)日：2015-11-18
申请号：EP15152490.7
申请日：2015-01-26
申请人： Innochips Technology Co., Ltd.
发明人： Park, In Kil , Noh, Tae Hyung , Kim, Gyeong Tae , Seo, Tae Geun , Lee, Myung Ho , Lee, Min Soo
IPC分类号： H03H7/01 , H03H1/00
CPC分类号： H03H7/0115 , H03H2001/0085
摘要： The present disclosure relates to a stacked chip device (11) including a first stack unit (B) comprising a plurality of electrode patterns (111, 112) respectively disposed for a unit device region and common electrode patterns (121) formed to be connected to overlap the unit device regions, a second stack unit (A) disposed on a top portion of the first stack unit (B) and comprising a plurality of first conductor patterns (211-216), and a third stack unit (C) disposed on a bottom portion of the first stack unit (B) and comprising a plurality of second conductor patterns (311-316), wherein the first and second conductor patterns (211-216; 311-316) are formed on a plurality of sheets (201-206; 301-306), the first and second conductor patterns formed on one sheet are formed across a plurality of unit device regions, and the first and second conductor patterns (211-216; 311-316) are connected vertically through vias (511, 512, 521, 522) formed penetrating through at least some of the sheets.
摘要翻译：本发明涉及一种堆叠芯片器件（11），其包括：第一堆叠单元（B），其包括分别设置用于单元器件区域的多个电极图案（111,112）;以及公共电极图案（121），其形成为连接到（B）的顶部上并且包括多个第一导体图案（211-216）的第二堆叠单元（A）以及设置在第一堆叠单元（B）上的第三堆叠单元（C）（B）的底部并且包括多个第二导体图案（311-316），其中第一和第二导体图案（211-216; 311-316）形成在多个片材（201 -206,301-306），形成在一个薄片上的第一和第二导体图案横跨多个单元器件区域形成，并且第一和第二导体图案（211-216; 311-316）通过通孔垂直连接（穿过至少一些片材形成。

9. 发明公开

EP2930500A1 LAYERED SENSOR ARRAY DEVICE 审中-公开
标题翻译： SCHICHTSENSORARRAYVORRICHTUNG
公开(公告)号：EP2930500A1
公开(公告)日：2015-10-14
申请号：EP15162644.7
申请日：2015-04-07
申请人： Innochips Technology Co., Ltd.
发明人： Park, In Kil , Noh, Tae Hyung , Park, Sung Cheol , Kwon, Ki Beom , Lee, Seung Hwan , Jung, Jun Ho
IPC分类号： G01N27/12 , G01N33/00
CPC分类号： G01N33/0031 , G01N27/123
摘要： Disclosed is a sensor device including a plurality of substrates (110, 120, 130, 140) vertically stacked, a plurality of heaters (210, 220, 230, 240) formed on at least one selected substrate and separated from each other in a horizontal direction, a plurality of sensing electrodes (310, 320, 330, 340) formed at least one selected substrate on a top portion of the substrate on which the plurality of heaters are formed and separated in the horizontal direction, and a plurality of materials (410, 420, 430, 440) configured to respectively contact the plurality of sensing electrodes and formed separately from each other.
摘要翻译：公开了一种传感器装置，其包括垂直堆叠的多个基板（110,120,130,140），形成在至少一个选定基板上的多个加热器（210,220,230,240），并在水平方向上彼此分离多个感测电极（310,320,330,340），其形成在其上形成有多个加热器的水平方向上分离的基板的顶部上的至少一个选择的基板，以及多个材料（，其被配置为分别接触所述多个感测电极并且彼此分开形成。

10. 发明公开

EP2869596A1 Complex device and electronic device having the same 有权
标题翻译： Komplexe Vorrichtung und elektronische Vorrichtung damit
公开(公告)号：EP2869596A1
公开(公告)日：2015-05-06
申请号：EP14191357.4
申请日：2014-10-31
申请人： Innochips Technology Co., Ltd.
发明人： Park, In Kil , Noh, Tae Hyung , Park, Sung Cheol , Kim, Young Sul , Choi, Soon Dong , Jung, In Seob , Park, Wan , Shin, Hee Seob
IPC分类号： H04R17/00 , H04B1/38 , H04M1/02 , H02J7/00
CPC分类号： H04W4/80 , B06B1/06 , H02J7/00 , H02J7/025 , H02J50/10 , H02J50/70 , H04M1/026 , H04M1/185 , H04M1/72575 , H04M2250/04 , H04R2217/00
摘要： Provided are a complex device including a piezoelectric device, a wire patch cell (WPC) antenna disposed on one surface of the piezoelectric device, the WPC antenna being connected to two antenna patterns that are vertically spaced apart from each other, and a near field communication (NFC) antenna disposed outside the WPC antenna and an electronic device having the same.
摘要翻译：提供了一种复合器件，包括压电器件，设置在压电器件的一个表面上的有线贴片电池（WPC）天线，WPC天线连接到彼此垂直间隔开的两个天线图案，以及近场通信（NFC）天线以及具有该天线的电子设备。

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