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1. 发明公开

EP4236641A1 PLUGGABLE DEVICE, INFORMATION COMMUNICATION DEVICE, HEAT DISSIPATION SYSTEM, AND MANUFACTURING METHOD 审中-实审
公开(公告)号：EP4236641A1
公开(公告)日：2023-08-30
申请号：EP21890637.8
申请日：2021-06-29
申请人： Huawei Technologies Co., Ltd.
发明人： LI, Cheng , WANG, Lianqiang , YANG, Yong , HE, Yongtao , ZHANG, Zhengtao
IPC分类号： H05K7/20
摘要： This application discloses a pluggable device, an information communication device, a heat dissipation system, and a manufacturing method, and belongs to the field of heat dissipation technologies. The pluggable device includes a housing, a circuit board, a heat emitting element, and a liquid cooling part. The circuit board, the heat emitting element, and the liquid cooling part are sequentially stacked in the housing, and two pipe joints of the liquid cooling part are both fastened to a housing wall of the housing. The two pipe joints of the liquid cooling part are configured to be respectively connected to a liquid discharge pipe joint and a liquid inlet pipe joint of a liquid cooling heat dissipation part. According to this application, liquid for cooling can flow between the liquid cooling part and the liquid cooling heat dissipation part, to absorb a temperature of the liquid cooling part and cool the liquid cooling part, so as to increase a temperature difference between the liquid cooling part and the heat emitting element, and enable the liquid cooling part to quickly absorb heat generated by the heat emitting element. This improves effect of heat dissipation for the pluggable device.

2. 发明公开

EP3364711A1 METHOD OF PERFORMING PROCESS FOR VOICE SERVICE TERMINAL, AND DEVICE UTILIZING SAME, AND COMMUNICATION SYSTEM 审中-公开
公开(公告)号：EP3364711A1
公开(公告)日：2018-08-22
申请号：EP15908072.0
申请日：2015-11-12
申请人： Huawei Technologies Co., Ltd.
发明人： WANG, Zhendong , YANG, Yong , ZENG, Meiyan
IPC分类号： H04W76/34 , H04W36/06
CPC分类号： H04M7/006 , H04L5/14 , H04W36/06 , H04W76/27 , H04W76/30 , H04W76/34 , H04W88/02
摘要： Embodiments of this application provide a method and an apparatus for processing a terminal that is performing a voice service, and a communications system. In the method, a RAN device actively redirects a voice service terminal, releases an RRC connection of the terminal, and instructs a CN device to retain a GBR bearer of the voice service terminal in a release process. Because a bearer type of a VOIP service is a GBR bearer, a bearer of the VOIP service is not released. When the terminal accesses a network again, the CN device may directly use the GBR bearer to restore the voice service, so as to avoid voice service interruption caused by releasing the bearer of the VOIP service in a redirection process, reduce a call drop rate, and improve user experience.

3. 发明公开

EP4163963A1 HEAT CONDUCTION MEMBER, SINGLE BOARD, COMPUTING DEVICE AND MANUFACTURING METHOD 审中-实审
公开(公告)号：EP4163963A1
公开(公告)日：2023-04-12
申请号：EP21834681.5
申请日：2021-06-30
申请人： Huawei Technologies Co., Ltd.
发明人： LIU, Xiaorui , CHU, Sheng , DENG, Chaojun , YANG, Yong , TANG, Xiaoyu , WANG, Bo , WANG, Cong
IPC分类号： H01L23/373
摘要： Embodiments of this application disclose a heat conduction component, a board, a computing device, and a manufacturing method, and belong to the field of chip technologies. The heat conduction component includes a first heat conduction layer and second heat conduction layers. A melting point of the first heat conduction layer is greater than a first value, a melting point of the second heat conduction layer is less than a second value, there is the second heat conduction layer on each of a first surface and a second surface of the first heat conduction layer, and the first surface and the second surface are opposite to each other. According to the solutions in embodiments of this application, melted liquid of a second heat conduction layer that is tightly attached to a heat source component may fill a gap between the heat conduction component and the heat source component, and melted liquid of a second heat conduction layer that is tightly attached to a heat sink may fill a gap between the heat conduction component and the heat sink, so that tight attachment between the heat conduction component and the heat source component and tight attachment between the heat conduction component and the heat sink can be improved, thereby accelerating heat transfer between the heat source component and the heat sink, and enhancing heat dissipation for the heat source component.

4. 发明公开

EP4007167A3 CLOCK OSCILLATOR AND CLOCK OSCILLATOR PRODUCTION METHOD USING A SHOCK-ABSORBING MATERIAL LAYER 审中-公开
公开(公告)号：EP4007167A3
公开(公告)日：2022-10-12
申请号：EP21207461.1
申请日：2021-11-10
申请人： Huawei Technologies Co., Ltd.
发明人： WU, Wei , WANG, Jinhui , LI, Hao , YANG, Yong , HUANG, Xinhua
IPC分类号： H03H9/05 , H03H9/09 , H03B5/32 , H03H9/02 , H03H9/10 , H03H9/54
摘要： A clock oscillator, a clock oscillator production method and use method, and a chip including the clock oscillator are provided. The clock oscillator includes a resonator, a shock-absorbing material layer, and a base, and at least a part of the shock-absorbing material layer is located between the resonator and the base. In the clock oscillator, the shock-absorbing material layer is added between the resonator and the base, and the shock-absorbing material layer can effectively prevent a mechanical wave from being conducted between the base and the resonator, so that the resonator is protected from external vibration. This can ensure, when there is external vibration, that an output frequency of the resonator is not deteriorated and improve shock absorption performance of the clock oscillator.

5. 发明公开

EP4027384A3 CHIP PACKAGE STRUCTURE, PREPARATION METHOD, AND ELECTRONIC DEVICE 审中-公开
公开(公告)号：EP4027384A3
公开(公告)日：2022-08-10
申请号：EP22150307.1
申请日：2022-01-05
申请人： HUAWEI TECHNOLOGIES CO., LTD.
发明人： DENG, Chaojun , WEI, Xiaoyun , YANG, Yong
IPC分类号： H01L23/13 , H01L25/065 , H01L21/98 , H01L23/485 , H01L21/60
摘要： This application discloses a chip package structure, a preparation method, and an electronic device, and pertains to the field of chip package technologies. The chip package structure includes a glass substrate, a routing layer, and at least one die; a first surface of the glass substrate has solder joints, a second surface of the glass substrate has substrate solder balls, the routing layer is located in the glass substrate, and the solder joints are electrically connected to the substrate solder balls by using the routing layer; and each die has chip solder balls, the at least one die is located on the first surface of the glass substrate, and the solder joints are bonded to the chip solder balls. This application can improve connection reliability between the die and the glass substrate, and can reduce a signal transmission loss.

6. 发明公开

EP3979312A2 CHIP AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE 审中-公开
公开(公告)号：EP3979312A2
公开(公告)日：2022-04-06
申请号：EP21194487.1
申请日：2021-09-02
申请人： Huawei Technologies Co., Ltd.
发明人： DENG, Chaojun , WEI, Xiaoyun , YANG, Yong , XU, Jiye , FU, Xing
IPC分类号： H01L23/367 , H01L23/373
摘要： Embodiments of this application provide a chip and a manufacturing method thereof, and an electronic device, and belong to the field of chip heat dissipation technologies. The chip includes a die and a thermal conductive sheet. An active surface of the die is connected to the thermal conductive sheet by using a first bonding layer. Heat generated at a part with a relatively high temperature on the active surface of the die can be quickly conducted and dispersed by using the thermal conductive sheet, so that temperatures on the active surface are evenly distributed to avoid an excessively high local temperature of the chip, thereby preventing running of the chip from being affected.

7. 发明公开

EP3873099A1 VR VIDEO PLAYING CONTROL METHOD AND RELATED APPARATUS 审中-公开
公开(公告)号：EP3873099A1
公开(公告)日：2021-09-01
申请号：EP19892508.3
申请日：2019-11-28
申请人： HUAWEI TECHNOLOGIES CO., LTD.
发明人： KUAI, Duoci , PENG, Bingjie , HE, Wei , WU, Liang , YANG, Yong
IPC分类号： H04N21/25
摘要： Embodiments of the present invention disclose a method for controlling VR video playing and related apparatus. In this method, a video server device renders a jump icon in a video image. When a user wants to perform video jump based on video content, a jump icon corresponding to a scene in which the user is interested may be selected to form an input. The video server obtains, based on the input of the user, a jump time of a jump target video corresponding to the jump icon, and plays the jump target video for the user from the jump time. The jump target video may be a video that is being played, or may be another video. In addition, the embodiments of the present invention further disclose that a terminal device performs the foregoing method for controlling VR video playing. In the method, a video can be switched based on preferences of the user. The method provides personalized services for the user, forms watching interaction with the user, and improves user experience of the VR video.

8. 发明公开

EP4184573A1 MULTICHIP STACKED PACKAGE, ELECTRONIC DEVICE, AND MANUFACTURING METHOD 审中-实审
公开(公告)号：EP4184573A1
公开(公告)日：2023-05-24
申请号：EP20948470.8
申请日：2020-08-04
申请人： Huawei Technologies Co., Ltd.
发明人： ZHANG, Liping , WANG, Junyou , ZHANG, Yanping , CUI, Xiaojuan , WEI, Xiaoyun , YANG, Yong , DENG, Chaojun
IPC分类号： H01L23/538 , H01L21/00
摘要： Embodiments of this application provide a multi-chip stacked package, a preparation method for a diamond layer having a first conductive channel, a preparation method for a multi-chip stacked package, and an electronic device, and relate to the field of chip package technologies. The multi-chip stacked package includes: a first chip, a second chip, and a diamond layer, where the first chip, the diamond layer, and the second chip are sequentially arranged in a stacked manner; a first conductive channel is provided in the diamond layer, and the first conductive channel runs through the diamond layer along a stacked direction of the first chip, the diamond layer, and the second chip and electrically connects the first chip and the second chip.

9. 发明公开

EP4027384A2 CHIP PACKAGE STRUCTURE, PREPARATION METHOD, AND ELECTRONIC DEVICE 审中-公开
公开(公告)号：EP4027384A2
公开(公告)日：2022-07-13
申请号：EP22150307.1
申请日：2022-01-05
申请人： HUAWEI TECHNOLOGIES CO., LTD.
发明人： DENG, Chaojun , WEI, Xiaoyun , YANG, Yong
IPC分类号： H01L25/065 , H01L21/98 , H01L23/485 , H01L21/60
摘要： This application discloses a chip package structure, a preparation method, and an electronic device, and pertains to the field of chip package technologies. The chip package structure includes a glass substrate, a routing layer, and at least one die; a first surface of the glass substrate has solder joints, a second surface of the glass substrate has substrate solder balls, the routing layer is located in the glass substrate, and the solder joints are electrically connected to the substrate solder balls by using the routing layer; and each die has chip solder balls, the at least one die is located on the first surface of the glass substrate, and the solder joints are bonded to the chip solder balls. This application can improve connection reliability between the die and the glass substrate, and can reduce a signal transmission loss.

10. 发明公开

EP3952425A1 COMMUNICATION METHOD AND COMMUNICATION DEVICE 有权
公开(公告)号：EP3952425A1
公开(公告)日：2022-02-09
申请号：EP20797978.2
申请日：2020-04-30
申请人： Huawei Technologies Co., Ltd.
发明人： YANG, Yong , SUN, Mingyang
IPC分类号： H04W28/02 , H04B15/00
摘要： Embodiments of this application disclose a communication method and apparatus. The method includes: After determining that a first base station is affected by atmospheric duct interference from a second base station, the first base station sends first information to the second base station through a core network, to notify the first base station that the first base station causes atmospheric duct interference to the second base station. After determining that the first base station is affected by the atmospheric duct interference from the second base station, the first base station notifies the second base station in a wired link manner, and specifically, may send the first information to the second base station through the core network. In this way, receiving of the first information by the second base station is not easily affected by a natural environment, so that a success rate of receiving, by the second base station, a message sent by the first base station can be improved. Therefore, the second base station can perform corresponding interference avoidance in time, thereby improving a success rate of eliminating the atmospheric duct interference.

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