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1. 发明公开

EP3457719A1 ULTRASONIC WAVE-BASED VOICE SIGNAL TRANSMISSION SYSTEM AND METHOD 有权
公开(公告)号：EP3457719A1
公开(公告)日：2019-03-20
申请号：EP16903578.9
申请日：2016-06-03
申请人： Huawei Technologies Co., Ltd.
发明人： DENG, Chaojun , FANG, Liming
IPC分类号： H04S7/00
摘要： Embodiments of the present invention disclose an ultrasonic wave-based voice signal transmission system. The apparatus includes an ultrasonic modulator, a beamforming controller, an ultrasonic transducer array, and a user detector. The ultrasonic modulator is configured to modulate a voice signal onto an ultrasonic band and output the modulated voice signal to the beamforming controller. The user detector is configured to detect a user and output a detection result of the user to the beamforming controller. The beamforming controller is configured to control, according to the detection result output by the user detector 102, a phase and an amplitude of the modulated voice signal, to obtain an electrical signal that points to the user, and output, to the ultrasonic transducer array, the electrical signal that points to the user. The ultrasonic transducer is configured to convert the electrical signal that points to the user and that is output by the beamforming controller into an ultrasonic signal with a beam pointing to the user, and transmit the ultrasonic signal. According to the foregoing solution, call convenience can be improved for the user.

2. 发明授权

EP1940086B1 METHOD, ETHERNET DEVICE AND ETHERNET FOR SOLVING THE CLOCK SYNCHRONIZATION 有权
标题翻译：方法，以太网设备和以太网解决时钟同步
公开(公告)号：EP1940086B1
公开(公告)日：2013-01-30
申请号：EP06775609.8
申请日：2006-09-06
申请人： Huawei Technologies Co., Ltd.
发明人： DENG, Chaojun , YE, Jinhua
IPC分类号： H04J3/06
CPC分类号： H04J3/0697

3. 发明公开

EP4206768A1 OPTICAL CAGE ASSEMBLY, OPTICAL MODULE CONNECTOR, AND FABRICATION METHOD FOR OPTICAL CAGE ASSEMBLY 审中-实审
公开(公告)号：EP4206768A1
公开(公告)日：2023-07-05
申请号：EP21913590.2
申请日：2021-11-19
申请人： Huawei Technologies Co., Ltd.
发明人： LIU, Xiaorui , DENG, Chaojun , LI, Chunrong , TANG, Xiaoyu
IPC分类号： G02B6/42
摘要： This application relates to the field of optical module heat dissipation technologies, and discloses an optical cage assembly, an optical module connector, and a method for manufacturing an optical cage assembly. The optical cage assembly includes a box-like housing (1), a radiator (2), and a cover-like fastener (3). The box-like housing (1) has a slot (11). A first housing wall (12) of the box-like housing (1) has an opening (121) at a position close to a slot opening of the slot (11). The radiator (2) is located at the opening (121) and can be bonded to an electrical connector (41) plugged into the slot (11). The cover-like fastener (3) is fastened to housing walls of the box-like housing (1), and the cover-like fastener (3) has a memory alloy member, where the memory alloy member is located on a surface that is of the radiator (2) and that is away from the opening (121). In this application, easy plugging and unplugging of an optical module in the slot (11) can be implemented, heat transfer between the radiator (2) and the optical module can be accelerated, and an effect of heat dissipation for the optical module can be enhanced.

4. 发明公开

EP4163963A1 HEAT CONDUCTION MEMBER, SINGLE BOARD, COMPUTING DEVICE AND MANUFACTURING METHOD 审中-实审
公开(公告)号：EP4163963A1
公开(公告)日：2023-04-12
申请号：EP21834681.5
申请日：2021-06-30
申请人： Huawei Technologies Co., Ltd.
发明人： LIU, Xiaorui , CHU, Sheng , DENG, Chaojun , YANG, Yong , TANG, Xiaoyu , WANG, Bo , WANG, Cong
IPC分类号： H01L23/373
摘要： Embodiments of this application disclose a heat conduction component, a board, a computing device, and a manufacturing method, and belong to the field of chip technologies. The heat conduction component includes a first heat conduction layer and second heat conduction layers. A melting point of the first heat conduction layer is greater than a first value, a melting point of the second heat conduction layer is less than a second value, there is the second heat conduction layer on each of a first surface and a second surface of the first heat conduction layer, and the first surface and the second surface are opposite to each other. According to the solutions in embodiments of this application, melted liquid of a second heat conduction layer that is tightly attached to a heat source component may fill a gap between the heat conduction component and the heat source component, and melted liquid of a second heat conduction layer that is tightly attached to a heat sink may fill a gap between the heat conduction component and the heat sink, so that tight attachment between the heat conduction component and the heat source component and tight attachment between the heat conduction component and the heat sink can be improved, thereby accelerating heat transfer between the heat source component and the heat sink, and enhancing heat dissipation for the heat source component.

5. 发明公开

EP4027384A3 CHIP PACKAGE STRUCTURE, PREPARATION METHOD, AND ELECTRONIC DEVICE 审中-公开
公开(公告)号：EP4027384A3
公开(公告)日：2022-08-10
申请号：EP22150307.1
申请日：2022-01-05
申请人： HUAWEI TECHNOLOGIES CO., LTD.
发明人： DENG, Chaojun , WEI, Xiaoyun , YANG, Yong
IPC分类号： H01L23/13 , H01L25/065 , H01L21/98 , H01L23/485 , H01L21/60
摘要： This application discloses a chip package structure, a preparation method, and an electronic device, and pertains to the field of chip package technologies. The chip package structure includes a glass substrate, a routing layer, and at least one die; a first surface of the glass substrate has solder joints, a second surface of the glass substrate has substrate solder balls, the routing layer is located in the glass substrate, and the solder joints are electrically connected to the substrate solder balls by using the routing layer; and each die has chip solder balls, the at least one die is located on the first surface of the glass substrate, and the solder joints are bonded to the chip solder balls. This application can improve connection reliability between the die and the glass substrate, and can reduce a signal transmission loss.

6. 发明公开

EP3979312A2 CHIP AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE 审中-公开
公开(公告)号：EP3979312A2
公开(公告)日：2022-04-06
申请号：EP21194487.1
申请日：2021-09-02
申请人： Huawei Technologies Co., Ltd.
发明人： DENG, Chaojun , WEI, Xiaoyun , YANG, Yong , XU, Jiye , FU, Xing
IPC分类号： H01L23/367 , H01L23/373
摘要： Embodiments of this application provide a chip and a manufacturing method thereof, and an electronic device, and belong to the field of chip heat dissipation technologies. The chip includes a die and a thermal conductive sheet. An active surface of the die is connected to the thermal conductive sheet by using a first bonding layer. Heat generated at a part with a relatively high temperature on the active surface of the die can be quickly conducted and dispersed by using the thermal conductive sheet, so that temperatures on the active surface are evenly distributed to avoid an excessively high local temperature of the chip, thereby preventing running of the chip from being affected.

7. 发明公开

EP4296714A1 OPTICAL PHASED BOARD, MANUFACTURING METHOD, AND OPTICAL PHASED ARRAY SYSTEM 审中-实审
公开(公告)号：EP4296714A1
公开(公告)日：2023-12-27
申请号：EP22810303.2
申请日：2022-04-28
申请人： Huawei Technologies Co., Ltd.
发明人： DENG, Chaojun , WEI, Xiaoyun , YANG, Yong , ZANG, Dajun
IPC分类号： G01S7/481 , G02F1/295 , G02B6/13
摘要： An optical phased board, a manufacturing method, and an optical phased array system are disclosed, and pertain to the field of beam scanning technologies. The optical phased board includes a plurality of optical waveguide layers (1) and a plurality of isolation layers (2). Each optical waveguide layer (1) includes a plurality of optical waveguides (11), and the plurality of optical waveguides (11) are arranged side by side; and the plurality of optical waveguide layers (1) and the plurality of isolation layers (2) are arranged in a superimposed manner, and each isolation layer (2) is located between two adjacent optical waveguide layers (1). The optical phased board includes a two-dimensional optical waveguide array, and therefore can perform two-dimensional beam scanning. In addition, in comparison with performing two-dimensional beam scanning by using a two-dimensional optical antenna array, resolution and a scanning angle of the beam scanning can be improved.

8. 发明公开

EP3979312A3 CHIP AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE 审中-公开
公开(公告)号：EP3979312A3
公开(公告)日：2022-04-13
申请号：EP21194487.1
申请日：2021-09-02
申请人： Huawei Technologies Co., Ltd.
发明人： DENG, Chaojun , WEI, Xiaoyun , YANG, Yong , XU, Jiye , FU, Xing
IPC分类号： H01L23/367 , H01L23/373
摘要： Embodiments of this application provide a chip and a manufacturing method thereof, and an electronic device, and belong to the field of chip heat dissipation technologies. The chip includes a die and a thermal conductive sheet. An active surface of the die is connected to the thermal conductive sheet by using a first bonding layer. Heat generated at a part with a relatively high temperature on the active surface of the die can be quickly conducted and dispersed by using the thermal conductive sheet, so that temperatures on the active surface are evenly distributed to avoid an excessively high local temperature of the chip, thereby preventing running of the chip from being affected.

9. 发明公开

EP3979318A1 VERTICAL INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF, PACKAGED CHIP, AND CHIP PACKAGING METHOD 审中-公开
公开(公告)号：EP3979318A1
公开(公告)日：2022-04-06
申请号：EP21195825.1
申请日：2021-09-09
申请人： HUAWEI TECHNOLOGIES CO., LTD.
发明人： WEI, Xiaoyun , YANG, Yong , DENG, Chaojun
IPC分类号： H01L23/538 , H01L21/48 , H01L23/14 , H01L23/15 , H01L23/498
摘要： Embodiments of this application provide a vertical interconnection structure and a manufacturing method thereof, a packaged chip, and a chip packaging method. The method includes: first forming conductive pillars on a first surface of a substrate, and then forming a first insulated support layer on the first surface, where the conductive pillars are located in the first insulated support layer, and an upper surface that is of the conductive pillar and that is away from the substrate is not covered by the first insulated support layer; and finally removing the substrate. The conductive pillars are first formed on the substrate, and then the first insulated support layer wrapping the conductive pillars is formed.

10. 发明授权

EP3457719B1 ULTRASONIC WAVE-BASED VOICE SIGNAL TRANSMISSION SYSTEM AND METHOD 有权
公开(公告)号：EP3457719B1
公开(公告)日：2020-11-25
申请号：EP16903578.9
申请日：2016-06-03
申请人： Huawei Technologies Co., Ltd.
发明人： DENG, Chaojun , FANG, Liming
IPC分类号： H04S7/00 , H04R1/40

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