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    • 5. 发明公开
    • URETHANE ADHESIVE FOR OUTDOOR USE
    • URETHANKLEBSTOFFFÜRDEN AUSSENBEREICH
    • EP2647684A1
    • 2013-10-09
    • EP11845169.9
    • 2011-11-28
    • Henkel Japan Ltd.Henkel AG & Co. KGaA
    • MATSUKI, YuichiYOSHIDA, YoshioHAYAKAWA, Tadashi
    • C09J175/06C09J11/06H01L31/042
    • H01L31/0487C08G18/3851C09J175/04H01L31/049Y02E10/50
    • Provided are a urethane adhesive for outdoor use which has high peel strength and excellent weatherability, a solar-cell back sheet obtained using the adhesive, and a solar-cell module obtained using the solar-cell back sheet. The urethane adhesive for outdoor use comprises (A) a urethane resin obtained by reacting one or more isocyanate compounds (a1) with a polyol (a2) having an ester bond and (B) a hydroxyphenyltriazine compound, the isocyanate compounds (a1) comprising at least one compound selected from aliphatic isocyanates and alicyclic isocyanates. The adhesive has high peel strength and excellent weatherability. The urethane resin for outdoor use which further contains a silane compound is more preferable.
    • 本发明提供一种具有高剥离强度和优异的耐候性的户外用聚氨酯粘合剂,使用该粘合剂得到的太阳能电池背板,以及使用太阳能电池背板获得的太阳能电池组件。 用于室外的聚氨酯粘合剂包括(A)通过使一种或多种异氰酸酯化合物(a1)与具有酯键的多元醇(a2)反应得到的聚氨酯树脂和(B)羟基苯基三嗪化合物,异氰酸酯化合物(a1) 选自脂族异氰酸酯和脂环族异氰酸酯的至少一种化合物。 该粘合剂具有高的剥离强度和优异的耐候性。 进一步含有硅烷化合物的室外用聚氨酯树脂是更优选的。
    • 10. 发明公开
    • MOISTURE-CURING HOT MELT ADHESIVE FOR IC CARD
    • FEUCHTIGKEITSHÄRTENDESHEISSGESCHMOLZENES HAFTMITTELFÜREINE IC-KARTE
    • EP2436745A1
    • 2012-04-04
    • EP10780445.2
    • 2010-05-18
    • Henkel AG & Co. KGaA
    • MATSUKI, YuichiYAMAUCHI, MasaruYOSHIDA, YoshioHAYAKAWA, TadashiTAKAMORI, Ai
    • C09J175/04C09J175/06C09J175/08G06K19/077
    • C09J175/06C08G18/10C08G18/12C08G18/4018C08G18/4202C08G18/4238C08G18/4833C08G2170/20C09J175/04C08G18/307
    • An object of the present invention is to provide a moisture-curable hot melt adhesive which is excellent in total performances as the moisture-curable hot melt adhesive, such as heat resistance, adhesiveness and solidification performance, and also does not cause deterioration of quality and productivity of an IC card to be produced. Another object is to provide an IC card obtained by applying the moisture-curable hot melt adhesive.
      The object is achieved by a moisture-curable hot melt adhesive for an IC card, including (A) a urethane prepolymer having an isocyanate group at the end, wherein the urethane prepolymer (A) includes a chemical structure (A1) derived from a polyesterpolyol (a1) obtained by the reaction of a diol with a dicarboxylic acid having 10 or less carbon atoms, a shear elastic modulus (at 40°C) in an uncured state under moisture is from (1 × 10 4 ) to (1 × 10 8 ) Pa, and a shear elastic modulus (at 80°C) in an uncured state under moisture is from (1 × 10 0 ) to (1 × 10 4 ) Pa. An IC card can be produced preferably by laminating a decorative material and a base material using the moisture-curable hot melt adhesive.
    • 本发明的目的是提供一种湿气固化型热熔粘合剂,其耐湿固化性,粘合性,凝固性等耐湿固化型热熔性粘合剂的总性能优异,且不会造成质量下降, 要生产的IC卡的生产率。 另一个目的是提供通过涂敷湿气固化的热熔粘合剂获得的IC卡。 该目的通过一种用于IC卡的湿气固化热熔粘合剂来实现,其包括(A)末端具有异氰酸酯基的氨基甲酸酯预聚物,其中,氨基甲酸酯预聚物(A)包含衍生自聚酯多元醇的化学结构(A1) (a1)通过二醇与碳原子数为10以下的二羧酸反应得到的水分中未固化状态下的剪切弹性模量(40℃)为(1×10 4)〜(1×10 8)Pa,在湿度下的未固化状态下的剪切弹性模量(80℃)为(1×10 0)〜(1×10 4)Pa。IC卡可优选通过层压装饰材料 以及使用可湿气固化的热熔粘合剂的基材。