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1. 发明公开

EP0288183A3 Cooling apparatus and semiconductor device employing the same 失效
标题翻译：冷却装置和使用其的半导体装置
公开(公告)号：EP0288183A3
公开(公告)日：1989-10-18
申请号：EP88303111.4
申请日：1988-04-07
申请人： HITACHI, LTD.
发明人： Morihara, Atsushi , Naganuma, Yoshio , Koyama, Shuntaro , Yamada, Kazuji , Soga, Tasao , Arakawa, Hideo , Nogita, Shunsuke , Hishinuma, Yukio
IPC分类号： H05K7/20 , H01L23/42 , H01L23/46
CPC分类号： H01L23/4338 , H01L2224/16
摘要： A heat conducting member 3 is placed in the space between a semiconductor chip 11 which generates heat and a heat transfer block 1 which is cooled by a coolant, and the heat conducting member conducts heat from the semiconductor chip to the heat transfer block. The heat conducting member has a slanted surface which is inclined with respect to a surface to be cooled of the corresponding semiconductor chip. Even when the semiconductor chip is displaced or inclined with respect to the heat transfer block, the whole of the cooling surface of the semiconductor chip can be kept in contact with the corresponding heat conducting member.

2. 发明公开

EP0354722A3 Heat transfer system especially for cooling semiconductor devices 失效
标题翻译：热转印系统特别用于冷却半导体器件
公开(公告)号：EP0354722A3
公开(公告)日：1991-04-03
申请号：EP89307878.2
申请日：1989-08-02
申请人： HITACHI, LTD.
发明人： Morihara, Atsushi , Naganuma, Yoshio , Yokoyama, Hiroshi , Kawamura, Keizo , Miyamoto, Mitsuo
IPC分类号： H01L23/433 , H01L23/40
CPC分类号： H01L23/4338 , H01L2224/16 , H01L2224/73253
摘要： Heat transfer system particularly for cooling semiconductor devices, has a first body (10) having a planar first surface (15) and a second body having a second surface (14). A heat conducting contact body (4) contacts both said first and second surfaces to transfer heat, and has a planar third surface (6) contacting said first surface (15) face-to-face and a fourth surface (5) contacting said second surface (14). A spring 8 acts upon the contact body (4) in a predetermined direction to urge the contact body in a wedge-type action against both said first surface (15) and said second surface (14). The second surface (14) is a planar surface at an angle α to the first surface (15) and the fourth surface (5) is a convexly curved surface curving in one plane, so that the second and fourth surfaces make line contact. The contact body (4) is free to move so as to maintain said face-to-face contact and said line contact, in order to accommodate varying relative positioning of said first and second bodies. The direction of action of the spring (8) is at an angle β to the first surface (15) given by 0

3. 发明公开

EP0288183A2 Cooling apparatus and semiconductor device employing the same 失效
标题翻译： Kühlungsgerätund eine diesesGerätverwendende Halbleitervorrichtung。
公开(公告)号：EP0288183A2
公开(公告)日：1988-10-26
申请号：EP88303111.4
申请日：1988-04-07
申请人： HITACHI, LTD.
发明人： Morihara, Atsushi , Naganuma, Yoshio , Koyama, Shuntaro , Yamada, Kazuji , Soga, Tasao , Arakawa, Hideo , Nogita, Shunsuke , Hishinuma, Yukio
IPC分类号： H05K7/20 , H01L23/42 , H01L23/46
CPC分类号： H01L23/4338 , H01L2224/16
摘要： A heat conducting member 3 is placed in the space between a semiconductor chip 11 which generates heat and a heat transfer block 1 which is cooled by a coolant, and the heat conducting member conducts heat from the semiconductor chip to the heat transfer block. The heat conducting member has a slanted surface which is inclined with respect to a surface to be cooled of the corresponding semiconductor chip. Even when the semiconductor chip is displaced or inclined with respect to the heat transfer block, the whole of the cooling surface of the semiconductor chip can be kept in contact with the corresponding heat conducting member.
摘要翻译：导热部件3配置在发热部的半导体芯片11与被冷却剂冷却的传热块1之间的空间内，导热部件从半导体芯片向传热块传导热量。导热构件具有相对于相应的半导体芯片的待冷却表面倾斜的倾斜表面。即使当半导体芯片相对于传热块移位或倾斜时，半导体芯片的整个冷却表面也可以与相应的导热构件保持接触。

4. 发明授权

EP0606991B1 Heat storage apparatus and method 失效
标题翻译：装置和方法的蓄热
公开(公告)号：EP0606991B1
公开(公告)日：1997-03-26
申请号：EP94300120.6
申请日：1994-01-07
申请人： HITACHI, LTD. , HITACHI PLANT ENGINEERING AND CONSTRUCTION CO., LTD.
发明人： Yamada, Akihiro , Shimoda, Makoto , Yamada, Akira , Koseki, Yasuo , Naganuma, Yoshio , Fukutake, Hideo , Fukuda, Toshihiro
IPC分类号： F24F5/00
CPC分类号： F24F5/0017 , Y02E60/147

5. 发明授权

EP0288183B1 Cooling apparatus and semiconductor device employing the same 失效
标题翻译：冷却装置和使用其的半导体装置
公开(公告)号：EP0288183B1
公开(公告)日：1993-10-13
申请号：EP88303111.4
申请日：1988-04-07
申请人： HITACHI, LTD.
发明人： Morihara, Atsushi , Naganuma, Yoshio , Koyama, Shuntaro , Yamada, Kazuji , Soga, Tasao , Arakawa, Hideo , Nogita, Shunsuke , Hishinuma, Yukio
IPC分类号： H05K7/20 , H01L23/42 , H01L23/46
CPC分类号： H01L23/4338 , H01L2224/16

6. 发明授权

EP0619537B1 A method of operating a plurality of ultilities, a utilities network system for carrying out the method and a control device for such a network 失效
标题翻译：操作多个供水设备，发电厂网络中用于这样的网络中执行该方法和控制装置的方法
公开(公告)号：EP0619537B1
公开(公告)日：1997-05-28
申请号：EP94300930.8
申请日：1994-02-09
申请人： HITACHI, LTD.
发明人： Naganuma, Yoshio , Yamada, Akihiro , Enbutsu, Ichiro , Baba, Kenji
IPC分类号： G05B19/418 , H02J3/14
CPC分类号： H02J13/0062 , H02J3/14 , Y02A30/62 , Y02B70/3225 , Y02B90/2638 , Y04S20/222 , Y04S40/124
摘要： In order to operate a plurality of utilities (2,3,4,5), the utilities (2,3,4,5) are interconnected via a communication path (11). Each utility (2,3,4,5) has a control device (1) for controlling the utility (2,3,4,5) and a memory (12) for storing information factors which are used by the corresponding control device (10). The information factors corresponding to all the utilities (2,3,4,5) are investigated by an extraction device (13) to determine which are common to the utilities (2,3,4,5) and which are related. Where the common information factors are identified, they are passed by the communication path (11) to the memories (12) of all the utilities (2,3,4,5). Similarly, when related information factors are found, a calculating device (14) calculates common information which is also passed via the communication path (11) to the memories (12) of all the utilities (2,3,4,5). In this way, utilities (2,3,4,5) may operate more efficiently than when they are operated on a stand-alone basis. The investigation of the information factors, and the calculating of common information from related information factors may be distributed among the utilities (2,3,4,5) or carried out by a common control device (6). The utilities (2,3,4,5) may be electric power supply systems, district heating and cooling systems, sewage disposal systems, waste recovery systems, etc.

7. 发明授权

EP0413565B1 Cooling system for a semiconductor element, semiconductor module including such a system and a thermally conductive member therefor 失效
标题翻译：用于半导体元件的冷却系统，半导体模块，其包括这样的系统和导热热沉为此。
公开(公告)号：EP0413565B1
公开(公告)日：1995-10-25
申请号：EP90308941.5
申请日：1990-08-14
申请人： HITACHI, LTD.
发明人： Shoji, Mitsuyoshi , Morihara, Atsushi , Nakakawaji, Takayuki , Ito, Yutaka , Komatsuzaki, Shigeki , Naganuma, Yoshio , Yokoyama, Hiroshi , Nakagawa, Yusaku
IPC分类号： H01L23/433 , H01L23/473 , C10M105/50 , C10M107/38
CPC分类号： H01L23/4338 , C10M105/68 , C10M105/76 , C10M107/38 , H01L2224/16 , H01L2224/73253 , H01L2924/01014 , H01L2924/01019 , H01L2924/15312

8. 发明公开

EP0619537A1 A method of operating a plurality of ultilities, a utilities network system for carrying out the method and a control device for such a network 失效
标题翻译：操作多个供水设备，发电厂网络中用于这样的网络中执行该方法和控制装置的方法。
公开(公告)号：EP0619537A1
公开(公告)日：1994-10-12
申请号：EP94300930.8
申请日：1994-02-09
申请人： HITACHI, LTD.
发明人： Naganuma, Yoshio , Yamada, Akihiro , Enbutsu, Ichiro , Baba, Kenji
IPC分类号： G05B19/417 , H02J3/14
CPC分类号： H02J13/0062 , H02J3/14 , Y02A30/62 , Y02B70/3225 , Y02B90/2638 , Y04S20/222 , Y04S40/124
摘要： In order to operate a plurality of utilities (2,3,4,5), the utilities (2,3,4,5) are interconnected via a communication path (11). Each utility (2,3,4,5) has a control device (1) for controlling the utility (2,3,4,5) and a memory (12) for storing information factors which are used by the corresponding control device (10). The information factors corresponding to all the utilities (2,3,4,5) are investigated by an extraction device (13) to determine which are common to the utilities (2,3,4,5) and which are related. Where the common information factors are identified, they are passed by the communication path (11) to the memories (12) of all the utilities (2,3,4,5). Similarly, when related information factors are found, a calculating device (14) calculates common information which is also passed via the communication path (11) to the memories (12) of all the utilities (2,3,4,5). In this way, utilities (2,3,4,5) may operate more efficiently than when they are operated on a stand-alone basis. The investigation of the information factors, and the calculating of common information from related information factors may be distributed among the utilities (2,3,4,5) or carried out by a common control device (6). The utilities (2,3,4,5) may be electric power supply systems, district heating and cooling systems, sewage disposal systems, waste recovery systems, etc.
摘要翻译：为了操作的实用程序（2,3,4,5-）多个，公用事业（2,3,4,5）经由通信路径（11）相互连接。每个实用程序（2,3,4,5）具有用于控制实用程序（2,3,4,5）和存储器（12），用于存储由相应的控制装置中使用的信息的因素的控制装置（1）（ 10）。对应于所有实用程序（2,3,4,5）中的信息的因素，通过在提取装置（13），以确定哪些矿是常见的实用程序（2,3,4,5），并且是相关的考察。当公共信息因素被确定，它们是由通信路径（11）的所有公用事业（2,3,4,5），存储器（12）通过。类似地，当发现相关的信息的因素，计算装置（14）计算的共同信息的所有其经由通信路径（11）的所有的实用程序（2,3,4,5）的存储器（12），从而通过。通过这种方式，公用事业（2,3,4,5），当他们独立的基础上运作可能比操作更高效。信息因子的调查，并从相关的信息的因素共同信息的计算可以公用事业之间分布（2,3,4,5）或通过共同的控制装置（6）进行。这些实用程序（2,3,4,5）可以是电力供应系统，区加热和冷却系统，污水处理系统，废物回收系统等

9. 发明公开

EP0606991A1 Heat storage apparatus and method 失效
标题翻译： Vorrichtung und Verfahren zurWärmespeicherung。
公开(公告)号：EP0606991A1
公开(公告)日：1994-07-20
申请号：EP94300120.6
申请日：1994-01-07
申请人： HITACHI, LTD. , HITACHI PLANT ENGINEERING AND CONSTRUCTION CO., LTD.
发明人： Yamada, Akihiro , Shimoda, Makoto , Yamada, Akira , Koseki, Yasuo , Naganuma, Yoshio , Fukutake, Hideo , Fukuda, Toshihiro
IPC分类号： F24F5/00
CPC分类号： F24F5/0017 , Y02E60/147
摘要： A heat storage apparatus has a tank (1) containing a heat storage medium (5) and having an upper region and a lower region holding heat storage medium at respective temperatures above and below atmospheric temperature. To reduce heat losses and increase flexibility of use, an intermediate region is maintained between the upper and lower regions at a temperature between the upper and lower temperatures. The desired temperature of the intermediate region is maintained by heating or cooling its heat storage medium, for example by use of an otherwise unused low-grade heat source.
摘要翻译：蓄热装置具有容纳储热介质（5）的储罐（1），并具有在大气温度以上且低于大气温度的各温度下保持储热介质的上部区域和下部区域。为了减少热损失并增加使用的灵活性，在上部和下部温度之间的温度下，中间区域保持在上部和下部区域之间。通过加热或冷却其储热介质来维持中间区域的期望温度，例如通过使用另外未使用的低等级热源。

10. 发明公开

EP0361495A3 Semiconductor package and computer using the package 失效
标题翻译：使用封装的半导体封装和计算机
公开(公告)号：EP0361495A3
公开(公告)日：1992-03-18
申请号：EP89118028.3
申请日：1989-09-29
申请人： HITACHI, LTD.
发明人： Tanaka, Akira , Inoue, Hirokazu , Yamada, Kazuji , Miyazaki, Kunio , Miura, Osamu , Arakawa, Hideo , Yokoyama, Hiroshi , Naganuma, Yoshio , Morihara, Atsushi , Ouchi, Katsunori
IPC分类号： H01L23/538 , H01L23/50 , H01L23/057 , H01L23/498 , H01L23/467
CPC分类号： H01L23/02 , H01L23/057 , H01L23/467 , H01L23/49822 , H01L23/50 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0655 , H01L2224/16225 , H01L2224/32188 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/49109 , H01L2224/73253 , H01L2224/73265 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/12041 , H01L2924/14 , H01L2924/15174 , H01L2924/15312 , H01L2924/1532 , H01L2924/15787 , H01L2924/16152 , H01L2924/16195 , H01L2924/19041 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/20752
摘要： A semiconductor package for use in computers includes an insulating substrate (2) onto which a semiconductor device (1) is mounted, an insulating cap (3) which shuts out outside air and seals said semiconductor device (1), power-source lines (7) which provide power to the semiconductor device, and signal lines (6) which transmit output signals from the semiconductor device to external circuits. The signal lines are arranged perpendicularly to the insulating substrate so that they are prevented from the dielectric constant of the insulating substrate, while the power-source lines are formed within the insulating substrate and connected through conductive layers parallel to the surface onto which the semiconductor is mounted to external leads (4, 5).
摘要翻译：一种用于计算机的半导体封装包括：绝缘基板（2），其上安装有半导体器件（1）;绝缘盖（3），其将外部空气切断并密封所述半导体器件（1），电源线向半导体器件提供电力的电源线（7）和将半导体器件的输出信号传输到外部电路的信号线（6）。信号线垂直于绝缘基板布置，从而防止绝缘基板的介电常数，同时电源线形成在绝缘基板内，并通过与半导体所在的表面平行的导电层连接安装到外部引线（4,5）上。

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