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1. 发明公开

EP0354722A2 Heat transfer system especially for cooling semiconductor devices 失效
标题翻译： Wärmetransportsystem，insbesondere zumKühlenvon Halbleiteranordnungen。
公开(公告)号：EP0354722A2
公开(公告)日：1990-02-14
申请号：EP89307878.2
申请日：1989-08-02
申请人： HITACHI, LTD.
发明人： Morihara, Atsushi , Naganuma, Yoshio , Yokoyama, Hiroshi , Kawamura, Keizo , Miyamoto, Mitsuo
IPC分类号： H01L23/433 , H01L23/40
CPC分类号： H01L23/4338 , H01L2224/16 , H01L2224/73253
摘要： Heat transfer system particularly for cooling semiconductor devices, has a first body (10) having a planar first surface (15) and a second body having a second surface (14). A heat conducting contact body (4) contacts both said first and second surfaces to transfer heat, and has a planar third surface (6) contacting said first surface (15) face-to-face and a fourth surface (5) contacting said second surface (14). A spring 8 acts upon the contact body (4) in a predetermined direction to urge the contact body in a wedge-type action against both said first surface (15) and said second surface (14). The second surface (14) is a planar surface at an angle α to the first surface (15) and the fourth surface (5) is a convexly curved surface curving in one plane, so that the second and fourth surfaces make line contact. The contact body (4) is free to move so as to maintain said face-to-face contact and said line contact, in order to accommodate varying relative positioning of said first and second bodies. The direction of action of the spring (8) is at an angle β to the first surface (15) given by 0
摘要翻译：特别是用于冷却半导体器件的传热系统具有具有平面第一表面（15）的第一主体（10）和具有第二表面（14）的第二主体。导热接触体（4）与所述第一表面和第二表面接触以传递热量，并且具有面对面接触所述第一表面（15）的平面第三表面（6）和与所述第二表面（5）接触的第二表面表面（14）。弹簧8以预定的方向作用在接触体（4）上，以使所述接触体以楔形作用推动所述第一表面（15）和所述第二表面（14）。第二表面（14）是与第一表面（15）成α角的平面，第四表面（5）是在一个平面中弯曲的凸曲面，使得第二表面和第四表面线接触。接触体（4）自由移动以便保持所述面对面接触和所述线接触，以便适应所述第一和第二主体的变化的相对定位。弹簧（8）的作用方向与由0 <β（α+ 5）给出的第一表面（15）成β角，其中α和β以度表示。

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