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1. 发明授权

EP0413565B1 Cooling system for a semiconductor element, semiconductor module including such a system and a thermally conductive member therefor 失效
标题翻译：用于半导体元件的冷却系统，半导体模块，其包括这样的系统和导热热沉为此。
公开(公告)号：EP0413565B1
公开(公告)日：1995-10-25
申请号：EP90308941.5
申请日：1990-08-14
申请人： HITACHI, LTD.
发明人： Shoji, Mitsuyoshi , Morihara, Atsushi , Nakakawaji, Takayuki , Ito, Yutaka , Komatsuzaki, Shigeki , Naganuma, Yoshio , Yokoyama, Hiroshi , Nakagawa, Yusaku
IPC分类号： H01L23/433 , H01L23/473 , C10M105/50 , C10M107/38
CPC分类号： H01L23/4338 , C10M105/68 , C10M105/76 , C10M107/38 , H01L2224/16 , H01L2224/73253 , H01L2924/01014 , H01L2924/01019 , H01L2924/15312

2. 发明授权

EP0488273B1 Electrical device containing a lubricant or heat conducting composition. 失效
标题翻译：含有润滑剂或导热组合物电气设备。
公开(公告)号：EP0488273B1
公开(公告)日：1997-05-02
申请号：EP91120372.7
申请日：1991-11-28
申请人： HITACHI, LTD.
发明人： Uematsu, Takao , Shoji, Mitsuyoshi , Nakakawaji, Takayuki , Komatsuzaki, Shigeki , Ito, Yutaka , Morihara, Atsushi , Sato, Koji , Zushi, Shizuo , Go, Hiroshi
IPC分类号： C10M169/00 , C10M131/08 , C10M133/16 , C10M139/04 , C10M147/04 , H01L23/373
CPC分类号： C10M139/04 , C10M101/02 , C10M107/02 , C10M107/50 , C10M113/00 , C10M117/02 , C10M117/04 , C10M119/24 , C10M125/00 , C10M131/08 , C10M133/16 , C10M147/04 , C10M169/00 , C10M2201/00 , C10M2201/06 , C10M2201/061 , C10M2201/062 , C10M2201/10 , C10M2201/103 , C10M2201/105 , C10M2201/16 , C10M2201/18 , C10M2203/10 , C10M2203/1006 , C10M2203/1025 , C10M2203/1045 , C10M2203/1065 , C10M2203/1085 , C10M2205/00 , C10M2205/0206 , C10M2207/1225 , C10M2207/1245 , C10M2207/125 , C10M2207/1265 , C10M2207/1285 , C10M2207/129 , C10M2207/166 , C10M2207/186 , C10M2207/206 , C10M2207/246 , C10M2211/042 , C10M2211/044 , C10M2211/06 , C10M2213/00 , C10M2213/04 , C10M2213/06 , C10M2215/08 , C10M2215/082 , C10M2215/086 , C10M2215/12 , C10M2215/122 , C10M2215/28 , C10M2217/042 , C10M2217/043 , C10M2227/04 , C10M2229/025 , C10M2229/0405 , C10M2229/041 , C10M2229/0415 , C10M2229/0425 , C10M2229/0435 , C10M2229/0445 , C10M2229/0455 , C10M2229/0465 , C10M2229/0475 , C10M2229/0485 , C10M2229/0505 , C10M2229/0515 , C10M2229/0525 , C10M2229/0535 , C10M2229/0545 , C10N2210/01 , C10N2220/00 , C10N2220/02 , H01L23/4338 , H01L2224/16 , H01L2224/73253 , H01L2924/01014 , H01L2924/01019 , H01L2924/12044 , H01L2924/15312 , H01L2924/16152 , H01L2924/00
摘要： The invention relates to an apparatus having sliding parts and a compound for preventing diffusion or separation of a base oil; and to a compound for preventing diffusion or separation of the base oil used for the apparatus, which is an electronic or electric appliance using a joule heat generating source, means for taking out joule heat to the outside by sliding with said heat generating source, and heat a conducting compound intervenient between said heat taking out means and heat generating source; and the heat conducting compound used for the appliance.

3. 发明公开

EP0354722A3 Heat transfer system especially for cooling semiconductor devices 失效
标题翻译：热转印系统特别用于冷却半导体器件
公开(公告)号：EP0354722A3
公开(公告)日：1991-04-03
申请号：EP89307878.2
申请日：1989-08-02
申请人： HITACHI, LTD.
发明人： Morihara, Atsushi , Naganuma, Yoshio , Yokoyama, Hiroshi , Kawamura, Keizo , Miyamoto, Mitsuo
IPC分类号： H01L23/433 , H01L23/40
CPC分类号： H01L23/4338 , H01L2224/16 , H01L2224/73253
摘要： Heat transfer system particularly for cooling semiconductor devices, has a first body (10) having a planar first surface (15) and a second body having a second surface (14). A heat conducting contact body (4) contacts both said first and second surfaces to transfer heat, and has a planar third surface (6) contacting said first surface (15) face-to-face and a fourth surface (5) contacting said second surface (14). A spring 8 acts upon the contact body (4) in a predetermined direction to urge the contact body in a wedge-type action against both said first surface (15) and said second surface (14). The second surface (14) is a planar surface at an angle α to the first surface (15) and the fourth surface (5) is a convexly curved surface curving in one plane, so that the second and fourth surfaces make line contact. The contact body (4) is free to move so as to maintain said face-to-face contact and said line contact, in order to accommodate varying relative positioning of said first and second bodies. The direction of action of the spring (8) is at an angle β to the first surface (15) given by 0

4. 发明公开

EP0288183A2 Cooling apparatus and semiconductor device employing the same 失效
标题翻译： Kühlungsgerätund eine diesesGerätverwendende Halbleitervorrichtung。
公开(公告)号：EP0288183A2
公开(公告)日：1988-10-26
申请号：EP88303111.4
申请日：1988-04-07
申请人： HITACHI, LTD.
发明人： Morihara, Atsushi , Naganuma, Yoshio , Koyama, Shuntaro , Yamada, Kazuji , Soga, Tasao , Arakawa, Hideo , Nogita, Shunsuke , Hishinuma, Yukio
IPC分类号： H05K7/20 , H01L23/42 , H01L23/46
CPC分类号： H01L23/4338 , H01L2224/16
摘要： A heat conducting member 3 is placed in the space between a semiconductor chip 11 which generates heat and a heat transfer block 1 which is cooled by a coolant, and the heat conducting member conducts heat from the semiconductor chip to the heat transfer block. The heat conducting member has a slanted surface which is inclined with respect to a surface to be cooled of the corresponding semiconductor chip. Even when the semiconductor chip is displaced or inclined with respect to the heat transfer block, the whole of the cooling surface of the semiconductor chip can be kept in contact with the corresponding heat conducting member.
摘要翻译：导热部件3配置在发热部的半导体芯片11与被冷却剂冷却的传热块1之间的空间内，导热部件从半导体芯片向传热块传导热量。导热构件具有相对于相应的半导体芯片的待冷却表面倾斜的倾斜表面。即使当半导体芯片相对于传热块移位或倾斜时，半导体芯片的整个冷却表面也可以与相应的导热构件保持接触。

5. 发明公开

EP0241866A2 Gasification process for coal gasification furnace and apparatus therefor 失效
标题翻译： Vergasungsverfahrenfüreinen Kohlenvergasungsofen und Vorrichtungdafür。
公开(公告)号：EP0241866A2
公开(公告)日：1987-10-21
申请号：EP87105267.6
申请日：1987-04-09
申请人： HITACHI, LTD.
发明人： Morihara, Atsushi , Miyamoto, Tomohiko , Koyama, Shuntaro , Nogita, Shunsuke , Hishinuma, Yukio
IPC分类号： C10J3/46 , C10J3/48
CPC分类号： C10J3/487 , C10J3/526 , C10J2300/093 , C10J2300/1846 , Y10S48/02
摘要： This invention relates to a gasification process for a coal gasification furnace which comprises ejecting coal and an oxidizing agent along the circumferential direction of a gasification chamber (10) to form a whirling stream, making the two contact and react with each other in the gasification chamber (10), thereby producing a combustible gas from the coal while making ash in the coal melt into the form of slag, and withdrawing the slag through a slag tap (3) provided at the lower part of the gasification chamber (10) into a slag cooling chamber, wherein said process comprises causing the whirling stream to produce pressure difference such that the pressure decreases from the wall surface of the gasification chamber (10) toward the central part thereof, forming, by use of the pressure difference, a recycle system wherein a part of the combustible gas produced is introduced from the gasification chamber to the slag cooling chamber and returned again therefrom to the gasification chamber (10), and heating the slag tap (3) by means of the circulating combustible gas, and to a process therefor.
摘要翻译：本发明涉及一种煤气化炉的气化方法，其包括沿着气化室（10）的圆周方向喷射煤和氧化剂以形成旋流，从而在气化室中彼此接触并反应（10），由此从煤中产生可燃气体，同时使煤熔体中的灰分变成炉渣，并且通过设置在气化室（10）的下部的炉渣抽出器（3）将炉渣排出成为炉渣冷却室，其中所述方法包括使回转流产生压力差，使得压力从气化室（10）的壁表面朝向其中心部分减小，通过使用13压差形成回收系统，其中产生的可燃气体的一部分从气化室引入炉渣冷却室，并从其再次返回到气化炉琥珀（10），并通过循环的可燃气体加热渣丝锥（3），并进行处理。

6. 发明授权

EP0504796B1 Method for surface treatment of a body, surface treatment agent, surface treated body, surface treated members, and apparatus being furnished with same 失效
标题翻译：用于处理体的表面处理的装置，用于表面处理，表面处理的身体，Oberlfächebehandelte份，和含有该装置
公开(公告)号：EP0504796B1
公开(公告)日：1996-09-18
申请号：EP92104577.9
申请日：1992-03-17
申请人： HITACHI, LTD.
发明人： Nakakawaji, Takayuki , Morihara, Atsushi , Shoji, Mitsuyoshi , Sato, Koji , Ito, Yutaka , Kaji, Ryuichi , Go, Hiroshi
IPC分类号： C09K3/18 , C08G65/32 , H01L23/373
CPC分类号： H01L24/32 , C09K3/18 , F28F13/00 , F28F2013/006 , H01L23/3737 , H01L23/433 , H01L2224/16 , H01L2224/32057 , H01L2224/73253 , H01L2224/83385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/12044 , H01L2924/14 , H01L2924/15312

7. 发明授权

EP0241866B1 Gasification process for coal gasification furnace and apparatus therefor 失效
标题翻译：煤气化炉及其设备的气化工艺
公开(公告)号：EP0241866B1
公开(公告)日：1990-07-25
申请号：EP87105267.6
申请日：1987-04-09
申请人： HITACHI, LTD.
发明人： Morihara, Atsushi , Miyamoto, Tomohiko , Koyama, Shuntaro , Nogita, Shunsuke , Hishinuma, Yukio
IPC分类号： C10J3/46 , C10J3/48
CPC分类号： C10J3/487 , C10J3/526 , C10J2300/093 , C10J2300/1846 , Y10S48/02

8. 发明公开

EP0288183A3 Cooling apparatus and semiconductor device employing the same 失效
标题翻译：冷却装置和使用其的半导体装置
公开(公告)号：EP0288183A3
公开(公告)日：1989-10-18
申请号：EP88303111.4
申请日：1988-04-07
申请人： HITACHI, LTD.
发明人： Morihara, Atsushi , Naganuma, Yoshio , Koyama, Shuntaro , Yamada, Kazuji , Soga, Tasao , Arakawa, Hideo , Nogita, Shunsuke , Hishinuma, Yukio
IPC分类号： H05K7/20 , H01L23/42 , H01L23/46
CPC分类号： H01L23/4338 , H01L2224/16
摘要： A heat conducting member 3 is placed in the space between a semiconductor chip 11 which generates heat and a heat transfer block 1 which is cooled by a coolant, and the heat conducting member conducts heat from the semiconductor chip to the heat transfer block. The heat conducting member has a slanted surface which is inclined with respect to a surface to be cooled of the corresponding semiconductor chip. Even when the semiconductor chip is displaced or inclined with respect to the heat transfer block, the whole of the cooling surface of the semiconductor chip can be kept in contact with the corresponding heat conducting member.

9. 发明公开

EP0241866A3 Gasification process for coal gasification furnace and apparatus therefor 失效
标题翻译：煤气化炉及其设备的气化过程
公开(公告)号：EP0241866A3
公开(公告)日：1988-05-04
申请号：EP87105267
申请日：1987-04-09
申请人： HITACHI, LTD.
发明人： Morihara, Atsushi , Miyamoto, Tomohiko , Koyama, Shuntaro , Nogita, Shunsuke , Hishinuma, Yukio
IPC分类号： C10J03/46 , C10J03/48
CPC分类号： C10J3/487 , C10J3/526 , C10J2300/093 , C10J2300/1846 , Y10S48/02
摘要： This invention relates to a gasification process for a coal gasification furnace which comprises ejecting coal and an oxidizing agent along the circumferential direction of a gasification chamber (10) to form a whirling stream, making the two contact and react with each other in the gasification chamber (10), thereby producing a combustible gas from the coal while making ash in the coal melt into the form of slag, and withdrawing the slag through a slag tap (3) provided at the lower part of the gasification chamber (10) into a slag cooling chamber, wherein said process comprises causing the whirling stream to produce pressure difference such that the pressure decreases from the wall surface of the gasification chamber (10) toward the central part thereof, forming, by use of the pressure difference, a recycle system wherein a part of the combustible gas produced is introduced from the gasification chamber to the slag cooling chamber and returned again therefrom to the gasification chamber (10), and heating the slag tap (3) by means of the circulating combustible gas, and to a process therefor.

10. 发明授权

EP0288183B1 Cooling apparatus and semiconductor device employing the same 失效
标题翻译：冷却装置和使用其的半导体装置
公开(公告)号：EP0288183B1
公开(公告)日：1993-10-13
申请号：EP88303111.4
申请日：1988-04-07
申请人： HITACHI, LTD.
发明人： Morihara, Atsushi , Naganuma, Yoshio , Koyama, Shuntaro , Yamada, Kazuji , Soga, Tasao , Arakawa, Hideo , Nogita, Shunsuke , Hishinuma, Yukio
IPC分类号： H05K7/20 , H01L23/42 , H01L23/46
CPC分类号： H01L23/4338 , H01L2224/16

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