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1. 发明授权

EP2495014B1 RF filter for an active implantable medical device (AIMD) for handling high RF power induced in an associated implanted lead from an external RF field 有权
标题翻译：用于处理来自外部RF场的相关植入导联中感应的高RF功率的有源植入式医疗设备（AIMD）的RF滤波器
公开(公告)号：EP2495014B1
公开(公告)日：2017-11-22
申请号：EP12157697.9
申请日：2012-03-01
申请人： Greatbatch Ltd.
发明人： Johnson, Robert Shawn , Thiebolt, William , Williams, Christopher M. , Woods, Jason , Truex, Buehl E. , Frustaci, Dominick J. , Dabney, Waren S. , Stevenson, Robert A. , Seitz, Keith W. , Frysz, Christine , Marzano, Thomas , Brendel, Richard L. , Roberts, John E.
IPC分类号： A61N1/37
CPC分类号： A61N1/08 , A61N1/05 , A61N1/3718 , A61N1/3754 , H01G4/35 , H03H1/0007
摘要： An RF filter for an active medical device (AMD), for handling RF power induced in an associated lead from an external RF field at a selected MRI frequency or range frequencies includes a capacitor having a capacitance of between 100 and 10,000 picofarads, and a temperature stable dielectric having a dielectric constant of 200 or less and a temperature coefficient of capacitance (TCC) within the range of plus 400 to minus 7112 parts per million per degree centigrade. The capacitor's dielectric loss tangent in ohms is less than five percent of the capacitor's equivalent series resistance (ESR) at the selected MRI RF frequency or range of frequencies.

2. 发明授权

EP2529790B1 Feedthrough wire connector for use in a medical device 有权
标题翻译：用于医疗设备的馈通线连接器
公开(公告)号：EP2529790B1
公开(公告)日：2017-09-20
申请号：EP12170625.3
申请日：2012-06-01
申请人： Greatbatch Ltd.
发明人： Marzano, Thomas , Seitz, Keith , Coffed, James
IPC分类号： A61N1/375 , H01G4/35 , H01R13/426
CPC分类号： H01R13/719 , A61N1/3754 , H01G4/35 , H01R13/426 , H01R13/521 , H01R13/5224 , Y10T29/49204

3. 发明授权

EP2398026B1 COATING OF NON-SOLDERABLE BASE METAL FOR SOLDERING APPLICATION IN MEDICAL DEVICE COMPONENT 有权
公开(公告)号：EP2398026B1
公开(公告)日：2019-08-21
申请号：EP11170034.0
申请日：2011-06-15
申请人： Greatbatch Ltd.
发明人： Sutay, Todd C. , Seitz, Keith , Hussein, Haytham , Thanawala, Sachin , Marzano, Thomas
IPC分类号： H01G4/35 , A61N1/375 , H01G4/232

4. 发明公开

EP3103514A1 RF FILTER FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE (AIMD) FOR HANDLING HIGH RF POWER INDUCED IN AN ASSOCIATED IMPLANTED LEAD FROM AN EXTERNAL RF FIELD 审中-公开
标题翻译： RF滤波器FOR HIGH RF功率的在一个相关的离子注入LINE从外部RF场的有源可植入医疗器件（AIMD）HANDLING
公开(公告)号：EP3103514A1
公开(公告)日：2016-12-14
申请号：EP16175505.3
申请日：2012-03-01
申请人： Greatbatch Ltd.
发明人： Frysz, Christine , Marzano, Thomas , Roberts, John E. , Seitz, Keith W. , Johnson, Robert Shawn , Stevenson, Robert A. , Thiebolt, William , Truex, Buehl E. , Williams, Christopher M. , Woods, Jason , Brendel, Richard L. , Dabney, Warren S. , Frustaci, Dominick J.
IPC分类号： A61N1/37
CPC分类号： A61N1/08 , A61N1/05 , A61N1/3718 , A61N1/3754 , H01G4/35 , H03H1/0007
摘要： An RF filter for an active medical device (AMD), for handling RF power induced in an associated lead from an external RF field at a selected MRI frequency or range frequencies includes a capacitor having a capacitance of between 100 and 10,000 picofarads, and a temperature stable dielectric having a dielectric constant of 200 or less and a temperature coefficient of capacitance (TCC) within the range of plus 400 to minus 7112 parts per million per degree centigrade. The capacitor's dielectric loss tangent in ohms is less than five percent of the capacitor's equivalent series resistance (ESR) at the selected MRI RF frequency or range of frequencies.
摘要翻译：对于有源医疗器件（AMD）上的RF滤波器，用于在选定的MRI频率或频率范围内从外部RF场处理在相关联的导线引起的RF功率包括具有皮法100和10000之间的电容的电容器，和一个温度具有200或更小的范围内的介电常数和电容（TCC）的温度系数加400至零下7112份每百万份每摄氏度稳定的介电。在欧姆电容的电介质损耗角正切是电容器的等效串联电阻（ESR）在所选择的MRI RF频率或频率范围的小于百分之五。

5. 发明公开

EP2617461A1 Co-fired hermetically sealed feedthrough with alumina substrate and platinum filled via for an active implantable medical device 有权
标题翻译：密封共烧导电铝衬底与铂经由有源可植入医疗设备填充
公开(公告)号：EP2617461A1
公开(公告)日：2013-07-24
申请号：EP13151536.3
申请日：2013-01-16
申请人： Greatbatch Ltd.
发明人： Tang, Xiaohong , Thieblot, William C. , Frysz, Christine A. , Seitz, Keith W. , Stevenson, Robert A. , Brendel, Richard L. , Marzano, Thomas , Woods, Jason , Frustaci, Dominick J. , Winn, Steven W.
IPC分类号： A61N1/375 , H01G9/10
CPC分类号： A61N1/3754 , A61N1/05 , A61N1/08 , A61N1/372 , A61N1/375 , B23K35/3013 , C22C29/12 , H01G2/103 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H01G4/40 , H01R43/00 , H02G3/22 , Y10T156/1052
摘要： A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.
摘要翻译：共烧密封馈通是附连到有源可植入医疗器件。通过包括在包括至少96或99％的氧化铝的氧化铝介质基板的进料。通孔A通过从体液侧到装置侧的氧化铝介质基板地设置。基本上封闭的孔隙，和无玻璃料基本上纯的铂是填充通孔形成通过导电体液侧和装置侧之间填充铂内设置。甲气密密封是铂和氧化铝填充电介质基片，worin气密密封件包括在氧化铝电介质基板和铂填充物之间的曲折和相互保形界面之间。

6. 发明公开

EP2529790A1 Feedthrough wire connector for use in a medical device 有权
标题翻译： Dechführungsdrahtverbinderzur Verwendung在einer medizinischen Vorrichtung
公开(公告)号：EP2529790A1
公开(公告)日：2012-12-05
申请号：EP12170625.3
申请日：2012-06-01
申请人： Greatbatch Ltd.
发明人： Marzano, Thomas , Seitz, Keith , Coffed, James
IPC分类号： A61N1/375 , H01G4/35
CPC分类号： H01R13/719 , A61N1/3754 , H01G4/35 , H01R13/426 , H01R13/521 , H01R13/5224 , Y10T29/49204
摘要： A feedthrough filter capacitor assembly comprising a terminal pin connector is described. The terminal pin connector is designed to facilitate an electrical connection between the terminal pin comprising a multitude of compositions to a circuit board of an implantable medical device. The terminal pin connector comprises a clip portion positioned within a connector housing. The connector clip mechanically attaches to the terminal pin of the feedthrough and an exterior surface of the connector housing electrically contacts the circuit board, creating an electrical connection therebetween. The connector housing comprises a material that is conducive to a weld or solder attachment process to the circuit board. The feedthrough filter capacitor assembly is particularly useful for incorporation into implantable medical devices such as cardiac pacemakers, cardioverter defibrillators, and the like, to decouple and shield internal electronic components of the medical device from undesirable electromagnetic interference (EMI) signals.
摘要翻译：描述了包括端子引脚连接器的馈通滤波电容器组件。端子针连接器被设计成便于在包括可植入医疗装置的电路板的多种成分的端子销之间的电连接。端子针连接器包括定位在连接器壳体内的夹子部分。连接器夹机械地附接到馈通的端子销，并且连接器壳体的外表面电接触电路板，从而在它们之间产生电连接。连接器壳体包括有助于对电路板的焊接或焊接附着过程的材料。馈通滤波电容器组件特别适用于结合到诸如心脏起搏器，心律转复除颤器等的可植入医疗装置中，以将医疗装置的内部电子部件分离和屏蔽以免受不良电磁干扰（EMI）信号的影响。

7. 发明公开

EP2636427A1 Elevated hermetic feedthrough insulator adapted for side attachment of electrical conductors on the body fluid side of an active implantable medical device 有权
标题翻译：增加气密馈通绝缘体，其适于电导体上的有源可植入医疗装置的体液并排安装
公开(公告)号：EP2636427A1
公开(公告)日：2013-09-11
申请号：EP13151537.1
申请日：2013-01-16
申请人： Greatbatch Ltd.
发明人： Marzano, Thomas , Seitz, Keith W. , Stevenson, Robert A. , Tang, Xiaohong , Thiebolt, William C. , Frysz, Christine A. , Brendel, Richard L. , Woods, Jason , Winn, Steven W. , Frustaci, Dominick J. , Truex, Buehl E. , Hickel, Donald
IPC分类号： A61N1/375 , B22F3/00 , H01L21/77 , H05K3/40
CPC分类号： A61N1/3754 , A61N1/05 , A61N1/08 , A61N1/372 , A61N1/375 , B23K35/3013 , C22C29/12 , H01G2/103 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H01G4/40 , H01R43/00 , H02G3/22 , Y10T156/1052
摘要： An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.
摘要翻译：在升高的进料通过可连接到顶部或有源可植入医疗设备的一侧。馈通包括导电套箍和一个电介质基片。介质基片被定义为包含在体液侧和导电套箍内设置一个装置侧。介质基片包括导电套圈以上提出的体液侧升高部分基因的反弹。通孔的至少一个是通过从体液一侧向装置侧电介质基片处理完毕。导电填充的过孔形成气密密封和体液侧和装置侧之间的导电的至少一个内设置。的导线连接的特征是在体液侧导电耦合到所述填充和设置成邻近所述电介质基板的升高部分。

8. 发明公开

EP2628504A1 EMI filtered co-connected hermetic feedthrough, feedthrough capacitor and leadwire assembly for an active implantable medical device 审中-公开
标题翻译： EMI过滤共连气密密封的穿通线，通过电容器和导丝组件，用于有源可植入医疗装置
公开(公告)号：EP2628504A1
公开(公告)日：2013-08-21
申请号：EP13151535.5
申请日：2013-01-16
申请人： Greatbatch Ltd.
发明人： Stevenson, Robert A. , Marzano, Thomas , Seitz, Keith W. , Winn, Steven W. , Frysz, Christine A. , Brendel, Richard L. , Woods, Jason , Frustaci, Dominick J. , Tang, Xiaohong , Thiebolt, William C.
IPC分类号： A61N1/375 , B22F3/00 , H01L21/77 , H05K3/40
CPC分类号： A61N1/3754 , A61N1/05 , A61N1/08 , A61N1/372 , A61N1/375 , B23K35/3013 , C22C29/12 , H01G2/103 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H01G4/40 , H01R43/00 , H02G3/22 , Y10T156/1052
摘要： A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.
摘要翻译：的共连接的气密馈通，馈通电容器，并且引线组件包括具有经由穿过电介质基片从体液侧设置一个装置侧孔的电介质基板。导电填充经由形成气密密封内的设置，并且是体液侧和装置侧之间的导电。馈通电容器被连接到电介质基片和包括电容器电介质基板，通孔未填充的电容器的金属化包括在内部，一组电容器有源电极板电耦合到上设置在外金属化内金属和一组电容器接地的电极板电耦合到所述金属化外层。导电引线通孔中的未填充电容器内设置。一种电接头连接所述导电填充，电容器内部的金属化地连同电容器有源电极板和导电性的引线。

9. 发明公开

EP2495014A1 RF filter for an active implantable medical device (AIMD) for handling high RF power induced in an associated implanted lead from an external RF field 有权
标题翻译：对于有源可植入医疗装置（AIMD）RF滤波器来处理高RF功率到相关联的植入引线从外部RF场
公开(公告)号：EP2495014A1
公开(公告)日：2012-09-05
申请号：EP12157697.9
申请日：2012-03-01
申请人： Greatbatch Ltd.
发明人： Johnson, Robert Shawn , Thiebolt, William , Williams, Christopher M. , Woods, Jason , Truex, Buehl E. , Frustaci, Dominick J. , Dabney, Waren S. , Stevenson, Robert A. , Seitz, Keith W. , Frysz, Christine , Marzano, Thomas , Brendel, Richard L. , Roberts, John E.
IPC分类号： A61N1/37
CPC分类号： A61N1/08 , A61N1/05 , A61N1/3718 , A61N1/3754 , H01G4/35 , H03H1/0007
摘要： An RF filter for an active medical device (AMD), for handling RF power induced in an associated lead from an external RF field at a selected MRI frequency or range frequencies includes a capacitor having a capacitance of between 100 and 10,000 picofarads, and a temperature stable dielectric having a dielectric constant of 200 or less and a temperature coefficient of capacitance (TCC) within the range of plus 400 to minus 7112 parts per million per degree centigrade. The capacitor's dielectric loss tangent in ohms is less than five percent of the capacitor's equivalent series resistance (ESR) at the selected MRI RF frequency or range of frequencies.
摘要翻译：对于有源医疗器件（AMD）上的RF滤波器，用于在选定的MRI频率或频率范围内从外部RF场处理在相关联的导线引起的RF功率包括具有皮法100和10000之间的电容的电容器，和一个温度具有200或更小的范围内的介电常数和电容（TCC）的温度系数加400至零下7112份每百万份每摄氏度稳定的介电。在欧姆电容的电介质损耗角正切是电容器的等效串联电阻（ESR）在所选择的MRI RF频率或频率范围的小于百分之五。

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