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1. 发明公开

EP1334802A4 POLISHER 有权
标题翻译： POLIERVORRICHTUNG
公开(公告)号：EP1334802A4
公开(公告)日：2005-08-31
申请号：EP01901492
申请日：2001-01-22
申请人： EBARA CORP
发明人： KAMIMURA KENJI , KIMURA NORIO , OKAMURA SATOSHI , AIZAWA HIDEO , AKAGI MAKOTO , TOKUSHIGE KATSUHIKO , MATSUO HISANORI , TSUJIMURA MANABU
IPC分类号： B24B53/00 , B24B53/007 , B24B53/017 , H01L21/306 , B24B37/04
CPC分类号： B24B53/017 , B24B29/005 , B24B53/003 , H01L21/30625
摘要： The invention relates to a polisher for polishing a workpiece, such as a semiconductor wafer, so that it may have a flat mirror finish. The polisher comprises a polisher table (1) with a polishing face, and a top ring (3). A workpiece is placed between the polisher table (1) and the top ring (3) and polished by application of a predetermined pressure. The polisher includes at least two dressing units equipped with dressers (7, 11) that are in contact with the surface of polishing cloth to dress the polishing face.
摘要翻译：本发明涉及一种用于抛光诸如半导体晶片的工件的抛光器，以使其可以具有平坦的镜面抛光。抛光机包括具有抛光面的抛光机台（1）和顶环（3）。将工件放置在抛光机台（1）和顶环（3）之间并通过施加预定压力抛光。该抛光机包括至少两个配备有修整器（7,11）的修整单元，修整器（7,11）与抛光布的表面接触以修整抛光面。

3. 发明公开

EP1666639A4 SUBMERGED ELECTRODE AND MATERIAL THEREOF 审中-公开
标题翻译：潜水铅，其材料
公开(公告)号：EP1666639A4
公开(公告)日：2007-05-23
申请号：EP04771507
申请日：2004-08-04
申请人： EBARA CORP
发明人： OGURE NAOAKI , TSUJIMURA MANABU
IPC分类号： C25B11/12 , C02F1/461
CPC分类号： C02F1/46109 , C02F1/46114 , C02F2001/46138 , C02F2001/46152 , C02F2101/308 , C02F2103/34 , Y10T29/49117
摘要： [PROBLEMS] To provide an electrode that is stable in liquid and is capable of treating a large volume of liquid and a small electrode that is capable of treating a large volume of liquid at high speed; provide a liquid treating apparatus and method of liquid treatment in which the electrode is used; provide an electrode material being resistant to damaging by thermal stress; and provide an electrode, liquid treating apparatus and method of liquid treatment in which the electrode material is used. [MEANS FOR SOLVING PROBLEMS] An electrode of configuration resulting from first coating solid pieces of 5 to 60 mm size with conductive diamond, supporting them on supports and bringing the same into contact with each other so as to realize current passage as a whole is used in various electrochemical treatments. Also, use is made of an electrode comprising conductive substrate (1), coating layer (2) covering the conductive substrate and conductive diamond particles (3) immobilized on the coating layer characterized in that part of each of the conductive diamond particles is in contact with the conductive substrate while another part thereof is exposed on the surface of the coating layer. Further, use is made of an electrode material comprising a columnar or tubular substrate having its whole side surface coated with conductive diamond.

4. 发明公开

EP1179617A4 APPARATUS FOR PLATING SUBSTRATE, METHOD FOR PLATING SUBSTRATE, ELECTROLYTIC PROCESSING METHOD, AND APPARATUS THEREOF 审中-公开
标题翻译：装置和方法电镀的基材，电解处理方法及装置
公开(公告)号：EP1179617A4
公开(公告)日：2007-01-24
申请号：EP00985856
申请日：2000-12-25
申请人： EBARA CORP , TOSHIBA KK
发明人： KUNISAWA JUNJI , ODAGAKI MITSUKO , MAKINO NATSUKI , MISHIMA KOJI , NAKAMURA KENJI , INOUE HIROAKI , KIMURA NORIO , MATSUDA TETSUO , KANEKO HISASHI , HAYASAKA NOBUO , OKUMURA KATSUYA , TSUJIMURA MANABU , MORITA TOSHIYUKI
IPC分类号： C23C18/16 , C25D7/12 , C25D17/12 , C25D17/14 , H01L21/00 , H01L21/288 , H01L21/768 , H05K3/42
CPC分类号： H01L21/6719 , C25D7/123 , C25D17/001 , C25D17/12 , C25D17/14 , H01L21/2885 , H01L21/67046 , H01L21/67051 , H01L21/6708 , H01L21/6715 , H01L21/6723 , H01L21/76877 , H01L21/76879 , H01L2924/0002 , H05K3/423 , H01L2924/00
摘要： An apparatus for plating a substrate by filling a fine interconnection pattern (recess) formed in a semiconductor substrate with a metal such as copper (Cu) comprises a substrate holding section (36) for horizontally holding and rotating a substrate so oriented that the surface to be plate faces up, a sealer (90) that comes into contact with the periphery of the surface to be plated of the held substrate to seal the periphery water-tightly, and a cathode (88) that comes into contact with the substrate to supply current thereto, and further comprises a cathode section (38) rotatable with the substrate holding section (36), an electrode arm section (30) provided horizontally and vertically movably above the cathode section (38) and having an anode (98) oriented down, and plating solution injecting means for injecting a plating solution into the space between the surface to be plated of the held substrate and the anode of the electrode arm section (30) brought near to the surface to be plated. Therefore, the processings including the plating and its collateral processings are carried out by means of a single unit. A method for plating a substrate is also disclosed.

5. 发明公开

EP0990486A4 POLISHING SOLUTION FEEDER 有权
标题翻译： POLIERFLÜSSIGKEITSSPENDER
公开(公告)号：EP0990486A4
公开(公告)日：2001-02-28
申请号：EP98957220
申请日：1998-12-08
申请人： EBARA CORP
发明人： KIMURA NORIO , HIYAMA HIROKUNI , WADA YUTAKA , KAWASHIMA KIYOTAKA , TSUJIMURA MANABU , KAWAMOTO TAKAYOSHI
IPC分类号： B24B37/04 , B24B57/02 , B24B1/04
CPC分类号： B24B37/04 , B24B57/02 , Y10S451/91
摘要： The object of the present invention is to provide a polishing apparatus that can supply a polishing solution having a non-varying distribution of abrading particle sizes at a steady rate. An apparatus (20) for delivering a polishing solution to a polishing apparatus (22) is disclosed. The apparatus (20) comprises: a solution passage for transporting the polishing solution; and an ultrasonic vibrator (72) being provided in at least one location of the solution passage.
摘要翻译：本发明的目的是提供一种抛光装置，其可以以稳定的速率供给具有不变的研磨粒度分布的抛光溶液。公开了一种用于将抛光溶液输送到抛光装置（22）的装置（20）。装置（20）包括：用于输送抛光溶液的溶液通道; 以及设置在所述溶液通道的至少一个位置的超声波振动器（72）。

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