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    • 5. 发明公开
    • Solid-state image pickup device and method for manufacturing solid-state image pickup device
    • Festkörperbildaufnahmevorrichtungund Verfahren zur Herstellung derFestkörperbildaufnahmevorrichtung
    • EP2487715A2
    • 2012-08-15
    • EP12151095.2
    • 2012-01-13
    • Canon Kabushiki Kaisha
    • Sawayama, TadashiIkakura, HiroshiKondo, TakaharuEto, Toru
    • H01L27/146
    • H01L27/14629H01L27/14621H01L27/14627H01L27/14636H01L27/14641H01L27/14643H01L27/14685
    • A method for manufacturing a solid-state image pickup device that includes a substrate (301) including a photoelectric conversion unit (202) and a waveguide arranged on the substrate, the waveguide corresponding to the photoelectric conversion unit and including a core and a cladding (3191), includes a first step and a second step, in which in the first step and the second step, a member (324a) to be formed into the core is formed in an opening in the cladding by high-density plasma-enhanced chemical vapor deposition, and in which after the first step, in the second step, the member to be formed into the core is formed by the high-density plasma-enhanced chemical vapor deposition under conditions in which the ratio of a radio-frequency power on the back face side of the substrate to a radio-frequency power on the front face side of the substrate is higher than that in the first step.
    • 一种固体摄像装置的制造方法,其特征在于,包括:基板(301),具备配置在所述基板上的光电转换部(202)和波导管,所述波导对应于所述光电转换部并具有芯和包层( 3191)包括第一步骤和第二步骤,其中在第一步骤和第二步骤中,待形成芯体的构件(324a)通过高密度等离子体增强化学品形成在包层的开口中 并且其中在第一步骤之后,在第二步骤中,通过高密度等离子体增强化学气相沉积在其中将射频功率的比率 基板的背面侧与基板的正面侧的高频电力比第一工序的高。