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1. 发明公开

EP3315379A1 ON-BOARD APPARATUS AND TRAIN COMMUNICATION SYSTEM 有权转让
标题翻译：车载设备和列车通信系统
公开(公告)号：EP3315379A1
公开(公告)日：2018-05-02
申请号：EP16813700.8
申请日：2016-06-22
申请人： Zhuzhou CSR Times Electric Co., Ltd.
发明人： HAN, Chen , LV, Haojiong , WU, Weiping , TANG, Guoping , LI, Hui , XU, Juan
IPC分类号： B61L23/14
CPC分类号： B61L23/14
摘要： On-board equipment and a train communication system are disclosed. The on-board equipment includes a wireless communication device, configured to receive a switching instruction from a ground responder; a time management device, configured to determine a wireless time-out time slice after the wireless communication device receives the switching instruction from the ground responder; a storage device, configured to store communication contents between the wireless communication device and the takeover ZC when the wireless communication device pauses communication with the takeover ZC; and a processing device, configured to determine a next movement authority according to the communication contents between the wireless communication device and the takeover ZC, determine whether the current movement authority is connected with the next movement authority, and perform zone switching if a determination result is yes.
摘要翻译：公开了车载设备和列车通信系统。车载设备包括无线通信设备，用于接收来自地面响应者的切换指令; 时间管理装置，用于在所述无线通信装置接收到来自地面响应器的切换指令后，确定无线超时时间片; 存储设备，用于当所述无线通信设备暂停与所述承接ZC的通信时，存储所述无线通信设备与所述承载ZC之间的通信内容; 处理装置，用于根据所述无线通信装置与所述承载ZC之间的通信内容，确定下一移动权限，判断当前移动权限是否与下一移动权限相连，若判断结果为是，则执行区域切换是。

2. 发明公开

EP3029734A4 IGBT DEVICE AND METHOD FOR PACKAGING WHOLE-WAFER IGBT CHIP 有权
标题翻译： IGBT器件和方法封装了所有晶圆IGBT芯片
公开(公告)号：EP3029734A4
公开(公告)日：2017-03-29
申请号：EP14831797
申请日：2014-06-16
申请人： ZHUZHOU CSR TIMES ELECTRIC CO LTD
发明人： LI JILU , WU YUDONG , PENG YONGDIAN
IPC分类号： H01L23/051 , H01L29/06 , H01L29/08 , H01L29/417 , H01L29/66 , H01L29/739
CPC分类号： H01L24/72 , H01L23/051 , H01L24/05 , H01L24/06 , H01L29/0657 , H01L29/0696 , H01L29/41741 , H01L29/66333 , H01L29/7395 , H01L2224/05552 , H01L2224/0612 , H01L2924/10156 , H01L2924/13055 , H01L2924/13091 , H01L2924/00
摘要： An IGBT device and a method for packaging a whole-wafer IGBT chip. The IGBT device comprises: an entire wafer IGBT chip (33), the upper surface thereof comprising a central gate connection zone (13) and a plurality of emitter connection zones (15, 25) surrounding the central gate connection zone (13), and the lower surface thereof comprising a collecting zone, wherein the emitter connection zones (15, 25) located on the surface of a failure cellular zone of the chip are thinned; a collector washer (32) which is fixed on the lower surface of the chip (33), and an emitter washer (34) which is fixed on the upper surface of the chip (33); a collector electrode (31) which is electrically contacted with the collector washer (32), and an emitter electrode (36) which is electrically contacted with the emitter washer (34); and a gate leading wire (37) which is connected to the central gate connection zone (13), wherein the gate leading wire (37) is insulated from the emitter washer (34) and the emitter electrode (36). The IGBT device avoids the harmful effect of the failure cellular zone in the whole-wafer chip on the performance of the IGBT device.

3. 发明公开

EP3029734A1 IGBT DEVICE AND METHOD FOR PACKAGING WHOLE-WAFER IGBT CHIP 有权
标题翻译： IGBT-VORRICHTUNG VERFAHREN ZUM VERKAPSELN VON GANZWAFER-IGBT-CHIPS
公开(公告)号：EP3029734A1
公开(公告)日：2016-06-08
申请号：EP14831797.7
申请日：2014-06-16
申请人： Zhuzhou CSR Times Electric Co., Ltd.
发明人： LI, Jilu , WU, Yudong , PENG, Yongdian
IPC分类号： H01L29/739 , H01L29/08
CPC分类号： H01L24/72 , H01L23/051 , H01L24/05 , H01L24/06 , H01L29/0657 , H01L29/0696 , H01L29/41741 , H01L29/66333 , H01L29/7395 , H01L2224/05552 , H01L2224/0612 , H01L2924/10156 , H01L2924/13055 , H01L2924/13091 , H01L2924/00
摘要： An IGBT device and a method for packaging a whole-wafer IGBT chip. The IGBT device comprises: an entire wafer IGBT chip (33), the upper surface thereof comprising a central gate connection zone (13) and a plurality of emitter connection zones (15, 25) surrounding the central gate connection zone (13), and the lower surface thereof comprising a collecting zone, wherein the emitter connection zones (15, 25) located on the surface of a failure cellular zone of the chip are thinned; a collector washer (32) which is fixed on the lower surface of the chip (33), and an emitter washer (34) which is fixed on the upper surface of the chip (33); a collector electrode (31) which is electrically contacted with the collector washer (32), and an emitter electrode (36) which is electrically contacted with the emitter washer (34); and a gate leading wire (37) which is connected to the central gate connection zone (13), wherein the gate leading wire (37) is insulated from the emitter washer (34) and the emitter electrode (36). The IGBT device avoids the harmful effect of the failure cellular zone in the whole-wafer chip on the performance of the IGBT device.
摘要翻译：一种IGBT器件以及封装全晶片IGBT芯片的方法。 IGBT装置包括：整个晶片IGBT芯片（33），其上表面包括中央栅极连接区域（13）和围绕中心栅极连接区域（13）的多个发射极连接区域（15,25），以及其下表面包括收集区，其中位于芯片的故障细胞区表面上的发射器连接区（15,25）变薄; 固定在所述芯片（33）的下表面的收集器垫圈（32）和固定在所述芯片（33）的上表面上的发射器垫圈（34）; 与集电垫圈（32）电接触的集电极（31）和与发射极垫圈（34）电接触的发射电极（36）。以及连接到中心栅极连接区域（13）的栅极引线（37），其中栅极引线（37）与发射极垫圈（34）和发射极电极（36）绝缘。 IGBT器件避免了全晶片芯片故障蜂窝区对IGBT器件性能的有害影响。

4. 发明公开

EP2290805A1 A SPACE VECTOR BASED SYNCHRONOUS MODULATING METHOD AND SYSTEM 有权
标题翻译： AUF EINEM RAUMVEKTOR基础同步调制系统
公开(公告)号：EP2290805A1
公开(公告)日：2011-03-02
申请号：EP09761249.3
申请日：2009-02-17
申请人： Zhuzhou CSR Times Electric Co., Ltd.
发明人： DING, Rongjun , LI, Jianghong , CHEN, Gaohua , XU, Wei , CHEN, Huaguo
IPC分类号： H02P21/00
CPC分类号： H02P27/12
摘要： A space vector based synchronous modulating method includes sampling a frequency f of a reference voltage vector; checking a relational table of frequencies and carrier wave ratios by the frequency f so as to obtain a carrier wave ratio N; obtaining a passing angle Δθ of the reference voltage vector by Δθ=2π/N; obtaining a modulating angle θm of the reference voltage vector by θm=(Nth-1)×Δθ, in which Nth indicates which time of sampling; obtaining a modulating ratio m according to a modulating ratio-frequency curve; accounting and synthesizing an output angle of three basic voltage vectors of the reference voltage vector according to the modulating angle θm and the passing angle Δθ of the reference voltage vector and the modulating ratio m; comparing a variable quantity θf of the reference voltage vector angle θ and the output angle of three basic voltage vectors, and outputting corresponding basic voltage vectors according to the comparing result; synthesizing an output voltage in accordance with the reference voltage vector by the basic voltage vectors.
摘要翻译：基于空间矢量的同步调制方法包括对参考电压矢量的频率f进行采样; 通过频率f检查频率和载波比的关系表，以获得载波比N; 通过“¸= 2 / N获得参考电压矢量的通过角”¸; 通过¸m=（Nth-1）×“¸获得参考电压矢量的调制角度¸m，其中Nth表示采样的时间; 根据调制比 - 频率曲线获得调制比m; 根据参考电压矢量和调制比m的调制角度¸m和通过角度¸计算和合成基准电压矢量的三个基本电压矢量的输出角; 将参考电压矢量角¸的可变量¸f与三个基本电压矢量的输出角进行比较，并根据比较结果输出相应的基本电压矢量; 根据基准电压矢量合成基准电压矢量的输出电压。

5. 发明授权

EP2290805B1 A SPACE VECTOR BASED SYNCHRONOUS MODULATING METHOD AND SYSTEM 有权
标题翻译：一种基于空间矢量的同步调制方法和系统
公开(公告)号：EP2290805B1
公开(公告)日：2017-05-17
申请号：EP09761249.3
申请日：2009-02-17
申请人： Zhuzhou CSR Times Electric Co., Ltd.
发明人： DING, Rongjun , LI, Jianghong , CHEN, Gaohua , XU, Wei , CHEN, Huaguo
IPC分类号： H02P21/00 , H02P27/12
CPC分类号： H02P27/12

6. 发明授权

EP3029734B1 IGBT DEVICE AND METHOD FOR PACKAGING WHOLE-WAFER IGBT CHIP 有权
公开(公告)号：EP3029734B1
公开(公告)日：2020-05-06
申请号：EP14831797.7
申请日：2014-06-16
申请人： Zhuzhou CSR Times Electric Co., Ltd.
发明人： LI, Jilu , WU, Yudong , PENG, Yongdian
IPC分类号： H01L23/051 , H01L29/739 , H01L29/08 , H01L29/417 , H01L29/66 , H01L29/06

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