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1. 发明公开

EP2507424A4 METHOD OF PROTECTING A PERSON FROM HOT HIGH HEAT CAPACITY MATERIALS AND HOT CORROSIVE MATERIALS 审中-公开
标题翻译：程序的人对热高的材料WÄRMEKAPAIZITÄT和耐热腐蚀性保护材料
公开(公告)号：EP2507424A4
公开(公告)日：2016-05-25
申请号：EP10833870
申请日：2010-11-23
申请人： CHAPMAN THERMAL PRODUCTS INC
发明人： THATCHER TYLER M
IPC分类号： D06B3/10 , D06B3/04 , D06M11/45 , D06M11/49 , D06M11/77 , D06M11/83
CPC分类号： D02G3/36 , D02G3/443 , D03D1/0041 , D03D15/12 , D06M15/277 , D06M15/643 , D06M2101/28 , D06M2200/10 , D06M2200/30 , D06N3/0002 , D06N3/128 , D10B2331/021 , D10B2401/063 , D10B2503/06 , Y10T428/2938 , Y10T442/273
摘要： Fire retardant and heat resistant yarns and fabrics include a fabric or yarn comprised of oxidized polyacrylonitrile at least partially coated or encapsulated by a strengthening polymer material that helps the fabric or yarn shed liquids, gels, sparks, and molten metals. The polymer material includes one or more types of cured silicone polymer resin. A fluorochemical may be at least partially impregnated into the fabric or yarn prior to applying the strengthening polymer material in order to further enhance the shedding properties of the yarns or fabric. In one embodiment, the silicone polymer resin only coats or encapsulates the yarn, but does not form a continuous coating over the whole fabric, so that the treated fabric is still able to breath through pores and spaces between individual yarn strands that make up the fabric. The polymer material increases the strength, abrasion resistance, durability and shedding capability of the fire retardant heat resistant yarn or fabric.
摘要翻译：阻燃和耐热的纱线和织物包括由聚丙烯腈氧化至少部分地涂覆或通过有助于加强织物或纱梭口的液体，凝胶，火花和熔融金属的聚合物材料包封的织物或纱。所述聚合物材料包括一种或多种类型的固化的有机硅聚合物树脂。甲含氟化合物可以至少部分地浸渍到织物或为了进一步提高纱线或织物的脱落特性施加加强聚合物材料之前，纱线。在一个，实施例中，有机硅聚合物树脂仅涂覆或封装纱，但不形成在整个织物的连续涂层，所以DASS模处理过的织物是静静能够一口气通过个别纱线股之间的孔和空间也构成了织物，聚合物材料的强度增加，耐磨性，耐用性和阻燃耐热纱线或织物的脱落能力。

2. 发明公开

EP1999425A4 PUMP HEADER BODY AND MODULAR MANIFOLD 审中-公开
标题翻译：泵头部壳体和模块化及其分布
公开(公告)号：EP1999425A4
公开(公告)日：2012-03-21
申请号：EP07759478
申请日：2007-03-27
申请人： SYRACUSE THERMAL PRODUCTS INC
发明人： KOENIG KEVIN J
IPC分类号： F04D15/02 , F04D29/42 , F24D3/10 , F28F13/06
CPC分类号： F04D9/008 , F04D15/029 , F04D29/426 , F24D3/1066 , F24D3/1075 , Y10S415/912

3. 发明授权

EP1264333B1 LOCALIZED HEATING AND COOLING OF SUBSTRATES 有权
标题翻译：局部性的加热，冷却SUBSTRATES
公开(公告)号：EP1264333B1
公开(公告)日：2008-03-05
申请号：EP01912062.5
申请日：2001-03-15
申请人： Mattson Thermal Products Inc.
发明人： TILLMAN, Andreas , ZERNICKEL, Dieter , SHOOSHTARIAN, Sohaila , ACHARYA, Narasimha , ELBERT, Mike
IPC分类号： H01L21/00
CPC分类号： H01L21/67109
摘要： The present invention is directed to an apparatus and process for locally heating and/or cooling of semiconductor wafers in thermal processing chambers. In particular, the apparatus of the present invention includes a device for heating or cooling localized regions of a wafer to control the temperature of such regions during one or more stages of a heat cycle. For instance, in one embodiment, gas nozzles eject gas towards the bottom of the wafer to provide localized temperature control. In another embodiment, a transparent gas pipe containing a variety of gas outlets distributes gas onto the top surface of the wafer to provide localized temperaure control.

4. 发明公开

EP1264333A2 LOCALIZED HEATING AND COOLING OF SUBSTRATES 有权
标题翻译：局部性的加热，冷却SUBSTRATES
公开(公告)号：EP1264333A2
公开(公告)日：2002-12-11
申请号：EP01912062.5
申请日：2001-03-15
申请人： Mattson Thermal Products Inc.
发明人： TILLMAN, Andreas , ZERNICKEL, Dieter , SHOOSHTARIAN, Sohaila , ACHARYA, Narasimha , ELBERT, Mike
IPC分类号： H01L21/00
CPC分类号： H01L21/67109
摘要： The present invention is directed to an apparatus and process for locally heating and/or cooling of semiconductor wafers in thermal processing chambers. In particular, the apparatus of the present invention includes a device for heating or cooling localized regions of a wafer to control the temperature of such regions during one or more stages of a heat cycle. For instance, in one embodiment, gas nozzles eject gas towards the bottom of the wafer to provide localized temperature control. In another embodiment, a transparent gas pipe containing a variety of gas outlets distributes gas onto the top surface of the wafer to provide localized temperaure control.

5. 发明授权

EP1051544B1 PROCESS CHAMBER AND METHOD FOR DEPOSITING AND/OR REMOVING MATERIAL ON A SUBSTRATE 有权
标题翻译：处理室和方法沉积和/或材料的去除上衬底
公开(公告)号：EP1051544B1
公开(公告)日：2004-04-28
申请号：EP98938314.6
申请日：1998-08-03
申请人： Mattson Thermal Products, Inc.
发明人： CHIU, Ting, H. , HOLTKAMP, William, H. , KO, Wen, C. , LOWERY, Kenneth, J. , CHO, Peter
IPC分类号： C25D5/00
CPC分类号： C25F7/00 , C25D7/123 , C25D17/001 , C25D17/02 , C25D17/12 , C25D21/00
摘要： A processing chamber for depositing and/or removing material onto/from a semiconductor wafer when the wafer is subjected to an electrolyte and in an electric field. A hollow sleeve is utilized to form a containment chamber for holding the electrolyte. A wafer residing on a support is moved vertically upward to engage the sleeve to form an enclosing floor for the containment chamber. One electrode is disposed within the containment chamber while the opposite electrode is comprised of several electrodes distributed around the circumference of the wafer. The electrodes are also protected from the electrolyte when the support is raised and engaged to the sleeve. In one embodiment, the support and the sleeve are stationary during processing, while in another embodiment, both are rotated or oscillated during processing.

6. 发明公开

EP1364397A2 HIGH TEMPERATURE SHORT TIME CURING OF LOW DIELECTRIC CONSTANT MATERIALS USING RAPID THERMAL PROCESSING TECHNIQUES 有权
标题翻译：过程与NIEDRIEGER介电常数材料的高温KURZZEITHÄRTUNG使用快速热工过程
公开(公告)号：EP1364397A2
公开(公告)日：2003-11-26
申请号：EP02715628.0
申请日：2002-01-24
申请人： Mattson Thermal Products Inc.
发明人： SHARANGPANI, Rahul , TAY, Sing-Pin
IPC分类号： H01L21/3105 , B05D3/02
CPC分类号： H01L21/02118 , H01L21/02282 , H01L21/31058 , H01L21/312 , H01L21/3122 , H01L21/3124 , H01L21/3127
摘要： A method for curing low k dielectric materials uses very short, relatively high temperature cycles instead of the conventionally used (lower temperature/longer time) thermal cycles. A substrate, such as a semiconductor wafer, coated with a layer of coating material is heated to an elevated temperature at a heating rate of greater than about 20°C per second. Once the coating material has been converted to a low dielectric constant material with desired properties, the coated substrate is cooled. Alternatively, spike heating raises and promptly lowers the temperature of the coated substrate to effect curing in one or a series of spikes heating steps. The method allows for a thinner refractory barrier metal layer thickness to prevent copper diffusion, and uses shorter curing times resulting in higher throughput.

7. 发明公开

EP1356503A2 METHOD AND SYSTEM FOR ROTATING A SEMICONDUCTOR WAFER IN PROCESSING CHAMBERS 审中-公开
标题翻译：方法和系统用于车削的半导体晶片在处理室
公开(公告)号：EP1356503A2
公开(公告)日：2003-10-29
申请号：EP02715627.2
申请日：2002-01-24
申请人： Mattson Thermal Products Inc.
发明人： KOREN, Zion , MA, Yorkman , CARDENA, Rudy, Santo, Tomas , TAOKA, James, Tsuneo , WRIDE, Lois , MC FARLAND, Craig , GIBSON, Sharon
IPC分类号： H01L21/00
CPC分类号： H01L21/68792 , B05C11/08 , C23C16/4584 , H01L21/67115
摘要： The present invention is generally directed to a system and process for rotating semiconductor wafers in thermal processing chambers, such as rapid thermal processing chambers and chemical vapor deposition chambers. In accordance with the present invention, a semiconductor wafer is supported on a substrate holder which, in turn, is supported on a rotor. During processing, the rotor is magnetically levitated and magnetically rotated by suspension actuators and rotation actuators positioned outside of the chamber.

8. 发明授权

EP0858578B1 LIQUID COOLED HEAT SINK FOR COOLING ELECTRONIC COMPONENTS 失效
标题翻译：与液冷散热模块冷却电子组件
公开(公告)号：EP0858578B1
公开(公告)日：2003-03-12
申请号：EP96936884.4
申请日：1996-10-23
申请人： Aavid Thermal Products, Inc.
发明人： LAVOCHKIN, Ronald, B.
IPC分类号： F28F3/12 , F28F7/00 , H01L23/473
CPC分类号： H01L25/117 , F28F1/22 , F28F2275/025 , H01L23/473 , H01L2924/0002 , Y10T29/49364 , H01L2924/00

9. 发明公开

EP1240666A2 GROWTH OF ULTRATHIN NITRIDE ON Si(100) BY RAPID THERMAL N 2? TREATMENT 审中-公开
标题翻译： GROWTH ULTRA THIN NITRIDE在Si（100）通过用N 2快速热处理
公开(公告)号：EP1240666A2
公开(公告)日：2002-09-18
申请号：EP00990357.6
申请日：2000-12-21
申请人： Mattson Thermal Products Inc.
发明人： LU, Zhenghong , TAY, Sing, Pin
IPC分类号： H01L21/31
CPC分类号： H01L21/28202 , H01L21/3144 , H01L21/3185 , H01L29/513 , H01L29/518
摘要： A silicon containing wafer (110) is heated in a rapid thermal processing (RTP) system (160) in a nitrogen containing gas to a temperature and a time where a thin oxide film on the wafer surface at least partially decomposes and a thin nitride or oxynitride film grows.

10. 发明公开

EP1009960A4 HYDRATION AND FREEZING PLANT FOR FLEXIBLE REFRIGERANT MEDIA 失效
标题翻译： WÄSSERUNGS-UND GEFRIERANLAGEFÜRBIEGSAMEKÄTTETRÄGER
公开(公告)号：EP1009960A4
公开(公告)日：2000-10-04
申请号：EP98934421
申请日：1998-07-10
申请人： THERMAL PRODUCTS INC
发明人： MURRAY JOSEPH C , GAUDE LYMAN E
IPC分类号： F25D3/00 , F25D13/06 , F25D25/04 , F28D20/02 , F25D17/02
CPC分类号： F25D25/04 , F25D13/06 , F25D13/065 , F25D13/067
摘要： Apparatus for preparing packaging materials for use in shipment of heat sensitive materials, utilizes a hydration module (11), a freezing module (40), and a delivery module (45). Rolls of superabsorbent polymer-based refrigerant media (117) in the form of a continuous web of a selected length and width are maintained in dry storage. These may be cut to size along the web material which separates cells containing the superabsorbent polymer. The web or pad is advanced into the hydration module (11) which comprises a dip tank (17) or spray system (26) to provide an adequate supply of hydrating fluid to the superabsorbent polymer. The hydrated web is then conveyed through a freezing chamber (40) having a temperature of -10 DEG Fahrenheit, or lower, where the fluid absorbed within the cells freezes. The small footprint of the modular system means that necessary handling, including cutting into a suitable size and shape, may be accomplished in the consumer's shipping area for placement around perishable materials in shipping containers.
摘要翻译：用于制备用于运输热敏材料的包装材料的设备利用水合模块（11），冷冻模块（40）和输送模块（45）。以选定长度和宽度的连续卷材形式的基于超吸收性聚合物的制冷剂介质（117）的卷保持干燥储存。这些可以沿着分离含有超吸收性聚合物的细胞的网状材料被切割成适当尺寸。该网或衬垫被推进到包括浸渍罐（17）或喷雾系统（26）的水合模块（11）中，以向超吸收性聚合物提供充足的水合流体供应。然后将水合纤维网输送通过温度为-10华氏度或更低的冷冻室（40），其中细胞内吸收的流体冻结。模块化系统的占地面积小意味着可以在消费者的运输区域完成必要的处理，包括切割成合适的尺寸和形状，以便将易腐物质放置在集装箱内。

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