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1. 发明公开

EP1926351A1 Driving circuit of surface light source and method of driving the same 有权
标题翻译： Treiberschaltung einerOberflächenlichtquelleund Verfahren zu deren Ansteuerung
公开(公告)号：EP1926351A1
公开(公告)日：2008-05-28
申请号：EP07110163.8
申请日：2007-06-13
申请人： Mirae Corporation
发明人： Hur, Jeong Wook , Lee, Hwan Woong
IPC分类号： H05B41/00
CPC分类号： H05B41/386
摘要： A driving circuit of a surface light source and a method of driving the same are disclosed, which is suitable for decreasing the luminance-stabilization period of time and improving the low-temperature starting properties by optimizing a starting voltage and current, the driving circuit comprising an inverter controller which feedbacks a current supplied to the surface light source, and compares the feedback current to a preset reference value, to control the current supplied to the surface light source; a temperature sensor which senses an operation temperature of the surface light source; and a driving-condition determining controller which determines operation modes of the surface light source on the basis of the temperature sensed in the temperature sensor, and varies the feedback current inputted to the inverter controller according to the operation modes of the surface light source.
摘要翻译：公开了一种面光源的驱动电路及其驱动方法，其适用于通过优化起动电压和电流来降低亮度稳定时间段并提高低温启动特性，所述驱动电路包括逆变器控制器，其反馈提供给所述表面光源的电流，并将所述反馈电流与预设的参考值进行比较，以控制提供给所述表面光源的电流; 感测表面光源的操作温度的温度传感器; 以及驱动条件确定控制器，其基于在温度传感器中感测的温度来确定面光源的操作模式，并且根据面光源的操作模式改变输入到逆变器控制器的反馈电流。

2. 发明公开

EP0997741A2 Carrier for an integrated circuit module handler 审中-公开
标题翻译： Trägeranordnungfüreine HandhabungsvorrichtungfürModule von integrierten Schaltungen
公开(公告)号：EP0997741A2
公开(公告)日：2000-05-03
申请号：EP99120888.5
申请日：1999-10-28
申请人： Mirae Corporation
发明人： Lee, Sang Song , Lee, Wan Gu , Kim, Jong Won , Kim, Hee Soo , Oh, Young Hak , Lee, Dong Chun
IPC分类号： G01R31/316
CPC分类号： G01R31/2867 , G01R1/04 , G01R31/2851 , G01R31/2893 , Y10T29/5313 , Y10T29/53174 , Y10T29/53178 , Y10T29/53261 , Y10T29/53265
摘要： A chamber for a module IC handler is disclosed which consists of a pre-heater for suitably heating a carrier containing a plurality of module IC at a preset temperature (which may be generated at the driving of the module IC) before the tests for the module IC are performed, and a test site for performing the tests with a external tester while pushing the carrier by using the pusher. The chamber consists of: a seating piece on which plural seating grooves are formed that place the carrier containing the module ICs thereon; a driving piece which is retractable and movable upward/downward, and on which a seating groove having the same spacing as that of the seating groove formed in the seating piece is formed; driving piece ascending/descending means for elevating/lowering the driving piece above a top surface of the seating piece relative to a top surface of the driving piece; driving piece advancing/retracting means for advancing/retracing the driving piece by one pitch corresponding to a spacing between the seating grooves formed in the seating piece; and transferring means for holding and transferring the carrier, which has the module IC heated in accordance with the tests conditions, positioned on a transfer path of the test site toward the test site.
摘要翻译：公开了一种用于模块IC处理器的室，其包括预热器，用于在模块的测试之前适当地加热包含多个模块IC的载体，该预定温度在预设温度（可在模块IC的驱动下产生）执行IC，以及用外部测试器进行测试的测试位置，同时通过使用推动器推动载体。该室由以下部件组成：座件，其上形成有多个座槽，将包含模块IC的载体放置在其上; 形成有能够向上/向下伸缩并可移动的驱动件，并且其上形成有与形成在所述座件中的所述安置槽相同间隔的安置槽; 驱动件上升/下降装置，用于相对于所述驱动件的顶表面在所述就座件的顶表面上升/降下所述驱动件; 驱动件前进/后退装置，用于使驱动件前进/后退一个间距，对应于形成在座件中的座槽之间的间距; 以及传送装置，用于保持和传送位于测试场所的传送路径上的测试场所的具有根据测试条件加热的模块IC的载体。

3. 发明公开

EP0957445A2 A contact light emitting device, a method of manufacturing thereof and a contact input apparatus using thereof 有权
标题翻译：响应于接触的发光器件，其制备方法，以及它们的使用在触摸输入设备
公开(公告)号：EP0957445A2
公开(公告)日：1999-11-17
申请号：EP99109642.1
申请日：1999-05-14
申请人： Mirae Corporation
发明人： Lee, Ju Hyun , Vlaskin, Vladimir , Ryu, Young Kee
IPC分类号： G06K9/20 , H05B33/12 , A61B5/117 , G06K11/00
CPC分类号： G06K9/0004 , A61B5/1172 , G06K9/00013 , H01L31/165
摘要： A contact light emitting device comprises a transparent electrode layer (2) connected to an alternating current power source terminal, a luminescence layer (3) for generating a photo-image such as a surface pattern of a contact surface (10a) by an electric field and formed between the transparent electrode layer (2) and a contacted object (10) which acts as a ground, and a transparent insulating layer (1) for penetrating the photo-image and formed under the transparent electrode (2).
摘要翻译：接触发光器件在交流电源端子，发光层包括连接到透明电极层（2）（3），用于生成光图像：例如通过在电场的接触面（10A）的表面图案和透明电极层（2）和一个接触对象（10），其作用作为接地，且用于穿透所述光图像的透明绝缘层（1）之间形成，并且透明电极下形成的（2）。

4. 发明公开

EP1903850A2 Picker and head assembly with the pickers 审中-公开
标题翻译： Greifer und Kopfanordnung mit dem Greifer
公开(公告)号：EP1903850A2
公开(公告)日：2008-03-26
申请号：EP07116688.8
申请日：2007-09-18
申请人： Mirae Corporation
发明人： Ahn, Jung-ug , Kim, Sun-hwal , Choi, Wan-hee , Hur, Jung
IPC分类号： H05K13/04
CPC分类号： H05K13/0408
摘要： Provided is a picker for transferring packaged chips, including a picker base, a base block fixably connected to the picker base, a plurality of nozzle assemblies, provided to the base block, each nozzle assembly being movable up and down, and having a nozzle which a packaged chip is held against or released from by air pressure, an air pressure supplying unit supplying negative or positive pressure by which the packaged chip is held against or released from the nozzle, a plurality of first mechanisms, through each of which the negative or positive pressure is supplied to the nozzle; and a plurality of second mechanisms, each of which moves up and down each of nozzle assemblies.
摘要翻译：提供了一种用于传送包装芯片的拾取器，包括拾取器基座，可固定地连接到拾取器基座的基座，设置在基座上的多个喷嘴组件，每个喷嘴组件可上下移动，并且具有喷嘴一个封装的芯片被保持在空气压力下或从空气压力中释放;一个空气压力供应单元，提供负压或正压，通过该压力供应封装的芯片被保持抵靠或从喷嘴释放;多个第一机构，向喷嘴供给正压; 以及多个第二机构，每个机构每个喷嘴组件都上下移动。

5. 发明公开

EP1752778A2 IC Sorter 审中-公开
标题翻译： IC-Sortierer
公开(公告)号：EP1752778A2
公开(公告)日：2007-02-14
申请号：EP06117699.6
申请日：2006-07-21
申请人： Mirae Corporation
发明人： Kim, Byoung-woo , Seo, Yong-jin
IPC分类号： G01R31/28
CPC分类号： B07C5/344 , G01R31/2893
摘要： Provided are an IC sorter, a method for sorting a burn-in IC, an IC sorted using the method. The IC sorter according to one embodiment of the present invention includes a board table onto which a burn-in board is loaded, a tray loader and a tray unloader which are spaced from the board table in a first axis direction and extended parallel to each other in a second axis direction, a DC test buffer and unloading buffer which are spaced from the board table in a second axis direction with a working area of the board table in between, a sorting unit spaced from the board table, having at least one DC failure tray receiving ICs which fail a DC test and at least one sorting tray, a DC failure/loading head movable at least among a working location of the tray loader, the DC test buffer and a DC failure tray of the sorting unit, a unloading head movable at least among a working location of the tray unloader and the unloading buffer, a sorting head movable at least among the unloading buffer and the sorting tray of the sorting unit; and an insertion/removal head movable at least among the DC test buffer, the working area of the board table, and the unloading buffer.
摘要翻译：提供了一种IC分拣机，用于分拣老化IC的方法，使用该方法排序的IC。根据本发明的一个实施例的IC分拣机包括一个装载有老化板的板台，一个托盘装载器和一个托盘卸载器，它们在第一轴线方向上与板台隔开并且彼此平行延伸在第二轴方向上，DC测试缓冲器和卸载缓冲器，其在第二轴线方向上与所述板台间隔开，其中所述板台的工作区域在其间，与所述板台间隔开的分拣单元，具有至少一个DC 故障托盘接收不通过直流测试的IC和至少一个分类托盘，至少在托盘加载器的工作位置，DC测试缓冲器和分类单元的DC故障托盘之间移动的DC故障/加载头，卸载至少在所述托盘卸载机的工作位置和所述卸载缓冲器之间移动的头部，至少在所述分拣单元的卸载缓冲器和分拣托盘之间移动的分拣头; 以及至少在DC测试缓冲器，板表的工作区域和卸载缓冲器之间可移动的插入/移除头。

6. 发明公开

EP0995998A3 Chamber for an IC module handler 有权
标题翻译：室，用于对IC模块的操作装置
公开(公告)号：EP0995998A3
公开(公告)日：2001-03-07
申请号：EP99120694.7
申请日：1999-10-19
申请人： Mirae Corporation
发明人： An, Tae Sung , Park, Chan Ho , Moon, Yong Soo , Seong, Eun Hyoung , Kim, Ku Kyong
IPC分类号： G01R31/316 , G01R31/28
CPC分类号： G01R31/2862
摘要： The present invention relates to an improved chamber for a module IC handler including a pre-heater for appropriately heating at a set temperature, that is, a generated temperature while a carrier served with a plurality of module ICs is moved, and a test site for enabling an outside tester to test by being pushed the carrier by a pusher. The present invention provides a chamber for a module IC handler including: a receiving piece installed at the lower plate of a chamber and formed with a plurality of receiving grooves at the upper surface thereof for being placed a carrier served with a module IC; an operating piece disposed in a predetermined portion of the receiving piece, disposed at the lowest point thereof in the upper surface of the receiving piece and formed at the upper surface thereof with a receiving groove same interval to the receiving groove of the receiving piece for performing up/down movement and advance/retreat movement; operating piece up/down movement means for going up/down the operating piece to be higher the upper surface thereof than the upper surface of the receiving piece; operating piece advance/retreat movement means for advancing/retreating the operating piece by one pitch same to the interval between the receiving grooves; and feeding means for holding the carrier on the feeding path served with the module IC heated at the test condition and for feeding toward the test site.

7. 发明公开

EP1903850A3 Picker and head assembly with the pickers 审中-公开
标题翻译：夹持器和夹持器头部组件，具有
公开(公告)号：EP1903850A3
公开(公告)日：2010-01-06
申请号：EP07116688.8
申请日：2007-09-18
申请人： Mirae Corporation
发明人： Ahn, Jung-ug , Kim, Sun-hwal , Choi, Wan-hee , Hur, Jung
IPC分类号： H05K13/04
CPC分类号： H05K13/0408
摘要： Provided is a picker for transferring packaged chips, including a picker base, a base block fixably connected to the picker base, a plurality of nozzle assemblies, provided to the base block, each nozzle assembly being movable up and down, and having a nozzle which a packaged chip is held against or released from by air pressure, an air pressure supplying unit supplying negative or positive pressure by which the packaged chip is held against or released from the nozzle, a plurality of first mechanisms, through each of which the negative or positive pressure is supplied to the nozzle; and a plurality of second mechanisms, each of which moves up and down each of nozzle assemblies.

8. 发明公开

EP1903344A1 Pushing block and a handler with the pushing block 审中-公开
标题翻译： Schiebeblock und Handhabungsvorrichtung mit dem Schiebeblock
公开(公告)号：EP1903344A1
公开(公告)日：2008-03-26
申请号：EP07116691.2
申请日：2007-09-18
申请人： Mirae Corporation
发明人： Ahn, Jung-ug , Kim, Sun-hwal , Choi, Wan-hee , Hur, Jung
IPC分类号： G01R31/28
CPC分类号： G01R31/2893
摘要： Provided is a pushing block for use in a handle and a handler equipped with the pushing block. The pushing block includes pushing pins, provided under the test tray, each pushing the latch upwards from under the test tray to enable the latch to release the packaged chip, a first plate on which the pushing pins are provided, and an assembly changing horizontal motion into vertical motion to move the first plate vertically. Positioning of the pushing block under the test tray prevents interference between the pushing block and the picker during loading and unloading and makes it convenient to take corrective action when malfunction of the picker occurs.
摘要翻译：提供了一种用于手柄的推动块和装备有推动块的操纵器。推动块包括设置在测试托盘下方的推动销，每个推动销从测试托盘下方向上推动闩锁，以使闩锁能够释放封装的芯片，其上设置有推动销的第一板，以及改变水平运动的组件垂直运动以垂直移动第一板。推动块在测试托盘下的定位可以防止在装载和卸载过程中推动块和拾取器之间的干扰，并且在拾取器发生故障时便于采取纠正措施。

9. 发明公开

EP1868003A1 Burn-in sorter and sorting method using the same 审中-公开
标题翻译： Burnie-Sortierer und diesen verendendes Sortierverfahren
公开(公告)号：EP1868003A1
公开(公告)日：2007-12-19
申请号：EP07109857.8
申请日：2007-06-08
申请人： Mirae Corporation
发明人： Kim, Byoung Woo
IPC分类号： G01R31/28 , B07C5/344 , H01L21/00
CPC分类号： B07C5/344 , G01R31/2868 , G01R31/2893 , H01L21/67271
摘要： Provided is an apparatus for sorting burn-in tested packaged chips, including a DC test unit (110) performing a DC test on packaged chips, a DC failure/loading head (152) moving in a first direction to load packaged chips onto the DC test unit, and an inserting head (154) moving in a second direction perpendicular to the first direction to transfer DC test-passed packaged chips from the DC test unit to a burn-in board (104), wherein the DC test unit is moved in the second direction, close to the DC failure/loading head when loading the packaged chips onto the DC test unit and close to the inserting head when transferring the packaged chips to the burn-in board, to sort burn-in tested packaged chips. The structure in which the DC test unit is movable toward the DC failure/loading head and the inserting head makes it possible to reduce the distance which the heads have to travel and to prevent the DC failure/loading head and the inserting head from interfering with each other.
摘要翻译：本发明提供一种用于分类老化测试封装芯片的装置，包括对封装芯片执行直流测试的DC测试单元（110），沿第一方向移动的DC故障/加载头（152），以将封装芯片加载到DC 测试单元和沿垂直于第一方向的第二方向移动的插入头（154），以将直流测试通过的封装芯片从直流测试单元传送到老化板（104），其中直流测试单元移动在将封装的芯片装载到烧录板上时，将封装的芯片装载到DC测试单元上并靠近插入头，在第二个方向上接近DC故障/加载头，对烧录的测试封装芯片进行分类。 DC测试单元可以朝向DC故障/加载头和插入头移动的结构使得可以减少头部必须行进的距离，并且防止DC故障/加载头和插入头干扰彼此。

10. 发明公开

EP1860448A2 Handler for sorting packaged chips 审中-公开
标题翻译： Gerätzur Sortierung verpackter芯片
公开(公告)号：EP1860448A2
公开(公告)日：2007-11-28
申请号：EP07106159.2
申请日：2007-04-13
申请人： Mirae Corporation
发明人： Kim, Jong Tae
IPC分类号： G01R31/28
CPC分类号： G01R31/2867 , G01R31/2893
摘要： Provided is a handler for sorting packaged chips, including a main body (1), a loading unit (3) which is provided on one side of the main body (1), and where a tray containing packaged chips subject to a burn-in test waits, a burn-in board (B) containing burn-in tested packaged chips, movable working space of the main body (1), an unloading unit where a tray bound to contain burn-in tested packaged chips from a burn-in board (B) waits, a sorting unit containing bad packaged chips picked up from the burin-in board (B); and a tray-transferring unit removing packaged chips remaining in a tray from the tray while transferring the tray from the loading unit to the unloading unit. The present invention provides an advantage of turning a tray upside down during transfer of the tray from the loading unit to the unloading unit to remove packaged chips remaining in the tray for the tray.
摘要翻译：提供一种用于分类包装芯片的处理机，包括主体（1），设置在主体（1）的一侧上的装载单元（3），以及包含经受老化的封装芯片的托盘测试等待，包含老化测试包装芯片的老化板（B），主体（1）的可移动工作空间，卸载单元，其中托盘包含从老化的老化测试的封装芯片董事会（B）等待，一个分类单位，包含从投机板（B）拾取的坏包装芯片; 以及托盘传送单元，其将托盘从装载单元传送到卸载单元的同时，从纸盘中移除残留在托盘中的包装芯片。本发明提供了在将托盘从装载单元转移到卸载单元的同时将托盘倒置的方法，以去除留在用于托盘的托盘中的包装的碎屑。

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