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1. 发明公开

EP0995998A3 Chamber for an IC module handler 有权
标题翻译：室，用于对IC模块的操作装置
公开(公告)号：EP0995998A3
公开(公告)日：2001-03-07
申请号：EP99120694.7
申请日：1999-10-19
申请人： Mirae Corporation
发明人： An, Tae Sung , Park, Chan Ho , Moon, Yong Soo , Seong, Eun Hyoung , Kim, Ku Kyong
IPC分类号： G01R31/316 , G01R31/28
CPC分类号： G01R31/2862
摘要： The present invention relates to an improved chamber for a module IC handler including a pre-heater for appropriately heating at a set temperature, that is, a generated temperature while a carrier served with a plurality of module ICs is moved, and a test site for enabling an outside tester to test by being pushed the carrier by a pusher. The present invention provides a chamber for a module IC handler including: a receiving piece installed at the lower plate of a chamber and formed with a plurality of receiving grooves at the upper surface thereof for being placed a carrier served with a module IC; an operating piece disposed in a predetermined portion of the receiving piece, disposed at the lowest point thereof in the upper surface of the receiving piece and formed at the upper surface thereof with a receiving groove same interval to the receiving groove of the receiving piece for performing up/down movement and advance/retreat movement; operating piece up/down movement means for going up/down the operating piece to be higher the upper surface thereof than the upper surface of the receiving piece; operating piece advance/retreat movement means for advancing/retreating the operating piece by one pitch same to the interval between the receiving grooves; and feeding means for holding the carrier on the feeding path served with the module IC heated at the test condition and for feeding toward the test site.

2. 发明授权

EP0995998B1 Chamber for an IC module handler 有权
标题翻译：室，用于对IC模块的操作装置
公开(公告)号：EP0995998B1
公开(公告)日：2006-07-19
申请号：EP99120694.7
申请日：1999-10-19
申请人： Mirae Corporation
发明人： An, Tae Sung , Park, Chan Ho , Moon, Yong Soo , Seong, Eun Hyoung , Kim, Ku Kyong
IPC分类号： G01R31/316 , G01R31/28
CPC分类号： G01R31/2862

3. 发明公开

EP0995998A2 Chamber for an IC module handler 有权
标题翻译： Kammerfüreine Handhabungsvorrichtungfürein IC-Modul
公开(公告)号：EP0995998A2
公开(公告)日：2000-04-26
申请号：EP99120694.7
申请日：1999-10-19
申请人： Mirae Corporation
发明人： An, Tae Sung , Park, Chan Ho , Moon, Yong Soo , Seong, Eun Hyoung , Kim, Ku Kyong
IPC分类号： G01R31/316
CPC分类号： G01R31/2862
摘要： The present invention relates to an improved chamber for a module IC handler including a pre-heater for appropriately heating at a set temperature, that is, a generated temperature while a carrier served with a plurality of module ICs is moved, and a test site for enabling an outside tester to test by being pushed the carrier by a pusher. The present invention provides a chamber for a module IC handler including: a receiving piece installed at the lower plate of a chamber and formed with a plurality of receiving grooves at the upper surface thereof for being placed a carrier served with a module IC; an operating piece disposed in a predetermined portion of the receiving piece, disposed at the lowest point thereof in the upper surface of the receiving piece and formed at the upper surface thereof with a receiving groove same interval to the receiving groove of the receiving piece for performing up/down movement and advance/retreat movement; operating piece up/down movement means for going up/down the operating piece to be higher the upper surface thereof than the upper surface of the receiving piece; operating piece advance/retreat movement means for advancing/retreating the operating piece by one pitch same to the interval between the receiving grooves; and feeding means for holding the carrier on the feeding path served with the module IC heated at the test condition and for feeding toward the test site.
摘要翻译：本发明涉及一种用于模块IC处理器的改进室，其包括用于在设定温度下进行适当加热的预热器，即，在与多个模块IC一起使用的载体移动时产生的温度，以及用于使外部测试仪能够通过推动器推动载体进行测试。本发明提供了一种用于模块IC处理器的室，包括：容纳件，安装在室的下板处，并在其上表面形成有多个接收槽，用于放置一个载有模块IC的载体; 设置在接收片的预定部分中的操作件，设置在接收片的上表面的最低点处，并在其上表面处形成与接收片的接收槽相同的间隔的接收槽，用于执行上下移动和前进/后退运动; 操作件上/下移动装置，用于使操作件上/下操作成高于其接收件的上表面的上表面; 操作件前进/后退移动装置，用于使操作件前进/后退一个间距到接收槽之间的间隔; 以及供给装置，用于将载体保持在与在试验状态下加热的模块IC一起供给的进给路径上，并且朝向试验部位供给。

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