专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

EP2770005B1 EPOXY RESIN COMPOSITION AND HIGH FREQUENCY ELECTRONIC-CIRCUIT SUBSTRATE MANUFACTURED BY USING THE SAME 有权
公开(公告)号：EP2770005B1
公开(公告)日：2019-05-08
申请号：EP11874396.2
申请日：2011-10-18
申请人： Guangdong Shengyi Sci. Tech Co., Ltd
发明人： ZENG, Xianping
IPC分类号： C08G59/32 , C08G59/42 , C08L63/00 , H05K1/03

2. 发明授权

EP2657295B1 HALOGEN-FREE HIGH-TG RESIN COMPOSITION AND PREPREG AND LAMINATE FABRICATED BY USING THE SAME 有权
标题翻译：无卤素高TG树脂组合物及使用该组合物制备的预浸料和层压板
公开(公告)号：EP2657295B1
公开(公告)日：2018-01-03
申请号：EP11850217.8
申请日：2011-09-03
申请人： Guangdong Shengyi Sci. Tech Co., Ltd
发明人： SU, Shiguo , HE, Yueshan
IPC分类号： C08L63/00 , C08L79/08 , C08L79/04 , C08L63/02 , C08L63/04 , C08G59/40 , C08J5/24 , C08K5/521 , C08K5/5399 , B32B27/04 , H05K1/03
CPC分类号： C08L79/04 , B32B5/022 , B32B5/26 , B32B15/14 , B32B15/20 , B32B2260/023 , B32B2260/04 , B32B2260/046 , B32B2307/204 , B32B2307/3065 , C08G73/0655 , C08J5/24 , C08J2379/04 , C08J2379/08 , C08K5/353 , C08K5/521 , C08K5/5399 , C08L63/00 , C08L79/085 , H05K1/0353 , H05K2201/012 , Y10T428/31511 , Y10T442/20
摘要： The present invention relate to a halogen-free high-Tg resin composition and a prepreg and a laminate fabricated by using the same. The composition comprises, based on parts by weight of organic solids: (A) 10-50 parts by weight of a cyanate ester resin; (B) at least one compound having a dihydrobenzoxazine ring; (C) 10-50 parts by weight of at least one bismaleimide resin; (D) 10-50 parts by weight of at least one polyepoxy compound; and (E) 5-30 parts by weight of at least one phosphorus-containing flame retardant. The halogen-free high-Tg resin composition has the performance of low water absorption, low CTE, high Tg, and good dielectric properties, and a prepreg and a laminate fabricated by using the same has the characteristics of a high glass transition temperature, a low CTE, a low dielectric constant, a low water absorption, and a high heat resistance, and thus being applicable to a multi-layer circuit board

3. 发明公开

EP2291061A3 Composite material, high frequency circuit substrate made therefrom and making method thereof 有权
标题翻译：复合材料，由其制成的高频电路基板及其制造方法
公开(公告)号：EP2291061A3
公开(公告)日：2011-11-16
申请号：EP10152475.9
申请日：2010-02-03
申请人： Guangdong Shengyi Sci. Tech Co., Ltd.
发明人： Su, Min She
IPC分类号： C08J5/24 , H05K1/03 , C08L25/18 , C08L9/06
CPC分类号： C08J5/24 , C08F212/08 , C08F212/14 , C08F212/34 , C08J2309/00 , C08J2309/06 , C08J2325/18 , C08J2353/02 , C08K3/013 , C08K3/40 , C08K5/0066 , C08K5/14 , C08K7/14 , C08L9/06 , C08L25/18 , H05K1/032 , H05K1/0366 , H05K1/0373 , H05K2201/012 , H05K2201/0158 , H05K2201/0209 , Y10T428/31533 , Y10T428/31544 , Y10T428/31547 , Y10T428/31645 , Y10T442/2992 , C08L2666/06 , C08L2666/04
摘要： The present invention relates to a composite material, a high-frequency circuit substrate made therefrom and making method thereof. The composite material comprises 20-70 parts by weight of thermosetting mixture, a fiberglass cloth, a powder filler, a flame retardant, and a cure initiator. The thermosetting mixture includes a resin containing vinyl in the amount of more than 60% composed of carbon and hydrogen with its molecular weight being less than 11000, and a solid styryl resin of middle or low molecular weight with unsaturated double bonds. The made high-frequency circuit substrate comprises a plurality of prepregs mutually overlapped, and copper foils respectively covered on both sides of overlapped prepregs. Each prepreg is made from the composite material. The composite material of the present invention enable to readily make prepregs. The high-frequency circuit substrate made from the composite material has low dielectric constant, low dielectric loss tangent, and good heat resistance, and is convenient for process operation. Therefore, the composite material of the present invention is suitable for making circuit substrates of high-frequency electronic equipments.
摘要翻译：本发明涉及复合材料，由其制成的高频电路基板及其制造方法。该复合材料包含20-70重量份的热固性混合物，玻璃纤维布，粉末填料，阻燃剂和固化引发剂。热固性混合物包括含有超过60％的由碳和氢构成的分子量小于11000的乙烯基树脂和具有不饱和双键的中等或低分子量的固体苯乙烯基树脂。所制成的高频电路基板包括多个相互重叠的预浸料坯，并且铜箔分别覆盖在交叠的预浸料坯的两侧。每种预浸料都由复合材料制成。本发明的复合材料能够容易地制造预浸料坯。由复合材料制成的高频电路基板介电常数低，介电损耗角正切小，耐热性好，便于工艺操作。因此，本发明的复合材料适用于制造高频电子设备的电路基板。

4. 发明公开

EP2770005A1 EPOXY RESIN COMPOSITION AND HIGH FREQUENCY ELECTRONIC-CIRCUIT SUBSTRATE MANUFACTURED BY USING THE SAME 审中-公开
标题翻译：环氧和电气泗射频电路的THAT制的基板
公开(公告)号：EP2770005A1
公开(公告)日：2014-08-27
申请号：EP11874396.2
申请日：2011-10-18
申请人： Guangdong Shengyi Sci. Tech Co., Ltd
发明人： ZENG, Xianping
IPC分类号： C08G59/32 , C08G59/42 , C08L63/00 , H05K1/03
CPC分类号： H05K1/0353 , C08G59/3218 , C08G59/4014 , C08G59/4215 , C08G59/4223 , C08J5/24 , C08J2363/00 , C08L63/00 , C08L63/04 , C08L2201/02 , C08L2203/20 , H05K1/024 , H05K1/0346 , H05K1/0373 , H05K2201/012 , Y10T428/31522 , C08L67/02 , C08L67/00 , C08L79/04
摘要： Disclosed are an epoxy resin composition and a high frequency circuit board manufactured by using the same, and the epoxy resin composition comprises the following solid components: (A) a cyanate compound having at least two cyanoxy groups or its pre-polymer, (B) an active ester, and (C) an epoxy resin containing a naphthol structure. The total amount of the component (A) a cyanate compound having at least two cyanoxy groups or its pre-polymer and the component (B) an active ester is 10-70 parts by weight, and the amount of component (C) an epoxy resin containing a naphthol structure is 30-90 parts by weight, based on the parts by weight of these solid components, wherein the weight ratio of the component (A) a cyanate compound having at least two cyanoxy groups or its pre-polymer to the component (B) an active ester is 0.2-5 to 1. The high frequency circuit board manufactured by using the epoxy resin composition comprises multiple layers of laminated semi-cured sheets and copper foils press-bonded on both sides of them, and each of the multiple layers of laminated semi-cured sheets comprises a substrate and the epoxy resin composition attached on it by impregnating and drying.

5. 发明授权

EP2291061B1 Composite material, high frequency circuit substrate made therefrom and making method thereof 有权
标题翻译：由此其高频布线基板及其制造方法制备的复合材料
公开(公告)号：EP2291061B1
公开(公告)日：2014-05-07
申请号：EP10152475.9
申请日：2010-02-03
申请人： Guangdong Shengyi Sci. Tech Co., Ltd.
发明人： Su, Min She
IPC分类号： C08J5/24 , H05K1/03 , C08L25/18 , C08L9/06
CPC分类号： C08J5/24 , C08F212/08 , C08F212/14 , C08F212/34 , C08J2309/00 , C08J2309/06 , C08J2325/18 , C08J2353/02 , C08K3/013 , C08K3/40 , C08K5/0066 , C08K5/14 , C08K7/14 , C08L9/06 , C08L25/18 , H05K1/032 , H05K1/0366 , H05K1/0373 , H05K2201/012 , H05K2201/0158 , H05K2201/0209 , Y10T428/31533 , Y10T428/31544 , Y10T428/31547 , Y10T428/31645 , Y10T442/2992 , C08L2666/06 , C08L2666/04
摘要： The present invention relates to a composite material, a high-frequency circuit substrate made therefrom and making method thereof. The composite material comprises 20-70 parts by weight of thermosetting mixture, a fiberglass cloth, a powder filler, a flame retardant, and a cure initiator. The thermosetting mixture includes a resin containing vinyl in the amount of more than 60% composed of carbon and hydrogen with its molecular weight being less than 11000, and a solid styryl resin of middle or low molecular weight with unsaturated double bonds. The made high-frequency circuit substrate comprises a plurality of prepregs mutually overlapped, and copper foils respectively covered on both sides of overlapped prepregs. Each prepreg is made from the composite material. The composite material of the present invention enable to readily make prepregs. The high-frequency circuit substrate made from the composite material has low dielectric constant, low dielectric loss tangent, and good heat resistance, and is convenient for process operation. Therefore, the composite material of the present invention is suitable for making circuit substrates of high-frequency electronic equipments.

6. 发明公开

EP2657295A1 HALOGEN-FREE HIGH-TG RESIN COMPOSITION AND PREPREG AND LAMINATE FABRICATED BY USING THE SAME 有权
标题翻译：具有高TG和物品无卤素树脂组合物构成预浸料和制品MANUFACTURED层压
公开(公告)号：EP2657295A1
公开(公告)日：2013-10-30
申请号：EP11850217.8
申请日：2011-09-03
申请人： Guangdong Shengyi Sci. Tech Co., Ltd
发明人： SU, Shiguo , HE, Yueshan
IPC分类号： C08L63/00 , C08L79/08 , C08L79/04 , C08L63/02 , C08L63/04 , C08G59/40 , C08J5/24 , C08K5/521 , C08K5/5399 , B32B27/04 , H05K1/03
CPC分类号： C08L79/04 , B32B5/022 , B32B5/26 , B32B15/14 , B32B15/20 , B32B2260/023 , B32B2260/04 , B32B2260/046 , B32B2307/204 , B32B2307/3065 , C08G73/0655 , C08J5/24 , C08J2379/04 , C08J2379/08 , C08K5/353 , C08K5/521 , C08K5/5399 , C08L63/00 , C08L79/085 , H05K1/0353 , H05K2201/012 , Y10T428/31511 , Y10T442/20
摘要： The present invention relate to a halogen-free high-Tg resin composition and a prepreg and a laminate fabricated by using the same. The composition comprises, based on parts by weight of organic solids: (A) 10-50 parts by weight of a cyanate ester resin; (B) at least one compound having a dihydrobenzoxazine ring; (C) 10-50 parts by weight of at least one bismaleimide resin; (D) 10-50 parts by weight of at least one polyepoxy compound; and (E) 5-30 parts by weight of at least one phosphorus-containing flame retardant. The halogen-free high-Tg resin composition has the performance of low water absorption, low CTE, high Tg, and good dielectric properties, and a prepreg and a laminate fabricated by using the same has the characteristics of a high glass transition temperature, a low CTE, a low dielectric constant, a low water absorption, and a high heat resistance, and thus being applicable to a multi-layer circuit board
摘要翻译：本发明涉及一种不含卤素的高Tg树脂组合物和预浸料坯及通过使用相同的制造的叠层体。该组合物包含，基于1重量份的有机固体部分：（A）10至50重量份的氰酸酯树脂; （B）具有二氢苯并恶嗪环的至少一种化合物; （C）10-50重量份的至少一种双马来酰亚胺树脂; （D）10至50份重量的至少一种聚环氧化合物; 和（E）5-30重量份的至少一种含磷阻燃剂。无卤高Tg树脂组合物具有低吸水性，低CTE，高Tg和良好的介电性能的性能，并且预浸料坯及通过使用相同的制造的层压板具有高的玻璃化转变温度的特性，一低CTE，低介电常数，低吸水性，以及高耐热性，因此是适用于多层电路板

7. 发明公开

EP2595460A1 COMPOSITE MATERIAL AND HIGH FREQUENCY CIRCUIT SUBSTRATE MANUFACTURED WITH THE COMPOSITE MATERIAL AND THE MANUFACTURING METHOD THEREOF 有权
标题翻译：复合材料和高高频电路板与复合材料与方法
公开(公告)号：EP2595460A1
公开(公告)日：2013-05-22
申请号：EP10849617.5
申请日：2010-07-14
申请人： Guangdong Shengyi Sci. Tech Co., Ltd
发明人： SU, Mingshe
IPC分类号： H05K1/00 , C09J163/02
CPC分类号： C08L47/00 , C08K3/016 , C08K3/36 , C08L9/00 , C08L71/126 , H05K1/0313 , H05K1/0373 , H05K3/022 , H05K3/44 , H05K2201/012
摘要： The present invention relates to a composite material, a high-frequency circuit substrate made therefrom and a making method thereof. The composite material comprises: thermosetting mixture including more than one liquid vinyl resin with the molecular weight being less than 10000 containing polar functional groups, and a polyphenylene ether resin with the molecular weight being less than 5000 containing unsaturated double bonds at the molecule terminal; fiberglass cloth; powder filler; flame retardant and cure initiator. The high-frequency circuit substrate made from the composite material comprises a plurality of prepregs mutually overlapped, and copper foils respectively covered on both sides of overlapped prepregs; each prepreg is made from the composite material. The composite material of the prevent invention realizes easy manufacturing of the prepregs and high bonding force to the copper foil. The high-frequency circuit substrate made from the composite material has low dielectric constant, low dielectric loss tangent, and excellent heat resistance, and is convenient for process operation. Therefore, the composite material of the present invention is suitable for making the circuit substrate of a high-frequency electronic equipment.
摘要翻译：本发明涉及一种复合材料，由其制成的高频电路基板及其制造方法。复合材料包含：热固性混合物包括与分子量为小于10,000含极性官能团的一个以上的液体乙烯基树脂，并与分子量小于5000含有在分子末端不饱和双键的聚亚苯基醚树脂; 玻纤布; 粉末填料; 阻燃剂和固化引发剂。由复合材料制成的高频电路基片包含预浸料坯相互重叠，并分别覆盖在重叠预浸料坯的bothsides铜箔的多元性; 各预浸渍体从复合材料制成。本发明防止对复合材料VC + +实现容易制造的预浸料的高结合力的铜箔。由复合材料制成的高频电路基片具有低介电常数，低介电损耗角正切和优异的耐热性，并且便于处理操作。因此，本发明的复合材料是适合于制造的高频电子设备的电路基片。

8. 发明授权

EP2290009B1 Halogen-free flame retardant resin composition, and, prepreg, laminate, and laminate for printed circuit made therefrom 有权
标题翻译：无卤素阻燃树脂组合物和预浸料坯层合体和层压用于从印刷电路板
公开(公告)号：EP2290009B1
公开(公告)日：2012-03-14
申请号：EP10173740.1
申请日：2010-08-23
申请人： Guangdong Shengyi Sci. Tech Co., Ltd.
发明人： He, Yueshan , Cheng, Tao , Su, Shiguo , Wang, Biwu , Li, Jie
IPC分类号： C08L85/02 , C08K5/357 , C08K5/5399 , C08L79/04 , C08J5/24 , H05K1/03
CPC分类号： C08K5/357 , C08G59/5073 , C08G59/621 , C08G59/686 , C08J5/24 , C08J2385/02 , C08J2463/00 , C08K5/5399 , C08L63/00 , H05K1/0326 , H05K1/0353 , H05K1/0366 , H05K2201/012 , H05K2201/0209 , Y10T428/24994 , Y10T428/31511 , Y10T428/31529

9. 发明公开

EP2291061A2 Composite material, high frequency circuit substrate made therefrom and making method thereof 有权
标题翻译：由此其高频布线基板及其制造方法制备的复合材料
公开(公告)号：EP2291061A2
公开(公告)日：2011-03-02
申请号：EP10152475.9
申请日：2010-02-03
申请人： Guangdong Shengyi Sci. Tech Co., Ltd.
发明人： Su, Min She
IPC分类号： H05K1/02 , H05K1/03 , C08J5/24
CPC分类号： C08J5/24 , C08F212/08 , C08F212/14 , C08F212/34 , C08J2309/00 , C08J2309/06 , C08J2325/18 , C08J2353/02 , C08K3/013 , C08K3/40 , C08K5/0066 , C08K5/14 , C08K7/14 , C08L9/06 , C08L25/18 , H05K1/032 , H05K1/0366 , H05K1/0373 , H05K2201/012 , H05K2201/0158 , H05K2201/0209 , Y10T428/31533 , Y10T428/31544 , Y10T428/31547 , Y10T428/31645 , Y10T442/2992 , C08L2666/06 , C08L2666/04
摘要： The present invention relates to a composite material, a high-frequency circuit substrate made therefrom and making method thereof. The composite material comprises 20-70 parts by weight of thermosetting mixture, a fiberglass cloth, a powder filler, a flame retardant, and a cure initiator. The thermosetting mixture includes a resin containing vinyl in the amount of more than 60% composed of carbon and hydrogen with its molecular weight being less than 11000, and a solid styryl resin of middle or low molecular weight with unsaturated double bonds. The made high-frequency circuit substrate comprises a plurality of prepregs mutually overlapped, and copper foils respectively covered on both sides of overlapped prepregs. Each prepreg is made from the composite material. The composite material of the present invention enable to readily make prepregs. The high-frequency circuit substrate made from the composite material has low dielectric constant, low dielectric loss tangent, and good heat resistance, and is convenient for process operation. Therefore, the composite material of the present invention is suitable for making circuit substrates of high-frequency electronic equipments.
摘要翻译：本发明涉及一种复合材料，从及其制作方法制成有一个高频电路基片。的复合材料重量的热固性混合物，玻璃纤维布，粉末填料，阻燃剂，和固化引发剂的包括20-70份。热固性混合物包括与它的分子量大于11000以下的碳和氢组成的超过60％的量的含乙烯基的树脂，中或低分子量的具有不饱和双键的苯乙烯基固体树脂。的由高频电路基板包括分别覆盖上重叠的预浸料坯的预浸料bothsides相互重叠，和铜箔的复数。各预浸渍体从复合材料制成。本发明的复合材料使容易地制造预浸料坯。由复合材料制成的高频电路基片具有低介电常数，低介电损耗角正切，和良好的耐热性，并且便于处理操作。因此，本发明的复合材料是适合于制造高频电子设备的电路基板。

10. 发明授权

EP2595460B1 COMPOSITE MATERIAL AND HIGH FREQUENCY CIRCUIT SUBSTRATE MANUFACTURED WITH THE COMPOSITE MATERIAL AND THE MANUFACTURING METHOD THEREOF 有权
标题翻译：用该复合材料制造的复合材料和高频电路基板及其制造方法
公开(公告)号：EP2595460B1
公开(公告)日：2017-10-11
申请号：EP10849617.5
申请日：2010-07-14
申请人： Guangdong Shengyi Sci. Tech Co., Ltd
发明人： SU, Mingshe
IPC分类号： H05K1/00 , C09J163/02
CPC分类号： C08L47/00 , C08K3/016 , C08K3/36 , C08L9/00 , C08L71/126 , H05K1/0313 , H05K1/0373 , H05K3/022 , H05K3/44 , H05K2201/012
摘要： The present invention relates to a composite material, a high-frequency circuit substrate made therefrom and a making method thereof. The composite material comprises: thermosetting mixture including more than one liquid vinyl resin with the molecular weight being less than 10000 containing polar functional groups, and a polyphenylene ether resin with the molecular weight being less than 5000 containing unsaturated double bonds at the molecule terminal; fiberglass cloth; powder filler; flame retardant and cure initiator. The high-frequency circuit substrate made from the composite material comprises a plurality of prepregs mutually overlapped, and copper foils respectively covered on both sides of overlapped prepregs; each prepreg is made from the composite material. The composite material of the prevent invention realizes easy manufacturing of the prepregs and high bonding force to the copper foil. The high-frequency circuit substrate made from the composite material has low dielectric constant, low dielectric loss tangent, and excellent heat resistance, and is convenient for process operation. Therefore, the composite material of the present invention is suitable for making the circuit substrate of a high-frequency electronic equipment.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式