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1. 发明公开

EP2291061A3 Composite material, high frequency circuit substrate made therefrom and making method thereof 有权
标题翻译：复合材料，由其制成的高频电路基板及其制造方法
公开(公告)号：EP2291061A3
公开(公告)日：2011-11-16
申请号：EP10152475.9
申请日：2010-02-03
申请人： Guangdong Shengyi Sci. Tech Co., Ltd.
发明人： Su, Min She
IPC分类号： C08J5/24 , H05K1/03 , C08L25/18 , C08L9/06
CPC分类号： C08J5/24 , C08F212/08 , C08F212/14 , C08F212/34 , C08J2309/00 , C08J2309/06 , C08J2325/18 , C08J2353/02 , C08K3/013 , C08K3/40 , C08K5/0066 , C08K5/14 , C08K7/14 , C08L9/06 , C08L25/18 , H05K1/032 , H05K1/0366 , H05K1/0373 , H05K2201/012 , H05K2201/0158 , H05K2201/0209 , Y10T428/31533 , Y10T428/31544 , Y10T428/31547 , Y10T428/31645 , Y10T442/2992 , C08L2666/06 , C08L2666/04
摘要： The present invention relates to a composite material, a high-frequency circuit substrate made therefrom and making method thereof. The composite material comprises 20-70 parts by weight of thermosetting mixture, a fiberglass cloth, a powder filler, a flame retardant, and a cure initiator. The thermosetting mixture includes a resin containing vinyl in the amount of more than 60% composed of carbon and hydrogen with its molecular weight being less than 11000, and a solid styryl resin of middle or low molecular weight with unsaturated double bonds. The made high-frequency circuit substrate comprises a plurality of prepregs mutually overlapped, and copper foils respectively covered on both sides of overlapped prepregs. Each prepreg is made from the composite material. The composite material of the present invention enable to readily make prepregs. The high-frequency circuit substrate made from the composite material has low dielectric constant, low dielectric loss tangent, and good heat resistance, and is convenient for process operation. Therefore, the composite material of the present invention is suitable for making circuit substrates of high-frequency electronic equipments.
摘要翻译：本发明涉及复合材料，由其制成的高频电路基板及其制造方法。该复合材料包含20-70重量份的热固性混合物，玻璃纤维布，粉末填料，阻燃剂和固化引发剂。热固性混合物包括含有超过60％的由碳和氢构成的分子量小于11000的乙烯基树脂和具有不饱和双键的中等或低分子量的固体苯乙烯基树脂。所制成的高频电路基板包括多个相互重叠的预浸料坯，并且铜箔分别覆盖在交叠的预浸料坯的两侧。每种预浸料都由复合材料制成。本发明的复合材料能够容易地制造预浸料坯。由复合材料制成的高频电路基板介电常数低，介电损耗角正切小，耐热性好，便于工艺操作。因此，本发明的复合材料适用于制造高频电子设备的电路基板。

2. 发明公开

EP2241589A2 Composite material and high-frequency circuit substrate made therefrom 审中-公开
标题翻译：。und。。。。。。。。。。。。。
公开(公告)号：EP2241589A2
公开(公告)日：2010-10-20
申请号：EP10152472.6
申请日：2010-02-03
申请人： Guangdong Shengyi Sci. Tech Co., Ltd.
发明人： Su, Min She
IPC分类号： C08J5/24 , C08J5/04 , H05K1/03
摘要： The invention relates to a composite material and a high-frequency circuit substrate made from the composite material. The composite material includes: a thermosetting composition in an amount of 20 to 70 by weight with respect to the composite material, a fiberglass cloth processed by coupling agent; a powder filler; a fire retardant and a cure initiator. The thermosetting composition includes a resin with molecular weight thereof being less than 11,000, and a low-molecular-weight solid allyl resin. The resin is composed of carbon and hydrogen element. More than 60 percent of the resin is vinyl.; The high-frequency circuit substrate made from the composite material comprises: a plurality of prepregs mutually overlapped and copper foils respectively covered on both sides of overlapped prepregs, wherein each prepreg is made from the composite material. The composite material of the present invention realizes easy manufacture of the prepreg and high bonding of the copper foil. The high-frequency circuit substrate made from the composite material has low dielectric constant, low dielectric loss tangent, and excellent heat resistance, and is convenient for process operation. Therefore, the composite material is suitable for making the circuit substrate.
摘要翻译：本发明涉及由复合材料制成的复合材料和高频电路基板。复合材料包括：相对于复合材料为20〜70重量％的热固性组合物，由偶联剂处理的玻璃纤维布; 粉末填料; 阻燃剂和固化引发剂。热固性组合物包括分子量小于11,000的树脂和低分子量固体烯丙基树脂。树脂由碳和氢元素组成。超过60％的树脂是乙烯基。由复合材料制成的高频电路基板包括：相互重叠的多个预浸料和分别覆盖在重叠的预浸料的两侧的铜箔，其中每个预浸料由复合材料制成。本发明的复合材料实现了预浸料的容易制造和铜箔的高粘合性。由复合材料制成的高频电路基板具有低介电常数，低介电损耗角正切和优异的耐热性，并且方便操作。因此，复合材料适于制造电路基板。

3. 发明公开

EP2150094A2 Composite material, high-frequency circuit substrate made therefrom and making method thereof 有权
标题翻译： Ver und undürürürürürürürürürürürürürürürürürürürürürür
公开(公告)号：EP2150094A2
公开(公告)日：2010-02-03
申请号：EP09165921.9
申请日：2009-07-20
申请人： Guangdong Shengyi Sci. Tech Co., Ltd.
发明人： Su, Min She
IPC分类号： H05K1/03
CPC分类号： H05K1/0373 , H05K1/032 , H05K1/0366 , H05K2201/0158 , H05K2201/0209 , H05K2201/0212 , Y10T428/24355 , Y10T442/2418 , Y10T442/2475 , Y10T442/2992 , Y10T442/3594
摘要： The invention relates to a composite material, a high-frequency circuit substrate made from the composite material and a making method of the high-frequency circuit substrate. The composite material includes: a thermosetting composition including a more than 60 percent of vinyl containing Butadiene styrene copolymer resin with molecular weight less than 11,000, a more than 60 percent of vinyl containing polybutadiene resin with polarity groups, and a maleic anhydride grafted polybutadiene styrene copolymer with molecular weight more than 50,000; a fiberglass cloth; a powder filler; and a cure initiator. The composite material of the prevent invention realizes easy manufacture of the prepreg and high bonding of the copper foil. The high-frequency circuit substrate made from the composite material has low dielectric constant, low dielectric loss tangent, and excellent heat resistance, and is convenient for process operation. Therefore, the composite material is suitable for making the circuit substrate.
摘要翻译：本发明涉及一种复合材料，由复合材料制成的高频电路基板和高频电路基板的制造方法。复合材料包括：热固性组合物，其包含超过60％的分子量小于11,000的含乙烯基丁二烯苯乙烯共聚物树脂，超过60％的含极性基团的含乙烯基聚丁二烯树脂和马来酸酐接枝的聚丁二烯苯乙烯共聚物分子量大于50,000; 玻璃纤维布; 粉末填料; 和固化引发剂。防止发明的复合材料实现了预浸料的容易制造和铜箔的高粘合。由复合材料制成的高频电路基板具有低介电常数，低介电损耗角正切和优异的耐热性，并且方便操作。因此，复合材料适于制造电路基板。

4. 发明授权

EP2291061B1 Composite material, high frequency circuit substrate made therefrom and making method thereof 有权
标题翻译：由此其高频布线基板及其制造方法制备的复合材料
公开(公告)号：EP2291061B1
公开(公告)日：2014-05-07
申请号：EP10152475.9
申请日：2010-02-03
申请人： Guangdong Shengyi Sci. Tech Co., Ltd.
发明人： Su, Min She
IPC分类号： C08J5/24 , H05K1/03 , C08L25/18 , C08L9/06
CPC分类号： C08J5/24 , C08F212/08 , C08F212/14 , C08F212/34 , C08J2309/00 , C08J2309/06 , C08J2325/18 , C08J2353/02 , C08K3/013 , C08K3/40 , C08K5/0066 , C08K5/14 , C08K7/14 , C08L9/06 , C08L25/18 , H05K1/032 , H05K1/0366 , H05K1/0373 , H05K2201/012 , H05K2201/0158 , H05K2201/0209 , Y10T428/31533 , Y10T428/31544 , Y10T428/31547 , Y10T428/31645 , Y10T442/2992 , C08L2666/06 , C08L2666/04
摘要： The present invention relates to a composite material, a high-frequency circuit substrate made therefrom and making method thereof. The composite material comprises 20-70 parts by weight of thermosetting mixture, a fiberglass cloth, a powder filler, a flame retardant, and a cure initiator. The thermosetting mixture includes a resin containing vinyl in the amount of more than 60% composed of carbon and hydrogen with its molecular weight being less than 11000, and a solid styryl resin of middle or low molecular weight with unsaturated double bonds. The made high-frequency circuit substrate comprises a plurality of prepregs mutually overlapped, and copper foils respectively covered on both sides of overlapped prepregs. Each prepreg is made from the composite material. The composite material of the present invention enable to readily make prepregs. The high-frequency circuit substrate made from the composite material has low dielectric constant, low dielectric loss tangent, and good heat resistance, and is convenient for process operation. Therefore, the composite material of the present invention is suitable for making circuit substrates of high-frequency electronic equipments.

5. 发明公开

EP2291061A2 Composite material, high frequency circuit substrate made therefrom and making method thereof 有权
标题翻译：由此其高频布线基板及其制造方法制备的复合材料
公开(公告)号：EP2291061A2
公开(公告)日：2011-03-02
申请号：EP10152475.9
申请日：2010-02-03
申请人： Guangdong Shengyi Sci. Tech Co., Ltd.
发明人： Su, Min She
IPC分类号： H05K1/02 , H05K1/03 , C08J5/24
CPC分类号： C08J5/24 , C08F212/08 , C08F212/14 , C08F212/34 , C08J2309/00 , C08J2309/06 , C08J2325/18 , C08J2353/02 , C08K3/013 , C08K3/40 , C08K5/0066 , C08K5/14 , C08K7/14 , C08L9/06 , C08L25/18 , H05K1/032 , H05K1/0366 , H05K1/0373 , H05K2201/012 , H05K2201/0158 , H05K2201/0209 , Y10T428/31533 , Y10T428/31544 , Y10T428/31547 , Y10T428/31645 , Y10T442/2992 , C08L2666/06 , C08L2666/04
摘要： The present invention relates to a composite material, a high-frequency circuit substrate made therefrom and making method thereof. The composite material comprises 20-70 parts by weight of thermosetting mixture, a fiberglass cloth, a powder filler, a flame retardant, and a cure initiator. The thermosetting mixture includes a resin containing vinyl in the amount of more than 60% composed of carbon and hydrogen with its molecular weight being less than 11000, and a solid styryl resin of middle or low molecular weight with unsaturated double bonds. The made high-frequency circuit substrate comprises a plurality of prepregs mutually overlapped, and copper foils respectively covered on both sides of overlapped prepregs. Each prepreg is made from the composite material. The composite material of the present invention enable to readily make prepregs. The high-frequency circuit substrate made from the composite material has low dielectric constant, low dielectric loss tangent, and good heat resistance, and is convenient for process operation. Therefore, the composite material of the present invention is suitable for making circuit substrates of high-frequency electronic equipments.
摘要翻译：本发明涉及一种复合材料，从及其制作方法制成有一个高频电路基片。的复合材料重量的热固性混合物，玻璃纤维布，粉末填料，阻燃剂，和固化引发剂的包括20-70份。热固性混合物包括与它的分子量大于11000以下的碳和氢组成的超过60％的量的含乙烯基的树脂，中或低分子量的具有不饱和双键的苯乙烯基固体树脂。的由高频电路基板包括分别覆盖上重叠的预浸料坯的预浸料bothsides相互重叠，和铜箔的复数。各预浸渍体从复合材料制成。本发明的复合材料使容易地制造预浸料坯。由复合材料制成的高频电路基片具有低介电常数，低介电损耗角正切，和良好的耐热性，并且便于处理操作。因此，本发明的复合材料是适合于制造高频电子设备的电路基板。

6. 发明授权

EP2241589B1 Composite material and high-frequency circuit substrate made therefrom 有权
公开(公告)号：EP2241589B1
公开(公告)日：2019-12-25
申请号：EP10152472.6
申请日：2010-02-03
申请人： Guangdong Shengyi Sci. Tech Co., Ltd.
发明人： Su, Min She
IPC分类号： C08J5/24 , C08J5/04 , H05K1/03

7. 发明授权

EP2150094B1 Composite material, high-frequency circuit substrate made therefrom and making method thereof 有权
标题翻译：由此其高频布线基板及其制造方法制备的复合材料
公开(公告)号：EP2150094B1
公开(公告)日：2012-05-16
申请号：EP09165921.9
申请日：2009-07-20
申请人： Guangdong Shengyi Sci. Tech Co., Ltd.
发明人： Su, Min She
IPC分类号： H05K1/03
CPC分类号： H05K1/0373 , H05K1/032 , H05K1/0366 , H05K2201/0158 , H05K2201/0209 , H05K2201/0212 , Y10T428/24355 , Y10T442/2418 , Y10T442/2475 , Y10T442/2992 , Y10T442/3594

8. 发明公开

EP2241589A3 Composite material and high-frequency circuit substrate made therefrom 审中-公开
标题翻译：复合材料，以及由其高频配线基板制造
公开(公告)号：EP2241589A3
公开(公告)日：2012-01-18
申请号：EP10152472.6
申请日：2010-02-03
申请人： Guangdong Shengyi Sci. Tech Co., Ltd.
发明人： Su, Min She
IPC分类号： C08J5/24 , C08J5/04 , H05K1/03
摘要： The invention relates to a composite material and a high-frequency circuit substrate made from the composite material. The composite material includes: a thermosetting composition in an amount of 20 to 70 by weight with respect to the composite material, a fiberglass cloth processed by coupling agent; a powder filler; a fire retardant and a cure initiator. The thermosetting composition includes a resin with molecular weight thereof being less than 11,000, and a low-molecular-weight solid allyl resin. The resin is composed of carbon and hydrogen element. More than 60 percent of the resin is vinyl.; The high-frequency circuit substrate made from the composite material comprises: a plurality of prepregs mutually overlapped and copper foils respectively covered on both sides of overlapped prepregs, wherein each prepreg is made from the composite material. The composite material of the present invention realizes easy manufacture of the prepreg and high bonding of the copper foil. The high-frequency circuit substrate made from the composite material has low dielectric constant, low dielectric loss tangent, and excellent heat resistance, and is convenient for process operation. Therefore, the composite material is suitable for making the circuit substrate.

9. 发明公开

EP2150094A3 Composite material, high-frequency circuit substrate made therefrom and making method thereof 有权
标题翻译：复合材料，由其制成的高频电路基板及其制造方法
公开(公告)号：EP2150094A3
公开(公告)日：2010-08-04
申请号：EP09165921.9
申请日：2009-07-20
申请人： Guangdong Shengyi Sci. Tech Co., Ltd.
发明人： Su, Min She
IPC分类号： H05K1/03
CPC分类号： H05K1/0373 , H05K1/032 , H05K1/0366 , H05K2201/0158 , H05K2201/0209 , H05K2201/0212 , Y10T428/24355 , Y10T442/2418 , Y10T442/2475 , Y10T442/2992 , Y10T442/3594
摘要： The invention relates to a composite material, a high-frequency circuit substrate made from the composite material and a making method of the high-frequency circuit substrate. The composite material includes: a thermosetting composition including a more than 60 percent of vinyl containing Butadiene styrene copolymer resin with molecular weight less than 11,000, a more than 60 percent of vinyl containing polybutadiene resin with polarity groups, and a maleic anhydride grafted polybutadiene styrene copolymer with molecular weight more than 50,000; a fiberglass cloth; a powder filler; and a cure initiator. The composite material of the prevent invention realizes easy manufacture of the prepreg and high bonding of the copper foil. The high-frequency circuit substrate made from the composite material has low dielectric constant, low dielectric loss tangent, and excellent heat resistance, and is convenient for process operation. Therefore, the composite material is suitable for making the circuit substrate.
摘要翻译：本发明涉及一种复合材料，由该复合材料制成的高频电路基板以及该高频电路基板的制造方法。该复合材料包括：热固性组合物，其包含超过60％的分子量小于11,000的含乙烯基的丁二烯苯乙烯共聚物树脂，超过60％的具有极性基团的含乙烯基的聚丁二烯树脂和马来酸酐接枝的聚丁二烯苯乙烯共聚物分子量超过50,000; 玻璃纤维布; 粉末填料; 和一个固化引发剂。本发明的复合材料实现了预浸料坯的容易制造和铜箔的高接合。由复合材料制成的高频电路基板具有低介电常数，低介电损耗角正切和优异的耐热性，并且便于工艺操作。因此，该复合材料适用于制作电路基板。

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