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81. 发明公开

EP0970594A1 MOULDED SOCKETS FOR ELECTRONIC COMPONENT ATTACHMENT 失效
标题翻译：铸造版用于固定电子元件
公开(公告)号：EP0970594A1
公开(公告)日：2000-01-12
申请号：EP97950344.8
申请日：1997-12-31
申请人： FORD MOTOR COMPANY , FORD MOTOR COMPANY LIMITED
发明人： GLOVATSKY, Andrew, Zachary , TODD, Michael, George , PHAM, Cuong, Van
IPC分类号： H05K1/18
CPC分类号： H05K3/326 , H05K1/0284 , H05K1/119 , H05K1/183 , H05K1/184 , H05K3/284 , H05K2201/09118 , H05K2201/09181 , H05K2201/09472 , H05K2201/09845 , H05K2201/1059 , H05K2201/10636 , H05K2201/10651 , H05K2201/10689 , Y02P70/611
摘要： There is disclosed herein an electrical circuit assembly which requires no solder processing, comprising an electronic component (10) having terminations (14) arranged on at least one of its surfaces, and a moulded curviplanar substrate (20) having circuit traces (30) thereon and a cavity (24) formed therein, wherein the cavity (24) substantially conforms in shape with the electronic component (10). Proximate the cavity (24) is a plurality of electrical contacts (40), arranged in matched relation with the respective terminations (14) of the electronic component (10), with at least one of the electrical contacts (40) being connected to at least one of the circuit traces (30) on the substrate (20). The cavity (24) and electrical contacts (40) are dimensioned such that an interference fit is provided between the component's terminations and the electrical contacts, such that the component (10) is held within the cavity (24) when the component (10) is placed therein. The component (10) is disposed in the cavity (24) such that its terminations (14) are in physical and electrical connection with their respective electrical contacts (40).

82. 发明公开

EP0964609A1 Anti-bridging solder ball collection zones 审中-公开
标题翻译： Überbrückungsschutzzonenzur Aufnahme vonLötkugeln
公开(公告)号：EP0964609A1
公开(公告)日：1999-12-15
申请号：EP99304262.1
申请日：1999-06-01
申请人： Ford Motor Company
发明人： McMillian, Richard Keith , Jairazbhoy, Vivek Amir
IPC分类号： H05K3/34
CPC分类号： H05K3/3442 , H01L2224/10175 , H01L2924/384 , H01L2924/3841 , H05K1/111 , H05K3/3452 , H05K2201/0939 , H05K2201/0989 , H05K2201/10636 , H05K2201/10689 , Y02P70/611 , Y02P70/613
摘要： There is disclosed herein a printed circuit board (PCB) having improved resistance against solder bridging and component decentring/tombstoning. The PCB comprises: a substrate 10 having a top surface 12; at least two mounting pads 14 disposed on the top surface in matched relation with terminations 26 of an electronic component 24; and a solder mask 16 disposed on the top surface and having at least two apertures 18 therethrough, wherein each aperture generally conforms in shape with and is arranged about a respective one of the mounting pads 14. Each aperture 18 has at least one inner aperture edge 22i generally within a projected footprint F of the electronic component and at least one outer aperture edge 220 generally outside the footprint F. Each aperture 18 includes a notch 20 in one or more of the at least one outer aperture edge 220, wherein each notch 20 extends generally outward from its respective mounting pad 14. The notch 20 provides a reservoir in the solder mask aperture 18 about each pad 14, into which flux, other solder paste effluents, and solder balls may be channelled and remain contained.
摘要翻译：这里公开了一种印刷电路板（PCB），其具有改进的耐焊接桥接和元件偏心/墓碑的电阻。 PCB包括：具有顶表面12的基板10; 至少两个安装焊盘14，其以与电子部件24的端子26相匹配的方式设置在顶表面上; 以及设置在顶表面上并且具有穿过其中的至少两个孔18的焊接掩模16，其中每个孔基本上与形状相配合并围绕相应的一个安装焊盘14布置。每个孔18具有至少一个内孔边缘 22i通常在电子部件的投影占地面积F内和通常在封面F外部的至少一个外部孔边缘220.每个孔口18包括位于至少一个外部孔口边缘220中的一个或多个中的凹口20，其中每个凹口20 凹槽20围绕每个焊盘14在焊料掩模孔18中提供储存器，焊剂，其它焊膏流出物和焊球可被引导并保持在其中。

83. 发明公开

EP0962968A2 Method of producing a multi-layer ceramic substrate 有权
标题翻译： Herstellungsmethode eines Mehrlagensubstrates
公开(公告)号：EP0962968A2
公开(公告)日：1999-12-08
申请号：EP99110289.8
申请日：1999-05-27
申请人： Murata Manufacturing Co., Ltd.
发明人： Sakamoto, Sadaaki, c/o (A170) Int. Prop. Dept. , Sunahara, Hirofumi, c/o (A170) Int. Prop. Dept. , Nishide, Mitsuyoshi, c/o (A170) Int. Prop. Dept.
IPC分类号： H01L21/48
CPC分类号： H05K1/186 , H01L21/4857 , H05K1/0306 , H05K1/16 , H05K3/4629 , H05K2201/10636 , Y02P70/611
摘要： The invention provides a method of producing a multi-layer ceramic substrate comprising a laminated member having a plurality of ceramic layers made of a ceramic insulating material and a wiring conductor, comprising the steps of: preparing a raw compact (1g) having the plurality of the laminated ceramic green sheets (2g - 8g) containing the ceramic insulating material and the wiring conductor (13 - 18); providing raw sheet type bases (48, 49) on the principal plane at both ends with respect to the lamination direction of the raw compact (1g), the raw sheet type bases (48, 49) containing a ceramic not to be sintered at the baking temperature of the raw compact (1g); baking the raw compact (1g) in the state interposed between the sheet type bases (48, 49) so as to obtain the laminated member; and eliminating the unsintered sheet type bases (48, 49); wherein the heat expansion coefficient difference of the sheet type bases (48, 49) and the laminated member after baking is 2.5 × 10 -6 degK -1 or more.
摘要翻译：本发明提供一种制造多层陶瓷基板的方法，该多层陶瓷基板包括具有由陶瓷绝缘材料和布线导体制成的多个陶瓷层的层叠构件，其包括以下步骤：制备具有多个含有陶瓷绝缘材料的层压陶瓷生片（2g-8g）和布线导体（13-18）; 在原料（1g）的层叠方向的两端的主面上设置原料片型基材（48,49），含有未烧结的陶瓷的原料片型基体（48,49）原料的烘烤温度（1g）; 在插入在片状基座（48,49）之间的状态下烘烤原料（1g），以获得层压构件; 并除去未烧结的片状基底（48,49）。其特征在于，所述片状基体（48,49）与所述层叠体的烘烤后的热膨胀系数差为2.5×10 -6 degK -1以上。

84. 发明公开

EP0852059A4 ASYMMETRIC RESISTOR TERMINAL 失效
标题翻译：不公平的WIDERSTANDSKONTAKT
公开(公告)号：EP0852059A4
公开(公告)日：1999-08-11
申请号：EP96945302
申请日：1996-12-23
申请人： EMC TECHNOLOGY INC
发明人： MAZZOCHETTE JOSEPH B
IPC分类号： H01C1/142 , H01C17/00 , H05K1/02 , H05K3/34 , H01C1/012
CPC分类号： H01C1/142 , H01C17/006 , H05K1/0201 , H05K3/3442 , H05K2201/09381 , H05K2201/09427 , H05K2201/10469 , H05K2201/10636 , Y02P70/611 , Y02P70/613
摘要： A chip resistor (30) includes a substantially rectangular substrate (32) of an insulating material having opposed substantially flat top and bottom surfaces (34, 36) and edges (38) extending between the top and bottom surfaces (34, 36). A layer (40) of a resistance material is on the top surface (34) of the substrate (32). Separate termination layers (42, 44) of a conductive material are on the top surface (34) of the substrate (30) and contact the resistance layer (40) at opposite end thereof. Each of the termination layers (42, 44) extends across an edge of the substrate and over a portion of the bottom surface (36) of the substrate (30). The total area of the portions (42b, 44b) of the termination layers (42, 44) on the bottom surface (36) of the substrate (30) is greater than the total area of the portions (42a, 44a) of the termination layers (42, 44) on the top surface (34) of the substrate (30) so that the spacing between the ends of the portions (42b, 44b) of the termination layers (42, 44) on the bottom surface (36) of the substrate (30) is smaller than the spacing between the ends of the portions (42a, 44a) of the termination layers (42, 44) on the top surface (34) of the substrate (30).
摘要翻译：芯片电阻器包括绝缘材料的基本上矩形的基板，其具有相对的基本上平坦的顶表面和底表面以及在顶表面和底表面之间延伸的边缘。电阻材料层位于衬底的顶表面上。导电材料的单独端接层位于顶表面或基板上，并在其相对端接触电阻层。每个终端层延伸穿过衬底的边缘并且在衬底的底表面的一部分上方延伸。基板的底面上的终端层的部分的总面积大于基板的顶面上端接层的部分的总面积，使得终端部分的端部之间的间隔衬底底表面上的层小于衬底顶表面上终端层部分的端部之间的间距。

85. 发明公开

EP0899550A1 Schaltungsanordnung mit einem SMD-Bauelement, insbesondere Temperatursensor und Verfahren zur Herstellung eines Temperatursensors 审中-公开
标题翻译：与SMD元件的电路装置，在特定的温度传感器及其制造温度传感器的方法
公开(公告)号：EP0899550A1
公开(公告)日：1999-03-03
申请号：EP98202758.3
申请日：1998-08-18
申请人： Philips Patentverwaltung GmbH , Koninklijke Philips Electronics N.V.
发明人： Groen, W.-A., Dr. , Sillen, Ir.V.R.C.M.J.
IPC分类号： G01K7/22 , H01C7/04 , H01C1/142
CPC分类号： H01C1/142 , G01K7/22 , H01C7/043 , H01L2924/0002 , H05K3/321 , H05K2201/0209 , H05K2201/10636 , H05K2201/10984 , H05K2203/1453 , Y02P70/611 , Y10T29/49082 , H01L2924/00
摘要： Die Erfindung betrifft eine Schaltungsanordnung mit einem SMD-Bauelement (1), insbesondere einen Temperatursensor mit einem Thermistorelement (1) mit zwei elektrisch leitenden Kontakten (2a, 2b), welche mit jeweils einer auf einem Substrat (4) aufgebrachten Leiterbahn (3a, 3b) leitend verbunden sind. Eine feste mechanische, als auch eine gute elektrisch leitende Verbindung zwischen dem SMD-Bauelement und den Leiterbahnen wird dabei dadurch erreicht, daß die Kontakte (2a, 2b) aus jeweils einer die Verbindung mit den Leiterbahnen (3a, 3b) schaffenden Metall-Glas-Schicht (6) gebildet sind und daß die Metall-Glas-Schicht (6) durch Erhitzen eines Glaspartikel enthaltenden Metalls bis zum Schmelzen oder Erweichen der Glaspartikel hergestellt ist. Die Erfindung betrifft außerdem auch ein Verfahren zur Herstellung eines Temperatursensors und zur Herstellung einer solchen Verbindung.
摘要翻译：在与具有连接到基板导体线的两个触点的表面安装器件（SMD）的电路中，每个由加热金属含玻璃颗粒熔化或软化的玻璃颗粒生产的金属/玻璃层形成。因此独立权利要求中包括了（1）与具有接触如上所述的热敏电阻元件的温度传感器; （2）用于制备上述温度传感器的方法; 和（3）用于生产SMD元件的一个接触，并通过施加金属膏含有玻璃颗粒到部件的表面，接触与导体线所得到的接触，加热熔化或软化一个基底导体线之间的导电连接的方法玻璃颗粒，然后冷却。

86. 发明公开

EP0834887A2 Chip component 失效
标题翻译：芯片Bauteil
公开(公告)号：EP0834887A2
公开(公告)日：1998-04-08
申请号：EP97117163.2
申请日：1997-10-02
申请人： TAIYO YUDEN CO., LTD.
发明人： Tanaka, Hirotoshi, Taiyo Yuden Co., Ltd. , Kohara, Masataka, Taiyo Yuden Co., Ltd. , Maki, Hideya, Taiyo Yuden Co., Ltd.
IPC分类号： H01C1/02 , H01L23/28
CPC分类号： H05K3/303 , H01C1/02 , H01C17/006 , H05K1/0269 , H05K2201/09954 , H05K2201/10636 , H05K2203/161 , H05K2203/168 , Y02P70/611 , Y02P70/613
摘要： A chip component such as chip resistor, which is capable of being mounted obversely or reversely to a substrate or the like. Since the color of the armor (glass film (6) and resin film (7)) is adjusted so as to be green identical with that of a ceramics chip (1), the lightness distribution of the component front face is similar with that of the component back face. Therefore, there is no case that chip component mounted obversely and chip component mounted reversely are identified as different components in a testing step of detecting a positional deviation or unloaded component by a color or monochromatic image processing (digital image processing), even if the component is mounted reversely to a substrate or the like.
摘要翻译：片状元件，例如片状电阻器，其能够与衬底等相反地或相反地安装。由于将铠装（玻璃膜（6）和树脂膜（7））的颜色调整为与陶瓷芯片（1）的颜色相同的绿色，所以部件正面的亮度分布与组件背面。因此，在通过彩色或单色图像处理（数字图像处理）检测位置偏离或卸载成分的测试步骤中，即使该组件反向安装在基板等上。

87. 发明公开

EP0834376A1 SOLDER, AND SOLDERED ELECTRONIC COMPONENT AND ELECTRONIC CIRCUIT BOARD 失效
标题翻译： LOT，GELÖTETESELEKTRONISCHES TEIL UND ELEKTRONISCHE LEITERPLATTE
公开(公告)号：EP0834376A1
公开(公告)日：1998-04-08
申请号：EP96918837.4
申请日：1996-06-19
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： YAMAGUCHI, Atsushi , SUETSUGU, Kenichiro , FUKUSHIMA, Tetsuo , FURUSAWA, Akio
IPC分类号： B23K35/14 , B23K35/22 , B23K35/26 , H01L23/50 , H05K3/24 , H05K3/34
CPC分类号： H05K3/244 , B23K35/0227 , B23K35/0244 , B23K35/025 , B23K35/26 , H01L23/49582 , H01L2924/0002 , H05K3/3421 , H05K3/3463 , H05K3/3484 , H05K2201/0218 , H05K2201/10636 , H05K2203/0425 , Y02P70/611 , Y10T428/24917 , Y10T428/2938 , Y10T428/294 , Y10T428/2951 , Y10T428/2991 , H01L2924/00
摘要： The occurrence of partial chip detachment is reduced by improving wettability for increasing the bonding strength, and by enabling gradual melting of the solder. Solder material, electronic components, and electronic circuit boards with higher performance and higher reliability are offered. The surface of a solder core, lead-frame surface and electrode surface of electronic components, and copper (Cu) land surface of electronic circuit boards are coated with metal element, which is either indium (In) or bismuth (Bi).
摘要翻译：通过提高粘合强度的润湿性以及使焊料能够逐渐熔化，可以减少部分切屑剥离的发生。提供了具有更高性能和更高可靠性的焊料，电子元件和电子电路板。焊料芯，引线框架表面和电子部件的电极表面以及电子电路板的铜（Cu）表面的表面涂覆有铟（In）或铋（Bi）的金属元素。

88. 发明公开

EP0762533A3 Antenna apparatus 失效
标题翻译：天线装置
公开(公告)号：EP0762533A3
公开(公告)日：1997-05-07
申请号：EP96113583.7
申请日：1996-08-23
申请人： MURATA MANUFACTURING CO., LTD.
发明人： Tsuru, Teruhisa, Murata Manufact. Co., Ltd. , Mandai, Harufumi, Murata Manufact. Co., Ltd. , Kanba, Seiji, Murata Manufact. Co., Ltd. , Asakura, Kenji, Murata Manufact. Co., Ltd.
IPC分类号： H01Q1/36 , H01Q1/38
CPC分类号： H01Q1/36 , H01Q1/38 , H05K1/0219 , H05K1/0231 , H05K1/0243 , H05K1/111 , H05K1/162 , H05K3/3442 , H05K2201/09236 , H05K2201/10522 , H05K2201/10636 , Y02P70/611
摘要： An antenna apparatus (10; 20; 30) having a predetermined impedance is provided. The apparatus has a chip antenna (11) including a conductor (16) and a mounting board (12) on which the antenna is mounted. A ground pattern (13) and a microstrip line (14) are formed on the board (12). A feeding terminal (17) for applying a voltage to the conductor (16) is deposited on the surface of the antenna. Solder may be used to connect the feeding terminal (17) of the antenna to the microstrip line (14) formed on the board (12). A capacitance-generating device (19; 21; 31), e. g., a dielectric resin (19) or capacitor (21) is disposed between the microstrip line (14) connected to the feeding terminal (17) of the antenna and the ground pattern (13). A capacitance is thus generated between the microstrip line (14) and the ground pattern (13) thereby enabling regulation of the antenna apparatus impedance and bandwidth.
摘要翻译：提供具有预定阻抗的天线装置（10; 20; 30）。该设备具有包括导体（16）和安装天线的安装板（12）的芯片天线（11）。接地图案（13）和微带线（14）形成在板（12）上。用于向导体（16）施加电压的馈电端子（17）被沉积在天线的表面上。焊料可以用于将天线的馈电端子（17）连接到形成在板（12）上的微带线（14）。电容产生装置（19; 21; 31），例如，例如，在连接到天线的馈电端子（17）的微带线（14）和接地图案（13）之间设置介电树脂（19）或电容器（21）。因此在微带线（14）和接地图案（13）之间产生电容，从而能够调节天线装置的阻抗和带宽。

89. 发明公开

EP0756447A3 Schaltungsanordnung für Kraftfahrzeuge 失效
标题翻译：电路，用于机动车辆
公开(公告)号：EP0756447A3
公开(公告)日：1997-03-26
申请号：EP96117380.4
申请日：1994-08-03
申请人： Hella KG Hueck & Co.
发明人： Klassen, Eugen , Raulf, Manfred , Rehberg, Helmut
IPC分类号： H05K9/00
CPC分类号： H05K9/0039 , H05K1/0218 , H05K1/0219 , H05K1/0225 , H05K1/0231 , H05K1/0239 , H05K2201/0715 , H05K2201/093 , H05K2201/09663 , H05K2201/10522 , H05K2201/10636 , Y02P70/611
摘要： Bei einer Schaltungsanordnung für Kraftfahrzeuge mit einer elektrisch isolierenden Trägerplatte, mit auf der Trägerplatte angeordneten, Störpotential erzeugenden oder empfindlichen Bauteilen und mit auf der Trägerplatte angeordneten Leiterbahnen, die die Bauteile mit anderen Bauteilen elektrisch verbinden, sind die Bauteile zur einfachen und kostengünstigen Herstellung und zum Erreichen einer ausreichenden Abschirmung von mehreren Leiterbahnringen umgeben, die eine Unterbrechung aufweisen und gegeneinander versetzt sind. Diese Lösung ist mit Abschirmbehälterdeckel anwendbar.

90. 发明公开

EP0756447A2 Schaltungsanordnung für Kraftfahrzeuge 失效
标题翻译： SchaltungsanordnungfürKraftfahrzeuge
公开(公告)号：EP0756447A2
公开(公告)日：1997-01-29
申请号：EP96117380.4
申请日：1994-08-03
申请人： Hella KG Hueck & Co.
发明人： Klassen, Eugen , Raulf, Manfred , Rehberg, Helmut
IPC分类号： H05K9/00
CPC分类号： H05K9/0039 , H05K1/0218 , H05K1/0219 , H05K1/0225 , H05K1/0231 , H05K1/0239 , H05K2201/0715 , H05K2201/093 , H05K2201/09663 , H05K2201/10522 , H05K2201/10636 , Y02P70/611
摘要： Bei einer Schaltungsanordnung für Kraftfahrzeuge mit einer elektrisch isolierenden Trägerplatte, mit auf der Trägerplatte angeordneten, Störpotential erzeugenden oder empfindlichen Bauteilen und mit auf der Trägerplatte angeordneten Leiterbahnen, die die Bauteile mit anderen Bauteilen elektrisch verbinden, sind die Bauteile zur einfachen und kostengünstigen Herstellung und zum Erreichen einer ausreichenden Abschirmung von mehreren Leiterbahnringen umgeben, die eine Unterbrechung aufweisen und gegeneinander versetzt sind. Diese Lösung ist mit Abschirmbehälterdeckel anwendbar.
摘要翻译：电路包括绝缘电路板（1），其支撑由HF屏蔽罩（11）包围的产生HF辐射或对HF辐射敏感的部件。这些部件被施加到电路板的相对表面的一对导体环（2,13）围绕，两个环具有轴向偏移的中断点（3,14），该屏蔽盖底部边缘与导体环。

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