![Method of producing a multi-layer ceramic substrate](/ep/1999/12/08/EP0962968A2/abs.jpg.150x150.jpg)
基本信息:
- 专利标题: Method of producing a multi-layer ceramic substrate
- 专利标题(中):Herstellungsmethode eines Mehrlagensubstrates
- 申请号:EP99110289.8 申请日:1999-05-27
- 公开(公告)号:EP0962968A2 公开(公告)日:1999-12-08
- 发明人: Sakamoto, Sadaaki, c/o (A170) Int. Prop. Dept. , Sunahara, Hirofumi, c/o (A170) Int. Prop. Dept. , Nishide, Mitsuyoshi, c/o (A170) Int. Prop. Dept.
- 申请人: Murata Manufacturing Co., Ltd.
- 申请人地址: 26-10, Tenjin 2-chome Nagaokakyo-shi Kyoto-fu 617-8555 JP
- 专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人地址: 26-10, Tenjin 2-chome Nagaokakyo-shi Kyoto-fu 617-8555 JP
- 代理机构: Schoppe, Fritz, Dipl.-Ing.
- 优先权: JP15715998 19980605; JP20487298 19980721
- 主分类号: H01L21/48
- IPC分类号: H01L21/48
摘要:
The invention provides a method of producing a multi-layer ceramic substrate comprising a laminated member having a plurality of ceramic layers made of a ceramic insulating material and a wiring conductor, comprising the steps of: preparing a raw compact (1g) having the plurality of the laminated ceramic green sheets (2g - 8g) containing the ceramic insulating material and the wiring conductor (13 - 18); providing raw sheet type bases (48, 49) on the principal plane at both ends with respect to the lamination direction of the raw compact (1g), the raw sheet type bases (48, 49) containing a ceramic not to be sintered at the baking temperature of the raw compact (1g); baking the raw compact (1g) in the state interposed between the sheet type bases (48, 49) so as to obtain the laminated member; and eliminating the unsintered sheet type bases (48, 49); wherein the heat expansion coefficient difference of the sheet type bases (48, 49) and the laminated member after baking is 2.5 × 10 -6 degK -1 or more.
摘要(中):
本发明提供一种制造多层陶瓷基板的方法,该多层陶瓷基板包括具有由陶瓷绝缘材料和布线导体制成的多个陶瓷层的层叠构件,其包括以下步骤:制备具有多个 含有陶瓷绝缘材料的层压陶瓷生片(2g-8g)和布线导体(13-18); 在原料(1g)的层叠方向的两端的主面上设置原料片型基材(48,49),含有未烧结的陶瓷的原料片型基体(48,49) 原料的烘烤温度(1g); 在插入在片状基座(48,49)之间的状态下烘烤原料(1g),以获得层压构件; 并除去未烧结的片状基底(48,49)。 其特征在于,所述片状基体(48,49)与所述层叠体的烘烤后的热膨胀系数差为2.5×10 -6 degK -1以上。
公开/授权文献:
- EP0962968B1 Method of producing a multi-layer ceramic substrate 公开/授权日:2006-06-14