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    • 84. 发明公开
    • Integrated semiconductor laser and waveguide device
    • Integriertes Halbleiterlaser-Wellenleiter-Element
    • EP1372229A1
    • 2003-12-17
    • EP02254072.8
    • 2002-06-12
    • Agilent Technologies Inc., A Delaware Corporation
    • Berry, Graham MichaelBooij, WilfredSilver, Mark
    • H01S5/026H01S5/22
    • H01S5/026H01S5/0265H01S5/22H01S5/2205
    • The present invention relates to an integrated semiconductor laser and waveguide device, and in particular a buried heterojunction laser (3) that is optically coupled with a buried waveguide electro-absorption (EA) optical modulator (5). The device is fabricated on a common substrate (2) on which a number of semiconductor layers are deposited. The laser component (3) and the waveguide component (5) are coupled via an active layer (10). The laser component (3) includes a laser current conduction region (4) and adjacent said laser current conduction region a laser current confinement region (41). The waveguide component (5) includes a waveguide current conduction region (104) and adjacent said waveguide current conduction region a waveguide current confinement region (141). The laser current confinement region (41) comprises a first current blocking structure (28) formed from grown semiconductor layers (22,24). The waveguide current confinement region (141) comprises a second current blocking structure (40) formed from grown semiconductor layers (42,44) and includes also an extension (128) of the first current blocking structure (28), said extension (128) being interposed between the second current blocking structure (40) and the waveguide current conduction region (104). Because each of the components (3,5) is flanked by current confinement regions (41,141) of differing structures, the resistive and capacitative properties of each of the current confinement regions (41,141) can be selected to optimise the performance of that component (3,5) for a particular use.
    • 本发明涉及一种集成半导体激光器和波导器件,特别涉及一种与埋入波导电吸收(EA)光调制器(5)光学耦合的掩埋异质结激光器(3)。 该器件制造在其上淀积多个半导体层的公共衬底(2)上。 激光组件(3)和波导组件(5)经由有源层(10)耦合。 激光器部件(3)包括激光电流传导区域(4),并且与激光电流限制区域(41)相邻。 波导部件(5)包括波导电流传导区域(104),并且邻近所述波导电流传导区域波导管限制区域(141)。 激光电流限制区域(41)包括由生长的半导体层(22,24)形成的第一电流阻挡结构(28)。 波导电流限制区域(141)包括由生长的半导体层(42,44)形成的第二电流阻挡结构(40),并且还包括第一电流阻挡结构(28)的延伸部(128),所述延伸部(128) 插入在第二电流阻挡结构(40)和波导电流传导区(104)之间。 因为每个组分(3,5)的侧面是不同结构的电流限制区域(41,141),所以可以选择每个电流限制区域(41,141)的电阻和电容性质以优化该组分(3 ,5)用于特定用途。
    • 85. 发明公开
    • Integrated semiconductor laser and waveguide device
    • 集成半导体激光器和波导装置
    • EP1372228A1
    • 2003-12-17
    • EP02254069.4
    • 2002-06-12
    • Agilent Technologies, Inc. - a Delaware corporation -
    • Booij, WilfredSilver, MarkBerry, Graham Michael
    • H01S5/026H01S5/22
    • H01S5/026H01S5/0265H01S5/06226H01S5/22H01S5/2205
    • The present invention relates to an integrated semiconductor laser and waveguide device, and in particular a buried heterojunction laser (1) that is optically coupled with a ridge waveguide electro-absorption (EA) optical modulator (3) having a raised ridge structure (33). The device is formed on a single semiconductor substrate (2) on which a plurality of semiconductor layers are grown, including at least one active layer (10) through which optical radiation (25) is coupled from the laser (1) to the waveguide (3). Semiconductor layers (12,32) above the active layer (10) form a laser current conduction region (4), and semiconductor layers adjacent the active layer (10) from a laser current confinement region (24). The ridge structure (33) is formed from one or more layers (32) used also to form the laser current conduction region (4). The layers used to form the laser current confinement region (24) do not extend adjacent the ridge structure (33).
    • 本发明涉及集成半导体激光器和波导器件,特别是与具有凸脊结构(33)的脊形波导电吸收(EA)光调制器(3)光学耦合的埋入式异质结激光器(1) 。 该器件形成在其上生长多个半导体层的单个半导体衬底(2)上,该半导体衬底包括至少一个有源层(10),光辐射(25)通过该有源层从激光器(1)耦合到波导 3)。 在有源层(10)上方的半导体层(12,32)形成激光电流传导区域(4),以及从激光电流限制区域(24)与有源层(10)相邻的半导体层。 脊结构(33)由也用于形成激光电流传导区域(4)的一个或多个层(32)形成。 用于形成激光电流限制区域(24)的层不邻近脊结构(33)延伸。
    • 87. 发明公开
    • Buried mesa semiconductor device
    • Halbleitervorrichtung mit vergrabener Mesa
    • EP1134858A1
    • 2001-09-19
    • EP00301819.9
    • 2000-03-06
    • Agilent Technologies Inc. a Delaware Corporation
    • Berry, Graham MichaelAmos, Sean DavidBhat, Jerome Chandra
    • H01S5/227
    • H01S5/227H01S5/2205H01S5/2222H01S5/2227
    • The present invention relates to a buried mesa semiconductor device such as a laser diode with reduced leakage currents past the heterojunction, and to a method of forming such a device. The method comprises the steps of: growing a semiconductor wafer (1) with a plurality of layers including a substrate (2) and an active layer (6); depositing a mask (52) on the wafer (1) which defines one or more mesa regions (51) ; etching the wafer (1) to remove semiconductor layers to form a mesa structure (51) above the substrate (2), each mesa region (51) having mesa sides (53,54) extending upwards from the substrate (2) and between the mesa sides (53,54) a mesa top (63,64,65); growing one or more current confining semiconductor layers (56A,59A) to cover the mesa sides (53,54); removing part of the mask (52) along a part (64,65) of the top of the mesa adjacent the mesa sides (53,54); growing a leakage current confining semiconductor layer (68A) on a previous current confining layer (59A) so that the leakage current confining semiconductor layer (68A) extends to overlie partly (64,65) the mesa top adjacent said mesa sides (53,54); and removing the residual mask (62) and growing above the mesa top (63,64,65) one or more electrical contact semiconductor layers (75) by which a confined electrical current may be applied through the mesa (51) and substrate (2).
    • 本发明涉及一种埋入式半导体器件,例如具有减小的漏电流通过异质结的激光二极管,以及形成这种器件的方法。 该方法包括以下步骤:生长具有包括衬底(2)和活性层(6)的多个层的半导体晶片(1); 在限定一个或多个台面区域(51)的晶片(1)上沉积掩模(52); 蚀刻晶片(1)以去除半导体层以在基板(2)上方形成台面结构(51),每个台面区域(51)具有从基板(2)向上延伸的台面侧(53,54) 台面(53,54)台面(63,64,65); 生长一个或多个电流限制半导体层(56A,59A)以覆盖台面侧面(53,54); 沿着台面顶部邻近台面侧面(53,54)的部分(64,65)去除面罩(52)的一部分; 在先前的电流限制层(59A)上生长泄漏电流限制半导体层(68A),使得限制半导体层(68A)的泄漏电流延伸到邻近所述台面侧(53,54)的台面顶部(64,65) ); 以及去除所述残留掩模(62)并在所述台面顶部(63,64,65)之上生长一个或多个电接触半导体层(75),通过所述电接触半导体层可以通过所述台面(51)和衬底(2)施加受限制的电流 )。
    • 88. 发明公开
    • SEMICONDUCTOR LASER
    • 半导体激光器
    • EP1120872A1
    • 2001-08-01
    • EP99943254.5
    • 1999-09-09
    • Sharp Kabushiki Kaisha
    • TANEYA, MototakaTAKATANI, KunihiroOHMI, Susumu
    • H01S5/22H01S5/343
    • B82Y20/00H01S5/0021H01S5/2004H01S5/2086H01S5/2205H01S5/2206H01S5/221H01S5/2218H01S5/222H01S5/2231H01S5/3213H01S5/3216H01S5/32325H01S5/32341H01S5/34333
    • An InGaAlN-based semiconductor laser device, comprising a first layer of a first conductivity type, an active layer having a smaller forbidden band than that of the first layer, and a second layer of a second conductivity type having a larger forbidden band than that of the active layer. The second layer includes a flat region and a stripe-shaped projecting structure. A stripe-shaped optical waveguide forming layer of the second conductivity type having a larger refractive index than that of the second layer is formed on the stripe-shaped projecting structure. A current-constricting layer of the first conductivity type or of a high resistance is formed for covering a top surface of the flat region of the second layer, a side surface of the projecting structure of the second layer, and a side surface of the optical waveguide forming layer. A difference between a thermal expansion coefficient of the current-constricting layer and a thermal expansion coefficient of the second layer is in the range of -4 × 10 -9 /°C to +4 x 10 -9 /°C.
    • 一种InGaAlN基半导体激光器件,包括第一导电类型的第一层,具有比第一层的禁带更小的禁带的活性层以及具有比第一层的禁带更大的禁带的第二导电类型的第二层, 活动层。 第二层包括平坦区域和条形突出结构。 在条形突出结构上形成折射率大于第二层的第二导电类型的条形光波导形成层。 形成第一导电类型或高电阻的电流狭窄层,用于覆盖第二层的平坦区域的顶表面,第二层的凸起结构的侧表面以及光学元件的侧表面 波导形成层。 电流狭窄层的热膨胀系数与第二层的热膨胀系数之间的差值在-4×10 -9 /℃至+ 4×10 -9 /℃的范围内。