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71. 发明公开

EP3042404A1 SYSTEM AND METHOD FOR VENTING PRESSURIZED GAS FROM A BATTERY MODULE 有权转让
标题翻译：系统在VERFAHREN ZUM ENTLASTEN VON DRUCKGAS AUS EINEM BATTERIEMODUL
公开(公告)号：EP3042404A1
公开(公告)日：2016-07-13
申请号：EP14756220.1
申请日：2014-08-18
申请人： Johnson Controls Technology Company
发明人： DEKEUSTER, Richard M. , MACK, Robert J. , SOLESKI, Edward J. , TYLER, Matthew R. , CASH, Stephen D. , BALK, Mikhail S.
IPC分类号： H01M2/10 , H01M2/12 , H01M10/42 , H01M2/20 , H01M2/30 , H01M10/613 , H01M10/625 , H01M10/647 , H01M10/6551
CPC分类号： H01M2/22 , B60L1/003 , B60L1/02 , B60L1/14 , B60L3/0046 , B60L3/12 , B60L11/123 , B60L11/14 , B60L11/1803 , B60L11/1851 , B60L11/1861 , B60L11/1864 , B60L11/1874 , B60L11/1877 , B60L11/1879 , B60L15/20 , B60L2210/10 , B60L2210/40 , B60L2240/34 , B60L2240/545 , B60L2240/547 , B60L2240/549 , B60L2250/10 , B60L2260/26 , B60L2270/20 , B60R16/03 , B60R16/033 , G01R31/025 , G01R31/362 , G01R31/3627 , H01H47/325 , H01M2/1077 , H01M2/1205 , H01M2/1211 , H01M2/1252 , H01M2/20 , H01M2/206 , H01M2/24 , H01M2/305 , H01M2/32 , H01M2/34 , H01M2/342 , H01M4/661 , H01M4/665 , H01M10/04 , H01M10/0413 , H01M10/058 , H01M10/425 , H01M10/4257 , H01M10/482 , H01M10/486 , H01M10/6551 , H01M2010/4271 , H01M2010/4278 , H01M2200/103 , H01M2220/20 , H01M2250/20 , H01R12/716 , H02H7/18 , H02J7/0021 , H02J7/0063 , H05K1/0262 , H05K1/0263 , H05K1/18 , H05K3/32 , H05K2201/10492 , H05K2201/1053 , H05K2201/10545 , Y02T10/6217 , Y02T10/645 , Y02T10/7005 , Y02T10/7016 , Y02T10/7044 , Y02T10/705 , Y02T10/7061 , Y02T10/7077 , Y02T10/7216 , Y02T10/7241 , Y02T10/7275 , Y10T29/49108 , Y10T29/4911 , Y10T29/49114
摘要： A method of manufacturing a battery module for use in a vehicle is presented. The method may include disposing battery cells into a lower housing and disposing a lid assembly over the battery cells. The lid assembly may include a lid and bus bar interconnects disposed on the lid. The method may also include disposing a printed circuit board (PCB) assembly onto the lid assembly and electrically coupling portions of the lid assembly, portions of the PCB assembly, and the battery cells to each other.
摘要翻译：提供一种母线，其包括包括第一材料的第一端和包括第二材料的第二端和制造方法。第一端被设计成耦合到电池模块的第一电池单元的端子，并且包括设置在第一端上的第一环，设计成接收和围绕电池模块的第一电池单元的端子。第二端被设计成耦合到电池模块的第二电池单元的端子，并且包括设置在第二端上的第二套环，其设计成接收和围绕电池模块的第二电池的端子。电池模块的第一和第二电池彼此相邻。此外，母线包括电连接和机械耦合第一端和第二端的接头。

72. 发明公开

EP3042212A1 BATTERY MODULE PRINTED CIRCUIT BOARD ASSEMBLY SYSTEM AND METHOD 有权转让
标题翻译：系统VERFAHREN ZUR LEITERPLATTENMONTAGE EINES BATTERIEMODULS
公开(公告)号：EP3042212A1
公开(公告)日：2016-07-13
申请号：EP14761767.4
申请日：2014-08-25
申请人： Johnson Controls Technology Company
发明人： DULLE, Ronald J. , GUNDERSON, Mark D. , THIEME, Bryan L.
IPC分类号： G01R31/36 , H01M2/10 , H01M10/42 , H01M10/48 , H02J7/00 , H01M2/12 , H01M2/20 , H01M2/30 , H01M10/613 , H01M10/625 , H01M10/647 , H01M10/6551
CPC分类号： H01M2/22 , B60L1/003 , B60L1/02 , B60L1/14 , B60L3/0046 , B60L3/12 , B60L11/123 , B60L11/14 , B60L11/1803 , B60L11/1851 , B60L11/1861 , B60L11/1864 , B60L11/1874 , B60L11/1877 , B60L11/1879 , B60L15/20 , B60L2210/10 , B60L2210/40 , B60L2240/34 , B60L2240/545 , B60L2240/547 , B60L2240/549 , B60L2250/10 , B60L2260/26 , B60L2270/20 , B60R16/03 , B60R16/033 , G01R31/025 , G01R31/362 , G01R31/3627 , H01H47/325 , H01M2/1077 , H01M2/1205 , H01M2/1211 , H01M2/1252 , H01M2/20 , H01M2/206 , H01M2/24 , H01M2/305 , H01M2/32 , H01M2/34 , H01M2/342 , H01M4/661 , H01M4/665 , H01M10/04 , H01M10/0413 , H01M10/058 , H01M10/425 , H01M10/4257 , H01M10/482 , H01M10/486 , H01M10/6551 , H01M2010/4271 , H01M2010/4278 , H01M2200/103 , H01M2220/20 , H01M2250/20 , H01R12/716 , H02H7/18 , H02J7/0021 , H02J7/0063 , H05K1/0262 , H05K1/0263 , H05K1/18 , H05K3/32 , H05K2201/10492 , H05K2201/1053 , H05K2201/10545 , Y02T10/6217 , Y02T10/645 , Y02T10/7005 , Y02T10/7016 , Y02T10/7044 , Y02T10/705 , Y02T10/7061 , Y02T10/7077 , Y02T10/7216 , Y02T10/7241 , Y02T10/7275 , Y10T29/49108 , Y10T29/4911 , Y10T29/49114
摘要： A method of manufacturing a battery module for use in a vehicle is presented. The method may include disposing battery cells into a lower housing and disposing a lid assembly over the battery cells. The lid assembly may include a lid and bus bar interconnects disposed on the lid. The method may also include disposing a printed circuit board (PCB) assembly onto the lid assembly and electrically coupling portions of the lid assembly, portions of the PCB assembly, and the battery cells to each other.
摘要翻译：提供一种母线，其包括包括第一材料的第一端和包括第二材料的第二端和制造方法。第一端被设计成耦合到电池模块的第一电池单元的端子，并且包括设置在第一端上的第一环，设计成接收和围绕电池模块的第一电池单元的端子。第二端被设计成耦合到电池模块的第二电池单元的端子，并且包括设置在第二端上的第二套环，其设计成接收和围绕电池模块的第二电池的端子。电池模块的第一和第二电池彼此相邻。此外，母线包括电连接和机械耦合第一端和第二端的接头。

73. 发明公开

EP3040450A1 METHOD FOR MANUFACTURING METAL-FILLED MICROSTRUCTURE 审中-公开
标题翻译：制造金属填充微结构的方法
公开(公告)号：EP3040450A1
公开(公告)日：2016-07-06
申请号：EP14839465.3
申请日：2014-08-21
申请人： Fujifilm Corporation
发明人： YAMASHITA Kosuke
IPC分类号： C25D1/00 , C25D1/10 , C25D11/04 , C25D11/24
CPC分类号： C25D1/20 , C25D1/006 , C25D1/10 , C25D3/38 , C25D11/045 , C25D11/20 , C25D11/24 , G01R1/06 , H01L24/27 , H01R12/7076 , H01R2201/20 , H05K3/32 , H05K2203/162
摘要： An object of the present invention is to provide a method for manufacturing a metal-filled microstructure, capable of easily filling micropores with metal and suppressing the generation of residual stress caused by metal filling. A method for manufacturing a metal-filled microstructure according to the present invention includes: an anodic oxidation treatment step of anodically oxidizing a single surface of an aluminum substrate to form an anodic oxidation film on the single surface of the aluminum substrate, the anodic oxidation film including micropores, which are present in a thickness direction, and a barrier layer which is present in a bottom portion of the micropores; a barrier layer removal step of removing the barrier layer of the anodic oxidation film after the anodic oxidation treatment step; a metal filling step of filling the inside of the micropores with metal through an electroplating treatment after the barrier layer removal step; and a substrate removal step of removing the aluminum substrate to obtain a metal-filled microstructure after the metal filling step.
摘要翻译：本发明的一个目的是提供一种用于制造金属填充微结构的方法，其能够容易地用金属填充微孔并且抑制由金属填充引起的残余应力的产生。根据本发明的用于制造金属填充微结构的方法包括：阳极氧化处理步骤，阳极氧化铝基板的单个表面以在铝基板的单个表面上形成阳极氧化膜，阳极氧化膜包括存在于厚度方向上的微孔和存在于微孔底部中的阻挡层; 在阳极氧化处理步骤之后去除阳极氧化膜的阻挡层的阻挡层去除步骤; 金属填充步骤，在阻挡层去除步骤之后通过电镀处理用金属填充微孔的内部; 和在金属填充步骤之后除去铝基板以获得金属填充的微结构的基板去除步骤。

74. 发明授权

EP2515622B1 Light emitting device array 有权转让
标题翻译：发光组件
公开(公告)号：EP2515622B1
公开(公告)日：2016-06-01
申请号：EP12163689.8
申请日：2012-04-11
申请人： LG Innotek Co., Ltd.
发明人： Lee, Sangwoo , Park, Dongwook , Jin, Hongboem
IPC分类号： H05K1/02 , H01L33/62 , H01L33/48 , H01L33/64 , H05K1/11 , H05K1/18 , H01L33/60
CPC分类号： H01L25/075 , H01L24/73 , H01L24/97 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/647 , H01L2224/32245 , H01L2224/48247 , H01L2224/48257 , H01L2224/49107 , H01L2224/73265 , H01L2224/97 , H01L2924/12035 , H01L2924/12041 , H05K1/0209 , H05K1/11 , H05K1/181 , H05K3/32 , H05K2201/09781 , H05K2201/10106 , H05K2201/10969 , H01L2224/48091 , H01L2924/00014 , H01L2924/00012 , H01L2224/85 , H01L2924/00

75. 发明授权

EP2374335B1 METHOD AND APPARATUS FOR MANUFACTURING A FLEXIBLE ELECTRONIC PRODUCT 有权
标题翻译： VERFAHREN UND VORRICHTUNG ZUR HERSTELLUNG EINES FLEXIBLEN ELEKTRONISCHEN PRODUKTS
公开(公告)号：EP2374335B1
公开(公告)日：2016-05-25
申请号：EP09771431.5
申请日：2009-12-16
申请人： Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO
发明人： VAN DEN BRAND, Jeroen , DIETZEL, Andreas Heinrich
IPC分类号： H05K1/18 , H05K3/32 , H01L23/538 , H01L23/498 , H01L21/48 , H01L23/00 , H05K1/02 , H05K3/00 , H05K3/10 , H05K3/12
CPC分类号： H05K1/185 , H01L21/486 , H01L23/49827 , H01L23/4985 , H01L23/5389 , H01L24/19 , H01L24/76 , H01L24/97 , H01L2224/04105 , H01L2224/32245 , H01L2224/73267 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01082 , H01L2924/07811 , H01L2924/12042 , H01L2924/14 , H05K1/0269 , H05K1/186 , H05K1/189 , H05K3/0032 , H05K3/0035 , H05K3/105 , H05K3/107 , H05K3/1258 , H05K3/32 , H05K2201/0108 , H05K2201/10674 , H05K2203/107 , H05K2203/1469 , H05K2203/1545 , H05K2203/1581 , Y10T29/49117 , Y10T29/49126 , Y10T29/49144 , H01L2924/00
摘要： A method is described for manufacturing a flexible electronic product, the method comprising the steps of - providing (S1) a flexible foil (10; 110) with a first and a second, mutually opposite main side (11, 12; 111, 112), - placing (S2) a component (30; 130) at the first foil at the first main side (11; 111), the component having at least one electrical terminal (31; 131) facing towards the second main side (12; 112) - estimating (S3) a position of the at least one electrical terminal (131), - adaptively forming (S4) a conductive path (40A, 40B, 40C) to the at least one electrical terminal, based on said estimated position.
摘要翻译：描述了一种用于制造柔性电子产品的方法，所述方法包括以下步骤：提供（S1）具有第一和第二相互相对的主侧（11,12; 111,112）的柔性箔（10; 110）在所述第一主侧（11; 111）的第一箔处放置（S2）部件（30; 130），所述部件具有面向所述第二主侧面（12; 111）的至少一个电端子（31; 131）基于所述估计位置，估计（S3）所述至少一个电气终端（131）的位置， - 自适应地形成（S4）导电路径（40A，40B，40C）到所述至少一个电气终端。

76. 发明公开

EP2890417A4 HALL SENSOR MOUNTING IN AN IMPLANTABLE BLOOD PUMP 审中-公开
标题翻译：霍尔传感器的可植入的血泵的安装
公开(公告)号：EP2890417A4
公开(公告)日：2016-04-27
申请号：EP13832936
申请日：2013-08-30
申请人： THORATEC CORP
发明人： SCHIMPF SAMUEL , MCCHRYSTAL MARK , STARK JOSEPH C III , SIEBENHAAR ANDRE
IPC分类号： A61M1/10
CPC分类号： A61M1/1086 , A61M1/101 , A61M1/1012 , A61M1/1015 , A61M1/1017 , A61M1/1031 , A61M1/1036 , A61M1/12 , A61M1/122 , A61M2205/3317 , A61M2205/3334 , A61M2205/3365 , A61M2207/00 , F04D13/064 , F04D15/0077 , G01B7/003 , G01B7/30 , G01D5/142 , G01R33/072 , H05K1/028 , H05K1/119 , H05K1/189 , H05K3/30 , H05K3/303 , H05K3/32 , H05K3/4691 , H05K2201/052 , H05K2201/10151 , Y10T29/49009 , Y10T29/49128
摘要： A molded interconnect device can carry a Hall sensor for transducing a position of a rotor of the implantable blood pump. The molded interconnect device includes one or more integrated electronic circuit traces configured to electrically connect the hall sensor with a printed circuit board of the implantable blood pump, and the molded interconnect device is configured to be mounted to the printed circuit board.

77. 发明公开

EP3002511A1 DISPOSITIF À COMPOSANT SEMI-CONDUCTEUR MONTÉ SUR UN DISSIPATEUR DE CHALEUR, PROCÉDÉ DE MONTAGE, ET DISPOSITIF D'ÉCLAIRAGE POUR VÉHICULE AUTOMOBILE COMPORTANT UN TEL DISPOSITIF 有权
标题翻译：随着半导体器件问题安装在散热片和安装方法和设备，例如广泛照明装置机动车DEVICE
公开(公告)号：EP3002511A1
公开(公告)日：2016-04-06
申请号：EP15186929.4
申请日：2015-09-25
申请人： VALEO VISION
发明人： MORNET, Eric , LETOUMELIN, Rémi , PUENTE, Jean-Claude , DUCLOUX, Bruno , YACOUBI, Nadia , MATTE, Fanck , JACQUEMIN, Didier
IPC分类号： F21V29/70 , F21S8/10
CPC分类号： F21S45/47 , B60Q1/0088 , F21S43/14 , F21S43/19 , F21S45/00 , H05K1/11 , H05K1/181 , H05K3/303 , H05K3/32 , H05K7/20409
摘要： Dispositif comprenant au moins un composant semi-conducteur (1) connecté à un élément d'interconnexion électrique (5), lequel élément d'interconnexion électrique (5) est fixé sur un dissipateur (2) de chaleur et connecté à un faisceau (3) de fils électriques, le faisceau (3) est relié mécaniquement et électriquement à l'élément d'interconnexion électrique (5) par un connecteur (7) unique, le faisceau (3) étant relié au dissipateur (2) par un moyen de tenue (8).
摘要翻译：包含在电连接元件连接到至少一个半导体部件的装置，所述电连接元件附接至散热器和连接到一组电线，该组是由一个单一的连接器机械和电连接到所述电连接元件中，组是由保持装置连接到所述散热器。

78. 发明公开

EP2984476A1 SYSTEMS AND METHODS FOR ENCAPSULATING ELECTRONICS IN A MOUNTABLE DEVICE 审中-公开
标题翻译：系统和方法电子设备的一个安装包胶
公开(公告)号：EP2984476A1
公开(公告)日：2016-02-17
申请号：EP14772685.5
申请日：2014-02-12
申请人： Google Inc.
发明人： ETZKORN, James
IPC分类号： G01N27/327 , G01N27/416 , G01N33/487
CPC分类号： A61B5/14546 , A61B3/101 , A61B5/0002 , A61B5/14532 , A61B5/1473 , A61B5/1477 , A61B5/6813 , A61B5/6821 , A61B2560/0214 , A61B2562/12 , B29D11/00817 , C12Q1/006 , G01N27/3272 , G02B1/043 , G02C7/04 , G02C7/049 , G02C7/083 , H05K1/185 , H05K3/32 , H05K2201/10098 , H05K2201/10151 , H05K2203/1469 , Y10T29/49018 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49158 , Y10T29/49163
摘要： A mountable device includes a bio-compatible structure embedded in a polymer that defines at least one mounting surface. The bio-compatible structure includes an electronic component having electrical contacts, sensor electrodes, and electrical interconnects between the sensor electrodes and the electrical contacts. The bio-compatible structure is fabricated such that it is fully encapsulated by a bio-compatible material, except for the sensor electrodes. In the fabrication, the electronic component is positioned on a first layer of bio-compatible material and a second layer of bio-compatible material is formed over the first layer of bio-compatible material and the electronic component. The electrical contacts are exposed by removing a portion of the second layer, a conductive pattern is formed to define the sensor electrodes and electrical interconnects, and a third layer of bio-compatible material is formed over the conductive pattern. The sensor electrodes are exposed by removing a portion of the third layer.

79. 发明公开

EP2976929A1 PROCÉDÉ DE FABRICATION D'UN CIRCUIT IMPRIMÉ FLEXIBLE, CIRCUIT IMPRIMÉ FLEXIBLE OBTENU PAR CE PROCÉDÉ ET MODULE DE CARTE À PUCE COMPORTANT UN TEL CIRCUIT IMPRIMÉ FLEXIBLE 有权
标题翻译：制造电路板，用这种VEFAHREN方法生产的主板和芯片模块，包括这种电路板
公开(公告)号：EP2976929A1
公开(公告)日：2016-01-27
申请号：EP14712260.0
申请日：2014-03-19
申请人： Linxens Holding
发明人： MATHIEU, Christophe , BOUZID, Nordin
IPC分类号： H05K1/03 , H05K1/18 , G06K19/077 , H05K3/02
CPC分类号： G06K19/07747 , G06K19/07718 , G06K19/07722 , H01L2224/45144 , H01L2224/48091 , H01L2224/48228 , H01L2224/73265 , H01L2924/181 , H05K1/032 , H05K1/0393 , H05K1/189 , H05K3/022 , H05K3/305 , H05K3/32 , H05K2201/10287 , H05K2201/10674 , Y02P70/613 , H01L2924/00012 , H01L2924/00
摘要： The invention relates to a method for manufacturing a flexible circuit (3) for a chip card module (100). Said method comprises a step of producing electrically conductive contact pads (15) in a first sheet (11) of conductive material. A layer (8) of electrically insulating adhesive material is also used, either to adhere a second sheet (12) of electrically conductive material onto the first sheet of conductive material or to form an intermediate complex making it possible to perforate the layer of adhesive material before it is transferred onto the first sheet of conductive material. Regardless of which option is chosen, the method according to the invention makes it possible to avoid using a flexible substrate of plastic material (PET, PEN, polyimide) or composite material (glass/epoxy) to perform the structuring and metalization of the conductor tracks and contact pads used in the chip card modules. The adhesive material can be specially formulated to have intrinsic hot-melt properties compatible with an operation for inserting the electronic module into the recess of the chip card body without using an additional hot-melt adhesive. The invention also relates to a flexible circuit for a chip card manufactured using said method and to a chip card module comprising such a flexible circuit.

80. 发明公开

EP2961613A1 FLUID STRUCTURE WITH COMPRESSION MOLDED FLUID CHANNEL 有权转让
标题翻译：与受压液体道流体结构形式
公开(公告)号：EP2961613A1
公开(公告)日：2016-01-06
申请号：EP13876633.2
申请日：2013-07-29
申请人： Hewlett-Packard Development Company, L.P.
发明人： CHEN, Chien-Hua , CUMBIE, Michael, W.
IPC分类号： B41J2/16 , B41J2/14 , B41J2/045
CPC分类号： B41J2/1637 , B29C69/001 , B41J2/14016 , B41J2/1404 , B41J2/14145 , B41J2/14201 , B41J2/1433 , B41J2/155 , B41J2/1601 , B41J2/1603 , B41J2/1607 , B41J2/162 , B41J2/1623 , B41J2/1628 , B41J2/1632 , B41J2/1645 , B41J2002/14419 , B41J2002/14491 , B41J2202/19 , B41J2202/20 , H05K1/186 , H05K3/284 , H05K3/32 , H05K3/4007 , H05K2203/0228 , H05K2203/1316
摘要： In one example, a process for making a micro device assembly includes placing a micro device on a front part of a printed circuit board, molding a molding on the printed circuit board surrounding the micro device, and then forming a channel to the micro device in a back part of the printed circuit board.

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