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71. 发明公开

EP2722881A1 Power RF amplifiers 失效转让
标题翻译： HF-Leistungsverstärker
公开(公告)号：EP2722881A1
公开(公告)日：2014-04-23
申请号：EP12290353.7
申请日：2012-10-17
申请人： NXP Semiconductors B.V.
发明人： Bouisse, Gerard
IPC分类号： H01L23/64 , H01L23/66 , H01L23/00
CPC分类号： H01L27/0641 , H01L23/645 , H01L23/66 , H01L24/45 , H01L24/49 , H01L2223/6611 , H01L2223/6644 , H01L2223/6655 , H01L2224/45015 , H01L2224/49175 , H01L2224/49433 , H01L2924/00014 , H01L2924/3011 , H01L2924/30111 , H01L2224/45099 , H01L2924/00
摘要： A power transistor circuit uses first and second power transistors in differential mode. An inductor arrangement of inductors is formed by wire bonds between the drains. The transistors are in a mirrored configuration, and the inductor arrangement comprises wire bonds which extend between the drain connections across the space between the mirrored transistors.
摘要翻译：功率晶体管电路在差分模式下使用第一和第二功率晶体管。电感器的电感器布置由漏极之间的引线键合形成。晶体管是镜像配置，并且电感器装置包括在穿过镜像晶体管之间的空间的漏极连接之间延伸的引线键合。

72. 发明公开

EP2722410A1 Electrically conductive bonding material and method of bonding with the same 审中-公开
标题翻译：导电粘合剂材料，方法与材料和半导体器件键合，这已经被胶合到它
公开(公告)号：EP2722410A1
公开(公告)日：2014-04-23
申请号：EP13192408.6
申请日：2010-04-27
申请人： Hitachi Chemical Co., Ltd.
发明人： YASUDA, Yuusuke , MORITA, Toshiaki , IDE, Eiichi , INADA, Teiichi
IPC分类号： C22C1/05 , B22F1/00 , H01B1/22
CPC分类号： B22F1/0074 , C22C1/05 , H01B1/22 , H01L21/565 , H01L23/049 , H01L23/10 , H01L23/13 , H01L23/142 , H01L23/15 , H01L23/24 , H01L23/3107 , H01L23/3121 , H01L23/34 , H01L23/3735 , H01L23/488 , H01L23/492 , H01L23/49513 , H01L23/49562 , H01L23/498 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L25/072 , H01L2224/05147 , H01L2224/05639 , H01L2224/05655 , H01L2224/27334 , H01L2224/29005 , H01L2224/2901 , H01L2224/29078 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/29118 , H01L2224/29124 , H01L2224/29138 , H01L2224/29139 , H01L2224/29155 , H01L2224/29157 , H01L2224/2916 , H01L2224/29163 , H01L2224/29164 , H01L2224/29166 , H01L2224/29169 , H01L2224/29171 , H01L2224/29173 , H01L2224/29176 , H01L2224/29178 , H01L2224/29181 , H01L2224/29184 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/29309 , H01L2224/29311 , H01L2224/29318 , H01L2224/29324 , H01L2224/29338 , H01L2224/29339 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29363 , H01L2224/29364 , H01L2224/29366 , H01L2224/29369 , H01L2224/29371 , H01L2224/29373 , H01L2224/29376 , H01L2224/29378 , H01L2224/29381 , H01L2224/29384 , H01L2224/29387 , H01L2224/29893 , H01L2224/32225 , H01L2224/32245 , H01L2224/32505 , H01L2224/45015 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/48739 , H01L2224/48755 , H01L2224/48839 , H01L2224/48855 , H01L2224/49111 , H01L2224/49175 , H01L2224/73265 , H01L2224/83065 , H01L2224/83075 , H01L2224/832 , H01L2224/8384 , H01L2224/85205 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , H01L2924/13091 , H01L2924/15153 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/3511 , H01L2924/0541 , H01L2924/0501 , H01L2924/00014 , H01L2924/01001 , H01L2924/01018 , H01L2924/01007 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2924/2076 , H01L2924/01202 , H01L2224/83205
摘要： According to the present invention an electrically conductive bonding material comprises silver particles (202), silver oxides particles (203), a dispersant comprising an organic material containing not more than 30 carbon atoms, and an organic solvent having a boiling point of not higher than 350°C as essential components. The total amount of the silver particles (202), the silver oxide particles (203), the dispersant, and the organic solvent is 100 mass parts and an amount of the organic solvent is not more than 90 mass parts. The silver particles (202) are in flake form; and the total amount of the silver particles (202), the silver oxide particles (203), the dispersant, and the organic solvent is in a range of 99.0% to 100% by weight.
摘要翻译：。根据导电接合材料的本发明包括银颗粒（202），银氧化物粒子（203），分散剂包括含有不超过30碳原子的有机材料，和在有机溶剂中具有不高于沸点 350℃作为必须成分。银粒子（202）的总量中，氧化物的银颗粒（203），分散剂，有机溶剂为100质量份，并且对有机溶剂的量不超过90质量份。银粒子（202）是薄片形式; 和银颗粒（202）的总量中，氧化物的银颗粒（203），分散剂，有机溶剂是在由范围为99.0％至100％重量。

74. 发明公开

EP2707897A1 STEUERGERÄT MIT EINER GETTERSCHICHT ZUM EINSATZ IN EINEM KRAFTFAHRZEUG 有权转让
标题翻译：有使用吸气剂在机动车辆控制单元
公开(公告)号：EP2707897A1
公开(公告)日：2014-03-19
申请号：EP12727271.4
申请日：2012-05-08
申请人： Conti Temic Microelectronic GmbH
发明人： HENNINGER, Jürgen , WIECZOREK, Matthias , URBANEK, Thomas , GEBHARDT, Marion , SCHUCH, Bernhard , REIF, Andreas , GOTTSCHLING, Stefan
IPC分类号： H01L23/26 , H01L23/10 , H01L23/055
CPC分类号： H05K5/069 , H01L23/055 , H01L23/10 , H01L23/26 , H01L2224/48091 , H01L2224/48228 , H01L2224/49175 , H01L2924/16152 , H05K3/306 , Y10T29/49139 , H01L2924/00014
摘要： The invention relates to a control device, in particular for a motor vehicle, comprising a housing (1) consisting of a housing cover (2) and a housing base (3), a sealing device (4) between the housing cover (2) and the housing base (3), at least one circuit carrier (5) having electrically conductive tracks, wherein at least one electronic component (6, 7) is disposed on the circuit carrier (5). Said control device further comprises at least one conductor structure (8) extending out of the interior of the housing (1), and at least one electrically conductive connecting line (9) which connects the electronic component (6, 7) to the conductor structure (8). A getter layer (10) is thermally sprayed on the inner face of the housing (1) to protect the metal parts (5, 6, 7, 8, 9, 11) which transmit current or data in the interior of the control device against corrosive gases, wherein the getter layer (10) has a particularly high specific surface area by comparison with for example galvanically applied getter layers.

75. 发明公开

EP2700158A1 AMPLIFIERS AND RELATED INTEGRATED CIRCUITS 有权转让
标题翻译： VERSTÄRKERUNDZUGEHÖRIGEINTEGRIERTE SCHALTUNGEN
公开(公告)号：EP2700158A1
公开(公告)日：2014-02-26
申请号：EP11729462.9
申请日：2011-04-20
申请人： Freescale Semiconductor, Inc.
发明人： NOORI, Basim , BOUISSE, Gerard , JONES, Jeffrey , NANAN, Jean-Christophe , PLA, Jaime
IPC分类号： H03F1/02
CPC分类号： H03F1/565 , H01L2224/49175 , H03F1/0288 , H03F3/195 , H03F3/21 , H03F3/68 , H03F2200/222 , H03F2200/387 , H03F2200/423 , H03F2200/451
摘要： Apparatus are provided for amplifier systems and related circuits are provided. An exemplary circuit includes a main amplifier arrangement, first impedance matching circuitry coupled between the output of the main amplifier arrangement and a first circuit output, a peaking amplifier arrangement, and second impedance matching circuitry coupled between the output of the peaking amplifier arrangement and a second output of the circuit. In one exemplary embodiment, the first impedance matching circuitry and the second impedance matching circuitry have different circuit topologies and different physical topologies.
摘要翻译：提供放大器系统的装置，并提供相关的集成电路。示例性集成电路包括主放大器装置，耦合在主放大器装置的输出端和集成电路的第一输出端之间的第一阻抗匹配电路，峰值放大器装置和耦合在峰化放大器的输出端之间的第二阻抗匹配电路布置和集成电路的第二输出。在一个示例性实施例中，第一阻抗匹配电路和第二阻抗匹配电路具有不同的电路拓扑和不同的物理拓扑。

76. 发明授权

EP1260192B1 Beleuchtungsvorrichtung 有权
公开(公告)号：EP1260192B1
公开(公告)日：2013-11-27
申请号：EP02008012.3
申请日：2002-04-10
申请人： Ivoclar Vivadent AG
发明人： Burtscher, Peter , Plank, Wolfgang , Rohner, Gottfried
IPC分类号： A61C13/15 , A61C19/00
CPC分类号： A61C19/003 , A61C19/004 , H01L2224/48091 , H01L2224/49175 , H01L2924/00014

77. 发明公开

EP2146372A3 Leistungselektronische Verbindungseinrichtung und Herstellungsverfahren hierzu 审中-公开
标题翻译：电力电子连接装置及其制造方法
公开(公告)号：EP2146372A3
公开(公告)日：2013-11-06
申请号：EP09008708.1
申请日：2009-07-03
申请人： Semikron Elektronik GmbH & Co. KG Patentabteilung
发明人： Scheuermann, Uwe
IPC分类号： H01L21/60 , H01L23/498
CPC分类号： H01L24/85 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05639 , H01L2224/0612 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45147 , H01L2224/4556 , H01L2224/45565 , H01L2224/45599 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/48739 , H01L2224/48839 , H01L2224/49175 , H01L2224/73265 , H01L2224/8384 , H01L2224/85439 , H01L2224/8584 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/2076 , H01L2224/45644 , H01L2924/01201 , H01L2224/78 , H01L2924/00 , H01L2924/00015
摘要： Die Erfindung beschreibt eine leistungselektronische Verbindungseinrichtung mit einer ersten (120) und einer zweiten (220) voneinander elektrisch isolierten Kontaktfläche, mit jeweils mindestens einem einer Edelmetalloberfläche (160,260) aufweisenden Kontaktbereich (16,26) auf diesen Kontaktflächen, je einer auf den Kontaktbereichen angeordneten Sintermetallschicht (18,28) und einem flexiblen Verbindungselement (4). Hierbei weist dieses Verbindungselement eigene dritte (40) und vierte (42) Kontaktbereiche mit jeweils einer Edelmetalloberfläche auf. Ebenso sind diese dritten und vierten Kontaktbereiche mit den Sintermetallschichten der ersten und zweiten Kontaktflächen elektrisch leitend verbunden. Die erste Kontaktfläche (120) kann auf einer Metallisierung (14) eines Substrats angeordnet sein une die zweite Kontaktfläche (220) kann auf einem Leistungshalbleiterbauelement (1) angeordnet sein.

78. 发明公开

EP2654192A2 Control chip for a power inverter comprising voltage level shifters 有权转让
标题翻译： Steuer-Chip mit Spannungspegel-Umsetzernfüreinen Wechselrichter
公开(公告)号：EP2654192A2
公开(公告)日：2013-10-23
申请号：EP13161780.5
申请日：2013-03-28
申请人： International Rectifier Corporation
发明人： Giandalia, Marco , Takahashi, Toshio , Grasso, Massimo
IPC分类号： H02M7/537 , H01L27/02
CPC分类号： H02M7/537 , H01L2224/48137 , H01L2224/49171 , H01L2224/49175 , H02M7/53875 , H01L2924/00
摘要： An integrated circuit (IC) includes a logic circuit (320) monolithically formed on the IC. The logic circuit is configured to generate modulation signals (330a, 330b, 330c; 332a, 332b, 332c) for controlling power switches of a power inverter. The logic circuit (320) generates the modulation signals based on at least one input value (idx1, idx2, idx3). The IC further includes a voltage level shifter (334a, 334b, 334c) monolithically formed on the IC. The voltage level shifter is configured to shift the modulation signals to a voltage level suitable for driving the power switches of the power inverter. The logic circuit can be a digital logic circuit and the input value can be a digital input value. The IC can also include a sense circuit (322) monolithically formed on the IC. The sense circuit is configured to generate the input value (idx2).
摘要翻译：集成电路（IC）包括在IC上单片地形成的逻辑电路（320）。逻辑电路被配置为产生用于控制功率逆变器的功率开关的调制信号（330a，330b，330c; 332a，332b，332c）。逻辑电路（320）基于至少一个输入值（idx1，idx2，idx3）产生调制信号。 IC还包括在IC上单片地形成的电压电平移位器（334a，334b，334c）。电压电平移位器被配置为将调制信号移动到适于驱动功率逆变器的功率开关的电压电平。逻辑电路可以是数字逻辑电路，输入值可以是数字输入值。 IC还可以包括在IC上单片地形成的感测电路（322）。感测电路被配置为生成输入值（idx2）。

79. 发明公开

EP2637302A1 Microwave semiconductor amplifier 有权
标题翻译： Mikrowellen-Halbleiterverstärker
公开(公告)号：EP2637302A1
公开(公告)日：2013-09-11
申请号：EP12199817.3
申请日：2012-12-31
申请人： Kabushiki Kaisha Toshiba
发明人： Takagi, Kazutaka
IPC分类号： H03F1/56 , H03F3/60 , H01L23/64
CPC分类号： H03F3/04 , H01L23/64 , H01L23/66 , H01L2223/6655 , H01L2224/48137 , H01L2224/49175 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H03F1/565 , H03F3/60 , H03F2200/222 , H03F2200/387 , H03F2200/423 , H01L2924/00
摘要： A microwave semiconductor amplifier includes a semiconductor amplifier element (14), an input matching circuit (12) and an output matching circuit (20). The semiconductor amplifying element (14) includes an input electrode and an output electrode and has a capacitive output impedance. The input matching circuit (12) is connected to the input electrode. The output matching circuit (20) includes a bonding wire (15) and a first transmission line (16). The bonding wire (15) includes first and second end portions. The first end portion is connected to the output electrode. The second end portion is connected to one end portion of the first transmission line (16). A fundamental impedance and a second harmonic impedance seen toward the external load change toward the one end portion. The second harmonic impedance at the one end portion has an inductive reactance. The output matching circuit (20) matches the capacitive output impedance of the semiconductor amplifying element (14) to the fundamental impedance of the external load.
摘要翻译：微波半导体放大器包括半导体放大器元件（14），输入匹配电路（12）和输出匹配电路（20）。半导体放大元件（14）包括输入电极和输出电极，并且具有电容性输出阻抗。输入匹配电路（12）连接到输入电极。输出匹配电路（20）包括接合线（15）和第一传输线（16）。接合线（15）包括第一端部和第二端部。第一端部连接到输出电极。第二端部连接到第一传输线（16）的一个端部。向外部负载看到的基本阻抗和二次谐波阻抗向着一端部变化。一端部的二次谐波阻抗具有感抗。输出匹配电路（20）将半导体放大元件（14）的电容性输出阻抗与外部负载的基波阻抗相匹配。

80. 发明公开

EP2549534A4 SEMICONDUCTOR DEVICE 有权
公开(公告)号：EP2549534A4
公开(公告)日：2013-08-14
申请号：EP11756266
申请日：2011-03-14
申请人： FUJI ELECTRIC CO LTD
发明人： SOYANO SHIN
IPC分类号： H01L25/07 , H01L25/18
CPC分类号： H01L25/18 , H01L23/04 , H01L24/37 , H01L24/40 , H01L24/73 , H01L25/072 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/37599 , H01L2224/40137 , H01L2224/40139 , H01L2224/40227 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83205 , H01L2224/83224 , H01L2224/83801 , H01L2224/84205 , H01L2224/84214 , H01L2224/84801 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2224/32225 , H01L2924/00012 , H01L2924/00014
摘要： An insulating substrate (2) fixed onto a metal base plate (1) includes an insulating plate (3), a metal foil (3a), and metal foils (4a, 4b, and 4c). A semiconductor element is disposed on each of the metal foils (4a and 4b). External connection terminals (18, 19, and 20) are fixed to a set of ends of terminal holders (8a, 8b, and 8c), respectively. The other ends of the terminal holders (8a, 8b, and 8c) are bonded to the metal foils (4a, 4b, and 4c), respectively. All external connection terminals (18, 19, and 20) which are main terminals through which main current flows are disposed on a lid (21). By preparing a plurality of lids (21, 22, 23, 24, and 25) having different layouts of the external connection terminals (18, 19, and 20), in which the external connection terminals (18, 19, and 20) are connected to the terminal holders (8a, 8b, and 8c) in the resin case (11), respectively, and exchanging the lids (21, 22, 23, 24, and 25), the positions of the external connection terminals (18, 19, and 20) can be changed easily.

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