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51. 发明授权

EP2872291B1 POLISHING PAD WITH POLISHING SURFACE LAYER HAVING AN APERTURE OR OPENING ABOVE A TRANSPARENT FOUNDATION LAYER 有权转让
标题翻译：具有抛光表面层的抛光垫具有透明基底层上方的孔或开口
公开(公告)号：EP2872291B1
公开(公告)日：2017-08-09
申请号：EP13728287.7
申请日：2013-05-29
申请人： Cabot Microelectronics Corporation
发明人： LEFEVRE, Paul Andre , ALLISON, William C. , LACASSE, James P. , SCOTT, Diane , SIMPSON, Alexander William , HUANG, Ping , CHARNS, Leslie M.
IPC分类号： B24B37/20 , B24B37/22 , B24B37/26 , B24D11/00 , B24D18/00
CPC分类号： B24B37/205 , B24B37/16 , B24B37/22 , B24B37/26 , B24D11/003 , B24D18/0009

52. 发明公开

EP3195979A1 POLISHING PAD 审中-公开
标题翻译：抛光垫
公开(公告)号：EP3195979A1
公开(公告)日：2017-07-26
申请号：EP15837016.3
申请日：2015-07-30
申请人： Fujimi Incorporated
发明人： KATAYAMA, Koji , OHASHI, Keigo , YAMADA, Eiichi , MORINAGA, Hitoshi
IPC分类号： B24B37/22 , B24B37/26
CPC分类号： B24B37/245 , B24B37/11 , B24B37/22 , B24B37/26
摘要： A polishing pad capable of removing waviness of a surface of a polishing target having a curved surface is provided. A polishing pad (10) includes a structure (40, 50) including a polishing surface (30) formed of a hard resin layer (40), the structure (40, 50) allowing the polishing surface (30) to follow a curved surface of a polishing target (90).
摘要翻译：提供一种能够去除具有曲面的研磨对象物的表面的起伏的研磨垫。本发明提供一种研磨垫（10），该研磨垫（10）包括具有由硬质树脂层（40）形成的研磨面（30）的结构体（40,50），该结构体使研磨面（30）的抛光目标（90）。

53. 发明公开

EP3178607A1 POLISHING PAD, MONITORING METHOD AND MONITORING SYSTEM THEREOF 审中-公开
标题翻译：抛光垫，监测方法和监测系统
公开(公告)号：EP3178607A1
公开(公告)日：2017-06-14
申请号：EP16200419.6
申请日：2016-11-24
申请人： Semiconductor Manufacturing International Corporation (Beijing) , Semiconductor Manufacturing International Corporation (Shanghai)
发明人： SHI, Chao
IPC分类号： B24B37/013 , B24B37/26 , B24B49/12 , B24B53/08 , H01L21/321 , B24B37/005 , B24B37/22
CPC分类号： B24B37/013 , B24B37/005 , B24B37/20 , B24B37/22 , B24B37/26 , B24B49/12 , B24D2205/00
摘要： The disclosed subject matter provides a polishing pad and a monitoring system for monitoring the polishing pad. The polishing pad includes a bottom layer, a polishing layer disposed on the bottom layer, and a plurality of mark structures disposed on the bottom layer and in the polishing layer to have a top surface coplanar with the polishing layer to indicate consumption level of the polishing layer. The monitoring system includes an acquisition module, a memory module, and a determining module connected to both the acquisition module and the memory module. The determining module, the acquisition module, and the memory module are configured to monitor the consumption level of the polishing layer and to recognize that the polishing pad needs to be replaced.
摘要翻译：所公开的主题提供了用于监视抛光垫的抛光垫和监测系统。抛光垫包括底层，设置在底层上的抛光层以及设置在底层和抛光层上的多个标记结构，以具有与抛光层共面的顶表面，以指示抛光的消耗水平层。监控系统包括获取模块，存储器模块和连接到采集模块和存储器模块两者的确定模块。确定模块，获取模块和存储器模块被配置为监视抛光层的消耗水平并识别抛光垫需要被更换。

54. 发明公开

EP2439768A4 FIXED-ABRASIVE-GRAIN MACHINING APPARATUS, FIXED-ABRASIVE-GRAIN MACHINING METHOD, AND SEMICONDUCTOR-WAFER MANUFACTURING METHOD 有权
标题翻译： VORRICHTUNG ZUR BEARBEITUNG FESTERSCHLEIFKÖRNER，VERFAHREN ZUR BEARBEITUNG FESTERSCHLEIFKÖRNERUND VERFAHREN ZUR HERSTELLUNG EINES HALBLEITERWAFERS
公开(公告)号：EP2439768A4
公开(公告)日：2017-06-07
申请号：EP10783466
申请日：2010-06-04
申请人： SUMCO CORP
发明人： HASHII TOMOHIRO , KAKIZONO YUICHI , KUROSAWA YOSHIAKI
IPC分类号： B24B7/22 , B24B7/17 , B24B37/08 , B24B37/22 , B24B37/24 , B24D7/06 , H01L21/02
CPC分类号： B24B7/228 , B24B7/17 , B24B37/08 , B24B37/22 , B24B37/245 , B24D7/06 , H01L21/02013

55. 发明公开

EP3126092A1 POLISHING PADS AND SYSTEMS AND METHODS OF MAKING AND USING THE SAME 有权
标题翻译：抛光垫和系统及其制造和使用方法
公开(公告)号：EP3126092A1
公开(公告)日：2017-02-08
申请号：EP15715634.0
申请日：2015-03-31
申请人： 3M Innovative Properties Company
发明人： LEHUU, Duy K. , MEYER, Kenneth A.P. , DAVID, Moses M.
IPC分类号： B24B37/26 , B24B37/22 , B24B37/24 , B24B7/22
CPC分类号： B24B37/26 , B24B7/228 , B24B37/22 , B24B37/245
摘要： The present disclosure relates to polishing pads which include a polishing layer, wherein the polishing layer includes a working surface and a second surface opposite the working surface. The working surface includes at least one of a plurality of precisely shaped pores and a plurality of precisely shaped asperities. The present disclosure further relates to a polishing system, the polishing system includes the preceding polishing pad and a polishing solution. The present disclosure relates to a method of polishing a substrate, the method of polishing including: providing a polishing pad according to any one of the previous polishing pads; providing a substrate, contacting the working surface of the polishing pad with the substrate surface, moving the polishing pad and the substrate relative to one another while maintaining contact between the working surface of the polishing pad and the substrate surface, wherein polishing is conducted in the presence of a polishing solution.
摘要翻译：本公开涉及包括抛光层的抛光垫，其中抛光层包括工作表面和与工作表面相对的第二表面。工作表面包括多个精确成形的孔和多个精确成形的凹凸中的至少一个。本发明还涉及一种抛光系统，该抛光系统包括前述抛光垫和抛光溶液。本公开涉及一种抛光基板的方法，该抛光方法包括：提供根据前述抛光垫中的任何一个的抛光垫; 提供基底，使抛光垫的工作表面与基底表面接触，使抛光垫和基底相对于彼此移动，同时保持抛光垫的工作表面和基底表面之间的接触，其中抛光在抛光液的存在。

56. 发明授权

EP1879720B1 MULTI-LAYER POLISHING PAD MATERIAL FOR CMP 有权转让
标题翻译：多层抛光垫层材料的化学机械抛光
公开(公告)号：EP1879720B1
公开(公告)日：2016-10-05
申请号：EP06750664.2
申请日：2006-04-19
申请人： CABOT MICROELECTRONICS CORPORATION
发明人： PRASAD, Abaneshwar c/o Legal Department , LACY, Michael c/o Legal Department
IPC分类号： B24B37/20 , B24B37/22 , B24D3/32
CPC分类号： B24D3/32 , B24B37/205 , B24B37/22

57. 发明公开

EP2857145A1 Polishing pad with homogeneous body having discrete protrusions thereon 有权转让
标题翻译： Polierkissen mit homogeneousemKörpermit einzelnen Erhebungen darauf
公开(公告)号：EP2857145A1
公开(公告)日：2015-04-08
申请号：EP14198969.9
申请日：2012-05-16
申请人： Nexplanar Corporation
发明人： Bajaj, Rajeev , Huang, Ping , Kerprich, Robert , Allison, William C , Frentzel, Richard , Scott, Diane
IPC分类号： B24B37/20 , B24B37/26 , B24B37/22 , B24B37/24 , B24D18/00
CPC分类号： B24B37/26 , B24B37/205 , B24B37/22 , B24B37/24 , B24D18/0009 , B29C39/123 , B29K2075/00 , B29L2009/00 , B29L2031/736
摘要： Polishing pads with homogeneous bodies having discrete protrusions thereon are described. In an example, a polishing pad for polishing a substrate includes a homogeneous body having a polishing side and a back side. The homogeneous body is composed of a material having a first hardness. A plurality of discrete protrusions is disposed on and covalently bonded with the polishing side of the homogeneous body. The plurality of discrete protrusions is composed of a material having a second hardness different from the first hardness. Methods of fabricating polishing pads with homogeneous bodies having discrete protrusions thereon are also described.
摘要翻译：描述具有其上具有离散突起的均匀体的抛光垫。在一个实例中，用于抛光衬底的抛光垫包括具有抛光侧和背面的均匀体。均质体由具有第一硬度的材料构成。多个分立的突起设置在均质体的抛光侧上并与其共价结合。多个离散突起由具有与第一硬度不同的第二硬度的材料构成。还描述了制造具有其上具有离散突起的均匀体的抛光垫的方法。

58. 发明授权

EP2714331B1 POLISHING PAD WITH HOMOGENEOUS BODY HAVING DISCRETE PROTRUSIONS THEREON 有权转让
标题翻译：与均质支撑体，并在此ARRANGED DISCREET TABS抛光垫上，
公开(公告)号：EP2714331B1
公开(公告)日：2015-04-01
申请号：EP12723065.4
申请日：2012-05-16
申请人： Nexplanar Corporation
发明人： BAJAJ, Rajeev , HUANG, Ping , KERPRICH, Robert , ALLISON, William C. , FRENTZEL, Richard , SCOTT, Diane
IPC分类号： B24B37/20 , B24B37/26 , B24B37/22 , B24B37/24 , B24D18/00
CPC分类号： B24B37/26 , B24B37/205 , B24B37/22 , B24B37/24 , B24D18/0009 , B29C39/123 , B29K2075/00 , B29L2009/00 , B29L2031/736

59. 发明公开

EP4431236A1 COMPOSITE POLISHING PAD INCLUDING CARBON NANOTUBES, AND METHOD FOR PRODUCING SAME 审中-实审
公开(公告)号：EP4431236A1
公开(公告)日：2024-09-18
申请号：EP21964181.8
申请日：2021-11-12
申请人： KPX Chemical Co., Ltd. , Korea Advanced Institute of Science and Technology
发明人： MIN, Byung Ju , HONG, Seok Ji , KIM, Seung Geun , CHOI, Jung Hee , KANG, Min Woo , OH, Nam Gue , KIM, Sanha , JEONG, Ji Hun , RYU, Hyun Jun , KANG, Sukkyung , KIM, Seong Jae
IPC分类号： B24B37/24 , B24B37/22 , B24D11/00 , B29C33/42 , B29C33/44
CPC分类号： B24B37/22 , B29C33/42 , B24B37/24 , B29C33/44 , B24D11/00
摘要： The present invention provides a composite polishing pad for CMP, and a method for producing the same. The composite polishing pad for CMP comprises: a polymer substrate layer including a plurality of protrusions formed on the upper surface thereof; and a carbon nanotube layer including carbon nanotubes embedded in and fixed to the upper portion of the substrate layer.

60. 发明授权

EP3362224B1 METHOD AND APPARATUS FOR FORMING ADVANCED POLISHING PADS USING AN ADDITIVE MANUFACTURING PROCESS 有权
公开(公告)号：EP3362224B1
公开(公告)日：2024-08-14
申请号：EP16855985.4
申请日：2016-10-06
IPC分类号： B24D11/00 , B24D3/28 , B24B37/24 , B33Y10/00 , B24B37/26 , B24D11/04 , B24B37/22 , B33Y80/00 , B24D18/00 , B29C64/112
CPC分类号： B24B37/22 , B24B37/24 , B33Y80/00 , B33Y10/00 , B24D11/001 , B24D18/009 , B29C64/112

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