会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 44. 发明公开
    • DISPOSITIF ET PROCEDE DE PROFILOMETRIE DE SURFACE POUR LE CONTROLE DE WAFERS EN COURS DE PROCESS
    • EP3198220A1
    • 2017-08-02
    • EP15778220.2
    • 2015-09-18
    • Fogale Nanotech
    • FRESQUET, Gilles
    • G01B11/24G01B9/02G01N21/95H01L21/66G01N21/956
    • G01B11/2441G01B9/0203G01B11/303G01B21/30G01B2210/56G01N21/9501G01N2021/8841H01L22/12
    • The present invention relates to a device or apparatus for carrying out shape measurements on a first surface (13) of a wafer (12) relative to the structures (14) present under said first surface (13), which comprises (i) profilometry means (10) arranged to carry out the shape measurements on said first surface (13) of the wafer (12) according to at least one measurement field; (ii) imaging means (11) facing said profilometry means (10) and arranged to acquire a reference image of said structures (14) on or through a second surface of the wafer (12) opposite to the first surface(13) according to at least one imaging field; said profilometry means (10) and said imaging means (11) being arranged such that the measurement and the imaging fields are position-referenced in a common frame of reference (15). The invention also relates to a method implemented in said device or apparatus.
    • 本发明涉及一种用于在晶片(12)的第一表面(13)上相对于存在于所述第一表面(13)下方的结构(14)进行形状测量的装置或设备,其包括(i)轮廓测量装置 (10),布置成根据至少一个测量场在晶片(12)的所述第一表面(13)上进行形状测量; (ii)成像装置(11),面对所述轮廓测定装置(10)并且被布置为根据以下公式获取在所述晶片(12)的与所述第一表面(13)相反的第二表面上或通过所述结构 至少一个成像场; 所述轮廓测量装置(10)和所述成像装置(11)被布置成使得测量和成像场在公共参考系(15)中被位置参考。 本发明还涉及在所述设备或装置中实施的方法。
    • 45. 发明公开
    • PROCEDE DE SUIVI TEMPS REEL DE L'ETAT DE FONCTIONNEMENT D'UN CAPTEUR CAPACITIF
    • 薇薇儿ZUR ECHTZEITVERFOLGUNG DES BETRIEBSZUSTANDES EINES KAPAZITIVEN SENSORS
    • EP3155376A1
    • 2017-04-19
    • EP15731862.7
    • 2015-06-10
    • Fogale Nanotech
    • NEEL, ChristianBILLIARD, Nicolas
    • G01D5/24
    • G01R31/028G01D5/24G01R27/26G01R27/2605G01R31/016
    • The invention relates to a method for real-time tracking of the operational status of a capacitive sensor mountable onto a rotatable machine and connected to an electronic measurement module via a high-frequency transmission line. Said method includes the steps of: generating, within the electronic module, a signal of conductance compensation for interference from the transmission line and the sensor; generating, within the electronic module, a signal of capacitance compensation for the transmission line and the sensor; sampling a signal representing the capacitance compensation and a signal representing the conductance compensation such as to determine an operation point of the sensor; and analyzing the operation point so as to verify if it is located in a predetermined area.
    • 本发明涉及一种用于实时跟踪可安装到可旋转机器上并通过高频传输线连接到电子测量模块的电容式传感器的操作状态的方法。 所述方法包括以下步骤:在所述电子模块内产生用于来自所述传输线和所述传感器的干扰的电导补偿信号; 在电子模块内产生传输线和传感器的电容补偿信号; 对表示电容补偿的信号进行采样,以及表示电导补偿的信号,以确定传感器的操作点; 并分析操作点,以验证其是否位于预定区域中。
    • 48. 发明公开
    • PROCEDE ET DISPOSITIF POUR CONTROLER LA REVELATION DE STRUCTURES ENTERREES SUR DES OBJETS TELS QUE DES WAFERS
    • 方法和设备物品中受控检测LIKE WAFERS结构所含
    • EP2888552A1
    • 2015-07-01
    • EP13763196.6
    • 2013-08-20
    • Fogale Nanotech
    • FRESQUET, GillesPERROT, Sylvain
    • G01B11/00B24B49/12G01B11/06G01N21/95H01L21/66H01L21/67
    • G06T7/0012B24B37/005B24B49/12G01B9/02091G01B11/06G01B11/0633G01B11/0683G01B11/14G01N21/9501G06T7/0008G06T7/001G06T2207/10004G06T2207/10152G06T2207/30148H04N5/2256H04N7/18
    • The present invention relates to an imaging method and device for inspecting for the presence, in an area of an object (20) such as a wafer, of structures (70a, 70b, 70c) enclosed in said object (20), such as vias, employing: an imaging sensor (22); optical imaging means (34) able to produce, on said imaging sensor (22), an image (73, 74) of the object (20) in a field of view; and illuminating means (23, 27) for generating an illuminating beam (25, 30) and lighting said field of view in reflection, characterised in that it comprises steps of: acquiring a first image (73) of the object (20) by illuminating said object (20) with a first illuminating beam (25, 30) the spectral content of which is adapted to the nature of the object (20), such that the light of said beam (25, 30) is able essentially to penetrate into said object (20); acquiring a second image (74) of the object (20) by illuminating said object (20) with a second illuminating beam (25, 30) the spectral content of which is adapted to the nature of the object (20), such that the light of said beam (25, 30) is essentially reflected by the surface of the object (20); and comparing said first and second images (73, 74) such as to identify structures (71a) that appear in the first image (73) but not in the second image (74).
    • 提供了一种用于在物体像的晶片检查是否有存在下,在,封闭结构,:如通孔,采用成像的方法和设备:成像传感器; 在光学成像器能够产生,在成像传感器的视场中,以对象图像; 和照明器用于在照明光束产生和反射照明的视场,其中包括:通过照射具有第一照明光束angepasst给对象的对象获取所述对象的第一图像,检测所做的光束的光穿透所述对象 ; 通过照射具有第二照射光束angepasst给对象的对象获取所述对象的第二图像,并检测的光束的光被所述物体的表面反射的光; 和比较第一和第二图像,以确定结构也出现在第一幅图像,但不是在第二图像。