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    • 33. 发明公开
    • Thin film forming process
    • Verfahren zur Trennung einer Schicht
    • EP0867923A2
    • 1998-09-30
    • EP98302218.7
    • 1998-03-24
    • CANON KABUSHIKI KAISHA
    • Iwane, MasaakiYonehara, TakaoOhmi, Kazuaki
    • H01L21/304H01L21/20B26F3/12H01L31/18
    • B32B43/00H01L21/2007H01L21/76259Y10S438/96Y10S438/974Y10S438/977
    • A process for producing an SOI substrate is disclosed which is useful for saving resources and lowering production cost. Further, a process for producing a photoelectric conversion device such as a solar cell is disclosed which can successfully separate a substrate by a porous Si layer, does not require a strong adhesion between a substrate and a jig, and can save resources and lower production cost. In a substrate having a porous layer on a nonporous layer and further having on the porous layer a layer small in porosity, the nonporous layer and the layer small in porosity are separated by the porous layer to form a thin film. A metal wire is wound around a side surface of the substrate, and a current is made to flow into the metal wire to generate a heat from the metal wire and transfer the heat preferentially to the porous layer, thus conducting the separation. The separated substrate is used for producing an SOI substrate and the separated nonporous Si layer is reutilized in a process of producing an SOI substrate.
    • 公开了一种用于制造SOI衬底的方法,其用于节省资源并降低生产成本。 此外,公开了一种太阳能电池的光电转换装置的制造方法,其可以通过多孔Si层成功地分离基板,不需要基板和夹具之间的强粘合性,并且可以节省资源并降低生产成本 。 在无孔层上具有多孔层的基板中,在多孔层上还具有孔隙小的层,无孔层和孔隙小的层被多孔层分离以形成薄膜。 金属线缠绕在基板的侧面上,使电流流入金属线,从金属线产生热量,并将热量优先传递给多孔层,进行分离。 分离的衬底用于制造SOI衬底,并且在制造SOI衬底的工艺中分离的无孔Si层被再利用。