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21. 发明公开

EP0199940A2 Photolithographic process, and organosilicone polymer composition for use therein 失效
标题翻译：光刻工艺，以及其中使用的有机硅氧烷聚合物组合物
公开(公告)号：EP0199940A2
公开(公告)日：1986-12-10
申请号：EP86103213.4
申请日：1986-03-11
申请人： International Business Machines Corporation
发明人： Babich, Edward Darko , Hatzakis, Michael , Liutkis, John Joseph , Parasczcak, Juri Rostyslav , Shaw, Jane Margaret
IPC分类号： C08L83/07 , C08K5/07 , G03F7/004
摘要： A composition containing a polysiloxane having a polymerizable ethylenically unsaturated group, and 2,2-dimethoxy-2-phenyl acetophenone as an ultraviolet light sensitizer and use thereof in lithography.
摘要翻译：含有具有聚合性烯属不饱和基团的聚硅氧烷和2,2-二甲氧基-2-苯基苯乙酮作为紫外线敏化剂的组合物及其在光刻中的用途。

22. 发明公开

EP0147127A3 A composition of matter of use as a resist in lithography 失效
标题翻译：使用作为电阻的电阻的一个组成部分
公开(公告)号：EP0147127A3
公开(公告)日：1986-09-03
申请号：EP84308616
申请日：1984-12-11
申请人： International Business Machines Corporation
发明人： Babich, Edward Darko , Hatzakis, Michael , Paraszcak, Juri Rostyslav , Shaw, Jane Margaret
IPC分类号： G03F07/10 , G03F07/08
CPC分类号： G03F7/0757 , G03F7/023 , G03F7/0754
摘要： A composition of matter is obtained by interreacting a quinone diazo compound and an organosilicon compound. Such a composition can be used as a resist in a lithographic process.

23. 发明公开

EP0717418A2 Composition containing a polymer and conductive filler and use thereof 失效
标题翻译：组合物包含聚合物和导电填料并使用相同
公开(公告)号：EP0717418A2
公开(公告)日：1996-06-19
申请号：EP95118610.5
申请日：1995-11-27
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Angelopoulos, Marie , Brusic, Vlasta A. , Graham, Teresita Ordonez , Purushothaman, Sampath , Roldan, Judith Marie , Saraf, Ravi F. , Shaw, Jane Margaret , Viehbeck, Alfred
IPC分类号： H01B1/22 , H01B1/12 , H05K3/14
CPC分类号： H05K9/0083 , C08G61/12 , C08L33/00 , C08L65/00 , C09D5/08 , C09D5/24 , C09J9/02 , H01B1/125 , H01B1/127 , H01B1/128 , H01B1/22 , H01B1/24 , H05K3/321 , H05K9/0079 , H05K9/0088 , H05K2201/0329 , Y10S428/901 , Y10T428/24917 , Y10T428/25 , Y10T428/31529 , Y10T428/31533 , Y10T428/31605 , Y10T428/31663 , Y10T428/31678 , Y10T428/31681 , Y10T428/31692 , Y10T428/31721 , Y10T428/31725 , Y10T428/31855 , C08L2666/04
摘要： A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyazines, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophene, substituted and unsubstituted poly-p-phenylene sulfides and substiututed and unsubstituted polyacetylenes, and mixtures thereof, and copolymers thereof.
Compositions of the present invention are useful as corrosion protecting layers for metal substrates, for electrostatic discharge protection, electromagnetic interference shielding, and as adhesives for interconnect technology as alternatives to solder interconnections.
In addition, films of polyanilines are useful as corrosion protecting layers with or without the conductive metal particles.
摘要翻译：提供了一种包含聚合物基质和导电填料组分的组合物。导电填料组分包括选自下组的导电性粒子和高分子由...组成substituiertem和unsubstituiertem聚苯胺，substituiertem和unsubstituiertem polyparaphenylenevinylenes，substituiertem和unsubstituiertem聚噻吩，substituiertem和unsubstituiertem polyazines，substituiertem和unsubstituiertem polyparaphenylenes，substituiertem和unsubstituiertem polyfuranes，substituiertem和unsubstituiertem聚吡咯，substituiertem和unsubstituiertem聚硒吩，substituiertem和unsubstituiertem聚对亚苯基硫醚和substiututed和unsubstituiertem聚乙炔，以及它们的混合物，和它们的共聚物。作为腐蚀保护层，用于静电放电保护，电磁干扰屏蔽金属基板的本发明的组合物是有用的，并作为粘合剂用于互连技术作为替代焊料互连。另外，聚苯胺膜已如腐蚀保护层具有或不具有导电金属颗粒是有用的。

24. 发明授权

EP0538663B1 Microwave methods of fabricating multi-layer ceramic substrates 失效
标题翻译：一种通过微波加热来生产多层陶瓷基板的过程
公开(公告)号：EP0538663B1
公开(公告)日：1996-05-15
申请号：EP92116899.3
申请日：1992-10-02
申请人： International Business Machines Corporation
发明人： Lewis, David Andrew , Shaw, Jane Margaret
IPC分类号： C04B35/64 , B32B18/00 , C03C14/00 , C03C8/14 , H01L21/48
CPC分类号： C04B35/638

25. 发明授权

EP0393348B1 Negative photoresist and use thereof 失效
标题翻译：负性光刻胶及其应用。
公开(公告)号：EP0393348B1
公开(公告)日：1994-09-28
申请号：EP90104693.8
申请日：1990-03-13
申请人： International Business Machines Corporation
发明人： Hatzakis, Michael , Shaw, Jane Margaret , Stewart, Kevin Jay
IPC分类号： G03F7/038 , G03F7/075
CPC分类号： G03F7/0758

26. 发明公开

EP0594947A2 Low dielectric constant fluorinated polymers and methods of fabrication thereof 失效
标题翻译：氟化聚合物具有低介电常数和它们的制备方法。
公开(公告)号：EP0594947A2
公开(公告)日：1994-05-04
申请号：EP93110696.7
申请日：1993-07-05
申请人： International Business Machines Corporation
发明人： Hougham, Gareth Geoffrey , Shaw, Jane Margaret , Viehbeck, Alfred
IPC分类号： C08G73/10
CPC分类号： C08G73/1039
摘要： Low dielectric constant, high molecular weight polymers, e.g. polyimides, polyamides, polyesters and polyurethanes, are described.The fluorine containing constituents are sterically disposed so that the dipole moment of the constituents tend to cancel out. Since fluorine containing diamines are generally nonreactive, to achieve a polyimide of high enough molecular weight to be practically useful, a method of fabrication of a high molecular weight polymer from monomers of low reactivity is provided. The monomers, such as a diamine and dianhydride are provided in a solution within which a low molecular weight polyamic acid is formed. The solution is dried. The polyamic acid used is cured to a low molecular weight polyimide. The polyimide is redisolved, redried and recured enough times to build up the molecular weight to a useful level. The method is applicable to fabricating other polymers of high molecular weight, such as polyamides, polyesters and polyurethanes.
摘要翻译：低介电常数，高的分子量的聚合物，E.G. 聚酰亚胺，聚酰胺，聚酯和聚氨酯，也作了含氟成分“是空间配置做了成分的偶极矩”往往抵消。由于含氟二胺是基因反弹非反应性，以达到足够高的分子量的聚酰亚胺是有用的。实际上，提供了一种从低反应性的单体的高分子量聚合物的制造的方法。单体：例如二胺和二酐在其内的低分子量的聚酰胺酸形成的溶液中提供。将溶液干燥。使用的聚酰胺酸固化以低分子量的聚酰亚胺。所述聚酰亚胺再溶解，再干燥和recured足够的次数，以分子量建立到有用的水平。该方法适用于制造高分子量，颜色的其他聚合物：如聚酰胺，聚酯和聚氨酯。

27. 发明公开

EP0538663A1 Microwave methods of fabricating multi-layer ceramic substrates 失效
标题翻译： Verfahren zur Herstellung von Vielschicht-Keramiksubstraten mittels Mikrowellenheizung。
公开(公告)号：EP0538663A1
公开(公告)日：1993-04-28
申请号：EP92116899.3
申请日：1992-10-02
申请人： International Business Machines Corporation
发明人： Lewis, David Andrew , Shaw, Jane Margaret
IPC分类号： C04B35/64 , B32B18/00 , C03C14/00 , C03C8/14 , H01L21/48
CPC分类号： C04B35/638
摘要： Microwave methods for forming ceramic substrates containing multi-level and interconnected circuit patterns of conductors are described. The formation includes microwave burn-out of binders in oxidizing ambients such as air burn out is substantially more rapid than by conventional heating.
摘要翻译：描述了用于形成包含导体的多电平和互连电路图案的陶瓷衬底的微波方法。形成包括在氧化环境中的粘合剂的微波烧尽，例如空气烧坏比通过常规加热显着更快。

28. 发明公开

EP0453716A3 Connector assembly for chip testing 失效
标题翻译：用于芯片测试的连接器总成
公开(公告)号：EP0453716A3
公开(公告)日：1992-07-01
申请号：EP91101647.5
申请日：1991-02-07
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Beaman, Brian Samuel , Fogel, Keith Edward , Kim, Jungihl , Mayr, Wolfgang , Shaw, Jane Margaret , Walker, George Frederick
IPC分类号： G01R1/073 , H01R23/72 , G01R1/04
CPC分类号： G01R1/0483 , G01R1/07314 , H01L2224/13021 , H01R12/714 , H01R13/2485 , H01R2201/20
摘要： An electrical connector is described for making contact with a plurality of convex and deformable contacts (40, 46) on an electronic device (38). The electrical connector comprises a substrate having a plurality of conductors (10, 12, 14) which extend above its surface. A polymeric material (20) is disposed on the surface of the substrate and has openings which expose the conductors, each opening sized to receive one of the convex, deformable contacts, and to enable electrical connection between the exposed conductors and the deformable contacts. A mechanism is provided for urging the deformable contacts on the electronic device against the exposed conductors. The mechanism exerts sufficient force between the device and the conductors to cause some deformation of the convex contact areas by the conductors.

29. 发明公开

EP0366937A2 Method of forming relief patterns and use thereof 失效
标题翻译： Verfahren zur Herstellung von Reliefstrukturen und Anwendung。
公开(公告)号：EP0366937A2
公开(公告)日：1990-05-09
申请号：EP89118050.7
申请日：1989-09-29
申请人： International Business Machines Corporation
发明人： Flagello, Donis George , Hatzakis, Michael , Cunningham Noe, Susan , Shaw, Jane Margaret , Witman, David Frank
IPC分类号： G03F7/38
CPC分类号： G03F7/265
摘要： A relief pattern is formed by exposing a portion of a photosensitive layer of polymeric material having reactive hydrogen functional groups and/or reactive hydrogen functional precursor groups to actinic light and then contacting the layer with a multifunctional organometallic material containing at least two functional groups which are reactive with the reactive hydrogen groups of the polymeric material to thereby render the thickness of the layer at the exposed portion different from the thickness of the layer at the unexposed portion. The relief pattern can, in turn, be used in optical disks to fabricate the servo-tracks. Also, the relief pattern can be used for producing a lithography mask for dry etching.
摘要翻译：通过将具有反应性氢官能团和/或反应性氢功能前体基团的聚合物材料的感光层的一部分暴露于光化光，然后使该层与含有至少两个官能团的多官能有机金属材料接触而形成浮雕图案，与聚合材料的反应性氢基团反应，从而使得暴露部分的层的厚度不同于未曝光部分的层的厚度。浮雕图案又可以用于光盘中以制造伺服轨道。此外，浮雕图案可以用于制造用于干蚀刻的光刻掩模。

30. 发明公开

EP0365881A2 Composition capable of being imaged and use of such a composition 失效
标题翻译： Aufzeichnungszusammensetzung und ihre Verwendung。
公开(公告)号：EP0365881A2
公开(公告)日：1990-05-02
申请号：EP89118364.2
申请日：1989-10-04
申请人： International Business Machines Corporation
发明人： Babich, Edward Darko , Flagello, Donis George , Hatzakis, Michael , Paraszczak, Jurij Rostyslav , Shaw, Jane Margaret , Witman, David Frank
IPC分类号： G03F7/075
CPC分类号： G03F7/0757 , G03F7/0755
摘要： The composition comprises an organosilicon compound having as the terminal groups, quinone diazo groups, and a phenolic-novolak polymer wherein the relative amount of A is about 5% to about 50% and the amount of B is about 95% to about 50% based upon the total weight of A and B. Such a composition is used for producing an image which comprises providing on a substrate a layer of said composition imagewise exposing the layer of light-sensitive composition to imaging radiation in a desired pattern and developing the exposed layer, thereby leaving the desired pattern of the layer of light-sensitive positive resist composition remaining on the substrate.
摘要翻译：该组合物包含具有端基的有机硅化合物，醌重氮基和酚类酚醛清漆聚合物，其中A的相对量为约5％至约50％，B的量为约95％至约50％ A和B的总重量。这种组合物用于产生图像，其包括在基底上提供所述组合物的图像成像曝光所述感光组合物层以期望的图案成像辐射并显影所述曝光层从而留下保留在基材上的光敏正性抗蚀剂组合物层的期望图案。

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