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    • 2. 发明公开
    • Method for producing metal powder with a uniform distribution of dispersants, method of uses thereof and structures fabricated therewith
    • 一种用于生产金属粉末的与分散的均匀分布,由其机构提出用于其使用方法和产品的过程。
    • EP0567772A1
    • 1993-11-03
    • EP93104770.8
    • 1993-03-23
    • International Business Machines Corporation
    • Kang, Sung KwonPurushothaman, SampathRitsko, John JamesShaw, Jane MargaretShinde, Subhash Laxman
    • B22F9/04
    • H05K1/092B22F9/04B22F2009/043B22F2999/00C22C1/1084B22F1/0003
    • Methods of fabricating powders of metal particles containing grain growth control additives are described. A powder, metal particle, e.g., copper particles, are mixed with a powder of additive particles, e.g., alumina particles. The mixture is milled in a high energy ball mill to provide metal particles having substantially uniformly distributed therein additive particles. The ball milled powder contains elongated high aspect ratio particles. The high aspect ratio particles are reduced in size by jet impact milling. The jet impact milled powder can be used to form a conductor forming paste in the fabrication of a metallized ceramic substrate for semiconductor chip packaging application. The jet impact milled powder has particles sufficiently small in size to fill vias between metallization layers in the green ceramic precursor to the ceramic substrate. During sintering of the combination of ceramic precursor and conductor forming paste, the grain growth control additive results in a substantially void free via filled with metal having a fine grain morphology.
    • 制造包含晶粒生长抑制剂的金属粒子的粉末的方法进行说明。 的粉末,金属粒子,E. G.,铜颗粒与添加剂颗粒,E. G.,氧化铝颗粒的粉末混合。 将混合物在高能球磨机粉碎以提供具有基本上均匀地分布在其中的添加剂颗粒的金属颗粒。 球磨粉末含有细长的高纵横比的粒子。 高纵横比的颗粒是通过喷射冲击研磨尺寸减小。 射流冲击研磨的粉末可用于形成导体在用于半导体芯片封装的应用程序的金属化陶瓷基片的制造中形成膏。 射流冲击研磨粉末具有颗粒尺寸小到足以填充金属化层之间的通孔中的生坯陶瓷前体陶瓷基片。 在陶瓷前体和导体形成用膏的组合的烧结,在基本上无空隙的晶粒生长控制添加剂的结果经由填充有具有细晶粒形态的金属。