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    • 21. 发明公开
    • LIQUID SURFACE HEIGHT DETECTOR
    • DETEKTORFÜRDIEHÖHEEINERFLÜSSIGKEITSOBERFLÄCHE
    • EP3064909A1
    • 2016-09-07
    • EP14857127.6
    • 2014-10-29
    • DENSO CORPORATION
    • HARADA, ToshikazuSAKAIDA, AtusiTANIGUCHI, ToshihisaGOUKO, NorioYAZAKI, YoshitaroSHIRAISHI, YoshihikoTANAKA, YasuhiroSAITOU, Keita
    • G01F23/22
    • G01F23/22
    • A liquid level detector includes: a detecting element having one surface and the other surface opposite to the one surface, the one surface being opposed to a liquid, while being parallel to a height direction of liquid level; a Peltier element provided on the other surface side of the detecting element; and a control unit performing a detection processing for a liquid level of the liquid. The Peltier element forms a heat flow passing through the detecting element from the other surface to the one surface, toward the liquid or a gas. The control unit calculates a liquid level on the basis of an output value of an electrical signal outputted according to the heat flow passing through the detecting element, and a relationship between an output value of the detecting element and a liquid level.
    • 液面检测器包括:检测元件,其具有一个表面,而另一个表面与所述一个表面相对,所述一个表面与液体相对,同时平行于液面的高度方向; 设置在所述检测元件的另一表面侧的珀耳帖元件; 以及对液体的液面进行检测处理的控制单元。 珀尔帖元件形成从另一个表面通过检测元件到一个表面,朝向液体或气体的热流。 控制单元基于根据通过检测元件的热流输出的电信号的输出值以及检测元件的输出值与液位之间的关系来计算液位。
    • 23. 发明公开
    • METHOD FOR MANUFACTURING THERMOELECTRIC CONVERTER
    • VERFAHREN ZUR HERSTELLUNG EINES热脱胶机
    • EP2950360A1
    • 2015-12-02
    • EP14743708.1
    • 2014-01-23
    • Denso Corporation
    • MIYAGAWA, EijirouSAITOU, KeitaSHIRAISHI, YoshihikoYAZAKI, YoshitaroTANIGUCHI, ToshihisaSAKAIDA, Atusi
    • H01L35/34
    • H01L35/32H01L35/08H01L35/34
    • An insulating substrate (10) is prepared. In the substrate, plurality via holes (11 and 12) penetrating in a thickness direction are filled with a conductive paste (41 and 51). This paste is produced by adding an organic solvent to a powder of an alloy in which a plurality of metal atoms retain a predetermined crystalline structure, and by processing the powder to a paste. The insulating substrate (10) is then pressed from a front surface (10a) and a back surface (10b) of the insulating substrate (10), while being heated. The conductive paste (41 and 51) is solid-phase sintered and interlayer connecting members (40 and 50) are formed. A front surface protective member (20) is disposed on a front surface (10a) of the substrate (10) and a back surface protective member (20) is disposed on a back surface (10b) of the substrate (10), and a laminate (80) is formed. The laminate (80) is integrated by a lower pressure being applied while heating at a lower temperature, compared to the temperature and pressure in the process of forming the interlayer connecting members (40 and 50).
    • 制备绝缘基板(10)。 在基板中,在厚度方向贯通的多个通孔(11,12)填充有导电性浆料(41,51)。 将该有机溶剂添加到多个金属原子保持规定的结晶结构的合金粉末中,通过将该粉末加工成糊状来制造。 然后在被加热的同时从绝缘基板(10)的前表面(10a)和后表面(10b)按压绝缘基板(10)。 导电膏(41和51)是固相烧结,并形成层间连接件(40和50)。 前表面保护构件(20)设置在基板(10)的前表面(10a)上,背面保护构件(20)设置在基板(10)的背面(10b)上,并且 形成层压体(80)。 与在形成层间连接构件(40和50)的过程中的温度和压力相比,层压体(80)在较低温度下加热时被施加较低的压力而积分。