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21. 发明公开

EP2448016A2 Method of manufacturing semiconductor light emitting device 有权转让
标题翻译： Verfahren zur Herstellung einer lichtemittierenden Halbleitervorrichtung
公开(公告)号：EP2448016A2
公开(公告)日：2012-05-02
申请号：EP11187470.7
申请日：2011-11-02
申请人： Samsung LED Co., Ltd.
发明人： Hur, Won Goo , Shin, Young Chul , Kim, Gi Bum , Choi, Seung Woo
IPC分类号： H01L33/42
CPC分类号： H01L33/42 , H01L33/025 , H01L2933/0016
摘要： There is provided a method of manufacturing a semiconductor light emitting device, the method including: forming a light emitting structure by sequentially growing an n-type nitride semiconductor layer, an active layer, and a p-type nitride semiconductor layer on a substrate; forming a transparent electrode on the p-type nitride semiconductor layer through a sputtering process; and forming a nitrogen gas atmosphere in an interior of a reaction chamber in which the sputtering process is performed, prior to or during the sputtering process.
In the case of the semiconductor light emitting device obtained according to embodiments of the invention, a deterioration phenomenon in electrode characteristics caused due to a nitrogen vacancy may be minimized in manufacturing a transparent electrode through a sputtering process to thereby allow for the provision of a transparent electrode having significantly improved electrical characteristics.
摘要翻译：提供了一种制造半导体发光器件的方法，该方法包括：通过依次生长n型氮化物半导体层（102），有源层（103）和p型氮化物半导体层（104）; 通过溅射工艺在p型氮化物半导体层（104）上形成透明电极（105）; 以及在溅射过程之前或期间，在其中进行溅射处理的反应室（200）的内部形成氮气（206）。在根据本发明的实施例获得的半导体发光器件的情况下，由于氮空位引起的电极特性的劣化现象在通过溅射工艺制造透明电极时可能最小化，从而允许提供透明电极具有显着改善的电特性。

22. 发明公开

EP2407577A3 Chemical Vapor Deposition Apparatus 有权转让
标题翻译：化学气相沉积装置
公开(公告)号：EP2407577A3
公开(公告)日：2012-04-25
申请号：EP11173168.3
申请日：2011-07-08
申请人： Samsung LED Co., Ltd.
发明人： Maeng, Jong Sun , Kim, Young Sun , Shim, Hyun Wook , Kim, Sung Tae
IPC分类号： C23C16/458 , C23C16/455
CPC分类号： H01L33/0075 , C23C16/45502 , C23C16/45517 , C23C16/45563 , C23C16/45572 , C23C16/45574 , C23C16/45578 , C23C16/4558 , C23C16/45591 , C23C16/458 , C23C16/4584 , C23C16/4585 , H01L33/0066 , H01L2933/0016
摘要： A chemical vapor deposition apparatus includes: a reaction chamber including an inner tube having a predetermined volume of an inner space, and an outer tube tightly sealing the inner tube; a wafer holder disposed within the inner tube and on which a plurality of wafers are stacked at predetermined intervals; and a gas supply unit including at least one gas line supplying an external reaction gas to the reaction chamber, and a plurality of spray nozzles communicating with the gas line to spray the reaction gas to the wafers, whereby semiconductor epitaxial thin films are grown on the surfaces of the wafers, wherein the semiconductor epitaxial thin film grown on the surface of the wafer includes a light emitting structure in which a first-conductivity-type semiconductor layer, an active layer, and a second-conductivity-type semiconductor layer are sequentially formed.

23. 发明公开

EP2428996A2 Gallium Nitride Based Semiconductor Devices and Methods of Manufacturing the Same 审中-公开
标题翻译： Galliumnitrid-basierte Halbleitervorrichtungen und Verfahren zur Herstellung
公开(公告)号：EP2428996A2
公开(公告)日：2012-03-14
申请号：EP11180488.6
申请日：2011-09-08
申请人： Samsung LED Co., Ltd.
发明人： Lee, Jae-hoon , Kim, Ki-se
IPC分类号： H01L29/778
CPC分类号： H01L29/7783 , H01L29/2003 , H01L29/205 , H01L29/4236 , H01L29/66143 , H01L29/66462 , H01L29/7781 , H01L29/7786 , H01L29/872
摘要： Gallium nitride (GaN) based semiconductor devices and methods of manufacturing the same. The GaN-based semiconductor device may include a heat dissipation substrate (that is, a thermal conductive substrate); a GaN-based multi-layer arranged on the heat dissipation substrate and having N-face polarity; and a heterostructure field effect transistor (HFET) or a Schottky electrode arranged on the GaN-based multi-layer. The HFET device may include a gate having a double recess structure. While such a GaN-based semiconductor device is being manufactured, a wafer bonding process and a laser lift-off process may be used.
摘要翻译：基于氮化镓（GaN）的半导体器件及其制造方法。 GaN基半导体器件可以包括散热基板（即，导热基板）; 布置在散热基板上并具有N面极性的GaN基多层; 以及配置在GaN基多层上的异质结构场效应晶体管（HFET）或肖特基电极。 HFET器件可以包括具有双凹槽结构的栅极。虽然正在制造这种GaN基半导体器件，但是可以使用晶片接合工艺和激光剥离工艺。

24. 发明公开

EP2428991A2 Light Emitting Component with integrated control 有权转让
标题翻译： Lichtemittierendes Bauteil mit integrierter Steuerung
公开(公告)号：EP2428991A2
公开(公告)日：2012-03-14
申请号：EP11180601.4
申请日：2011-09-08
申请人： Samsung LED Co., Ltd.
发明人： Song, Ho Young
IPC分类号： H01L25/16 , H05B33/08
CPC分类号： H01L25/167 , H01L33/486 , H01L2924/0002 , H01L2924/00
摘要： A light emitting device includes: a substrate having opposed first and second main faces; a light emitting element mounted on the first main face of the substrate; and a driver integrated circuit (IC) formed in an area corresponding to a lower side of the light emitting element within the substrate, and adjusting the amount of current applied to the light emitting element. Since the circuit provided to drive a light emitting diode (LED) is integrated within the substrate, a compact light emitting device having an integrated structure can be obtained.
摘要翻译：发光器件（100）包括：具有相对的第一和第二主面的衬底（102）; 安装在所述基板的所述第一主面上的发光元件（101）以及形成在与基板内的发光元件的下侧对应的区域中的驱动器集成电路（IC）（103），并且调整施加到发光元件的电流量。由于设置用于驱动发光二极管（101）（LED）的电路（103）集成在基板（102）内，因此可以获得具有一体结构的紧凑型发光装置。

25. 发明公开

EP2426744A2 Light emitting diode package and manufacturing method thereof 审中-公开
标题翻译： Leuchtdiodenbaugruppe und deren Herstellungsverfahren
公开(公告)号：EP2426744A2
公开(公告)日：2012-03-07
申请号：EP11179555.5
申请日：2011-08-31
申请人： Samsung LED Co., Ltd.
发明人： Lee, Young Jin , Kim, Hyung Kun , Moon, Kyung Mi , Woo, Gwang Bok
IPC分类号： H01L33/48 , H01L33/64
CPC分类号： H01L33/642 , H01L33/486 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2933/0075 , H01L2924/00014
摘要： A light emitting diode (LED) package is disclosed. The LED package includes a lead frame comprising a thermal pad and at least two electrode pads disposed at a distance from the thermal pad; at least one LED mounted on the thermal pad and electrically connected with the at least two electrode pads through a wire; a package mold comprising a first cavity to receive the thermal pad and the at least two electrode pads and to partially expose the thermal pad and the at least two electrode pads through a first surface of the package mold, the first surface on which the at least one LED is mounted, and exposing the thermal pad and the at least two electrode pads through a surface coplanar with a second surface opposite to the first surface; and a molding unit disposed in the first cavity.
摘要翻译：公开了一种发光二极管（LED）封装。所述LED封装包括引线框架，所述引线框架包括散热焊盘和至少两个电极焊盘，所述至少两个电极焊盘设置在与所述散热焊盘相距一定距离处; 至少一个LED，其安装在所述散热焊盘上并通过导线与所述至少两个电极焊盘电连接; 封装模具，其包括用于接收所述热垫和所述至少两个电极焊盘并且通过所述封装模具的第一表面部分地暴露所述热焊盘和所述至少两个电极焊盘的第一腔体，所述第一表面至少在所述第一表面上，安装一个LED，并且通过与第一表面相对的第二表面共面的表面暴露所述热焊盘和所述至少两个电极焊盘; 以及设置在所述第一腔中的模制单元。

26. 发明公开

EP2390696A1 Backlight unit 有权转让
标题翻译： Rückbeleuchtungseinheit
公开(公告)号：EP2390696A1
公开(公告)日：2011-11-30
申请号：EP11168276.1
申请日：2011-05-31
申请人： Samsung LED Co., Ltd.
发明人： Choi, Sun , Kim, Geun Young , Lee, Jung Hun , Park, Jong Jin
IPC分类号： G02B6/00
CPC分类号： G02B6/0085 , G02B6/0073 , G02B6/0078 , G02B6/009
摘要： There is provided a backlight unit. The backlight unit includes a light guiding plate (100), a light source module (200) including a substrate (220) provided with a circuit wiring and a plurality of light emitting diode (LED) blocks each including one or more LED (210) mounted on the substrate (220) to be positioned vertically with respect to the substrate (220), the one or more LED (210) being disposed to face a side surface (110) of the light guiding plate (100), a bottom chassis (300) including a base (310) and a sidewall (320) upwardly extending from a circumference of the base (310), and accommodating the light source module (220) and the light guiding plate (100) in such a manner that the one or more LED (210) is disposed to be adjacent to the sidewall (320), and a driving unit controlling a current signal applied to each of the plurality of LED blocks to thereby control brightness for each LED block.
摘要翻译：提供背光单元。背光单元包括导光板（100），包括设置有电路布线的基板（220）的光源模块（200）和包括一个或多个LED（210）的多个发光二极管（LED）块，安装在所述基板（220）上以相对于所述基板（220）垂直定位，所述一个或多个LED（210）设置成面对所述导光板（100）的侧表面（110），底部底盘（300），包括从基部（310）的圆周向上延伸的基部（310）和侧壁（320），并且以这样的方式容纳光源模块（220）和导光板（100）一个或多个LED（210）设置成与侧壁（320）相邻，并且驱动单元控制施加到多个LED块中的每一个的电流信号，从而控制每个LED块的亮度。

27. 发明公开

EP2385292A1 Illumination apparatus employing light-emitting device package 审中-公开
标题翻译： use use use use use use use use use use use
公开(公告)号：EP2385292A1
公开(公告)日：2011-11-09
申请号：EP11163644.5
申请日：2011-04-26
申请人： Samsung LED Co., Ltd.
发明人： Moon, Kyung-mi , Song, Young-hee , Choi, Ill-heung , Lee, Jeong-wook , Lee, Young-jin
IPC分类号： F21K99/00
CPC分类号： F21V23/06 , F21K9/275 , F21V29/507 , F21V29/83 , F21Y2103/10 , F21Y2115/10 , H01L2224/48091 , H01L2224/48247 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
摘要： An illumination apparatus includes a light source unit comprising at least one light source module comprising a plurality of light-emitting device chips and a lead frame on which the light-emitting device chips are mounted and which connects the mounted light-emitting device chips; a diffusion cover having an interior space in which the light source module is accommodated and diffusing light emitted from the light source module; and an installation portion formed adjacent to the diffusion cover to install the light source module.
摘要翻译：一种照明装置，包括：光源单元，包括至少一个包括多个发光器件芯片的光源模块和引导框架，所述引线框架安装有发光器件芯片，并连接所安装的发光器件芯片; 具有容纳光源模块的内部空间和从光源模块发射的光的漫射罩; 以及与扩散罩相邻形成的安装部，以安装光源模块。

28. 发明公开

EP2383602A2 Optical sheet for a light source module, backlight unit, display apparatus, television set, and illumination apparatus 有权转让
标题翻译：用于照明模块，背光源，显示装置，电视和照明装置中的光学薄膜
公开(公告)号：EP2383602A2
公开(公告)日：2011-11-02
申请号：EP11164369.8
申请日：2011-04-29
申请人： Samsung LED Co., Ltd.
发明人： Park, Jung Kyu , Park, Young Sam , Choi, Sung A , Lim, Jeong Eun , Kim, Jin Mo , Hong, Man Ki , Han, Tae Heon , Shin, Churl Wung , Kim, Young Taek , Hong, Dae Woon , Jun, Young Geun , Kook, Jung Kyu
IPC分类号： G02B27/09 , G02B5/02 , H01L33/58
CPC分类号： F21V11/00 , F21K9/60 , F21Y2115/10 , G02B19/0014 , G02B19/0061 , G02B19/0071 , G02F1/133603 , G02F1/133606 , H01L33/58 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/8592 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A light source module, a backlight unit, a display apparatus, a television set, and an illumination apparatus are provided. The light source module includes: one or more light source units (101) including a light emitting element (111) emitting light when electricity is applied thereto; and an optical sheet (103) disposed above the light source units (101) and exhibiting bidirectional transmittance distribution function characteristics having first and second peaks at radiation angles less than 0° and greater than 0°.

29. 发明公开

EP2354773A1 Apparatus and method for evaluating optical properties of an LED and method for manufacturing an LED device 审中-公开
标题翻译：装置和方法的LED的光学特性评价和方法，用于制造LED器件
公开(公告)号：EP2354773A1
公开(公告)日：2011-08-10
申请号：EP11153302.2
申请日：2011-02-04
申请人： Samsung LED Co., Ltd.
发明人： Sohn, Jong Rak , Park, Il Woo
IPC分类号： G01J1/04
CPC分类号： H01L22/10 , G01J1/04 , G01J1/0488 , G01J3/0251 , G01J2001/4252 , H01L33/50 , H01L2224/48091 , H01L2924/00014
摘要： An optical property evaluation apparatus (100) includes: a light conversion filter (151,152) converting light emitted from an LED chip (50) or a bare LED package, which is to be evaluated, into a different wavelength of light, and emitting a specific color of light; and an optical property measurement unit (130,140) receiving the specific color of light emitted from the light conversion filter and measuring the optical properties of the received light.
摘要翻译：一种光学性能评估设备（100）包括：光转换滤光器（151,152）从到LED芯片（50）或裸LED封装件发射的光转换，所有要被评估的，成不同波长的光，并且发射特定光的颜色; 和光学性能测量单元（130,140）接收来自所述光转换滤光器发射的光的特定颜色并测量所接收的光的光学特性。

30. 发明公开

EP2232595A4 LIGHT EMITTING DIODE PACKAGE 审中-公开
标题翻译： LEUCHTDIODENKAPSELUNG
公开(公告)号：EP2232595A4
公开(公告)日：2011-06-22
申请号：EP08864310
申请日：2008-12-24
申请人： SAMSUNG LED CO LTD
发明人： PYEON IN-JOON , KIM HONG-MIN
IPC分类号： H01L33/00 , H01L33/48 , H01L33/60 , H01L33/62
CPC分类号： H01L33/62 , H01L33/486 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/01021 , H01L2924/01068 , H01L2924/00014

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