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    • 16. 发明公开
    • Methods of fabricating mems with a shaped substrate and devices formed by same
    • 一种用于生产MEMS的具有由此形成的成型基底和设备处理
    • EP1998211A2
    • 2008-12-03
    • EP08153806.8
    • 2008-03-31
    • Qualcomm Mems Technologies, Inc.
    • Sampsell, Jeffrey BrianGally, Brian JamesFloyd, Philip, Don
    • G02B26/00B81B3/00
    • G02B26/0841B81B3/007B81B2201/042B81B2207/07B81B2207/092G02B5/284G02B26/001H01L31/04Y10T29/49126
    • Methods of fabricating a microelectromechanical systems (MEMS) device with shaped substrate and MEMS devices formed by the same are disclosed. In one embodiment, a MEMS device is fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed thereover. A carrier including movable electrodes formed thereover is attached to the front substrate. The carrier of some embodiments is released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the MEMS device. Features on the front substrate are shaped by embossing, by inscribing, or by patterning and etching. The methods not only reduce the manufacturing costs, but also provide a higher yield. The resulting MEMS devices can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.
    • 微机电系统(MEMS)装置与由相同的形成的成型基板和MEMS器件的制造方法是游离缺失盘。 在一个,实施例的MEMS装置通过层叠前部衬底和载体,其每一个具有预成型于其上的组件制成。 前基板上设置有上形成有固定电极。 载体,包括在被附接到前部衬底在那里形成可动电极。 一些实施例的载体传递环后释放可动电极的前部衬底。 在其它实施方案中,载体保持在所述前基片,并作为MEMS器件的背板。 在前面基板的特征由压花形,通过刻或通过图案化和蚀刻。 该方法不仅降低制造成本,因此而提供更高的收益率。 所得MEMS装置可以层叠基板之间并捕获更小的体积对压力变化和湿气泄漏不敏感。