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11. 发明公开

EP2292696A1 Method for improving flame retardant efficiency of phenoxyphosphazene compound, and prepreg, laminate, and laminate for printed circuit made by the method 审中-公开
标题翻译：从这个过程中提高苯氧基膦腈和预浸料叠层的用于印刷电路板的阻燃性效率和层压方法
公开(公告)号：EP2292696A1
公开(公告)日：2011-03-09
申请号：EP10173756.7
申请日：2010-08-23
申请人： Guangdong Shengyi Sci. Tech Co., Ltd.
发明人： He, Yueshan , Cheng, Tao , Su, Shiguo , Wang, Biwu , Li, Jie
IPC分类号： C08L85/02 , C08K5/357 , C08K5/5399 , C08L79/04
CPC分类号： B32B15/20 , B32B5/022 , B32B5/22 , B32B5/26 , B32B15/14 , B32B2260/021 , B32B2260/046 , B32B2262/02 , B32B2262/06 , B32B2262/08 , B32B2262/10 , B32B2307/20 , B32B2307/306 , B32B2307/3065 , B32B2307/50 , B32B2307/546 , B32B2307/714 , B32B2307/7246 , B32B2307/7265 , B32B2457/08 , C08K5/357 , C08K5/5399 , C08L63/00 , C08L85/02 , C08L2203/20 , Y10T428/249952 , Y10T428/31511 , Y10T428/31529 , Y10T428/31678 , C08L2666/14
摘要： The present invention provides a method for improving the flame retardant efficiency of a phenoxyphosphazene compound, and provides a prepreg, a laminate, and a laminate for printed circuit that are made by the method. The present invention compounds a phenoxyphosphazene compound and a dihydrobenzoxazine ring-containing compound in a halogen-free flame retardant resin composition, so as to effectively improve the flame-retardant efficiency of the phenoxyphosphazene compound. Besides, the prepreg, the laminate and the laminate for printed circuit that are made by the method for improving the flame retardant efficiency of a phenoxyphosphazene compound have excellent flame retardancy, chemical resistance, anti-CAF property, high glass transition temperature (Tg), high thermal resistance, low dielectric dissipation factor, low moisture, and low C.T.E, etc. Furthermore, epoxy resins are interfused to greatly overcome the brittleness of the benzoxazine resin, so, the cured resin has comparatively high flexural strength and good processability.
摘要翻译：本发明提供了用于改进苯氧基磷腈化合物的阻燃效率的方法，并且提供了预浸料坯，层叠，以及用于印刷电路的层压并通过所述的方法制造。本发明的化合物一个苯氧基磷腈化合物和无卤阻燃树脂组合物中的二氢苯并恶嗪环的化合物，从而有效地提高了苯氧基磷腈化合物的阻燃效率。另外，预浸料坯，层压板和印刷电路用层叠体也被通过该方法制备用于改善苯氧基磷腈化合物的阻燃效率具有优异的阻燃性，耐化学性，抗CAF性，高玻璃化转变温度（Tg）高耐热性，低介电损耗，低水分和低CTE等。此外更多，环氧树脂interfused大大克服苯并恶嗪树脂的脆性，所以固化后的树脂具有较高的抗弯强度和良好的加工性。

12. 发明公开

EP2290009A1 Halogen-free flame retardant resin composition, and, prepreg, laminate, and laminate for printed circuit made therefrom 有权
标题翻译： Halogenfreie flammenhemmende Harzzusammensetzung und Prepreg，Laminat und LaminatfürLeiterplatte daraus
公开(公告)号：EP2290009A1
公开(公告)日：2011-03-02
申请号：EP10173740.1
申请日：2010-08-23
申请人： Guangdong Shengyi Sci. Tech Co., Ltd.
发明人： He, Yueshan , Cheng, Tao , Su, Shiguo , Wang, Biwu , Li, Jie
IPC分类号： C08L85/02 , C08K5/357 , C08K5/5399 , C08L79/04 , C08J5/24 , H05K1/03
CPC分类号： C08K5/357 , C08G59/5073 , C08G59/621 , C08G59/686 , C08J5/24 , C08J2385/02 , C08J2463/00 , C08K5/5399 , C08L63/00 , H05K1/0326 , H05K1/0353 , H05K1/0366 , H05K2201/012 , H05K2201/0209 , Y10T428/24994 , Y10T428/31511 , Y10T428/31529
摘要： The present invention provides a halogen-free flame retardant resin composition, and, a prepreg, a laminate, and a laminate for printed circuit that are made from the halogen-free flame retardant resin composition. The halogen-free flame retardant resin composition comprises: (A) 40- 80 parts by weight of the mixture of a phenoxyphosphazene compound (A1) and a dihydrobenzoxazine ring-containing compound (A2), and, the weight ratio between the phenoxyphosphazene compound (A1) and the dihydrobenzoxazine ring-containing compound (A2) being between 1:10 and 1:2;(B) 15- 45 parts by weight of a polyepoxy compound;(C) 5- 25 parts by weight of a phenolic resin type hardener; and (D)0.1- 1 parts by weight of an imidazole type compound as the curing accelerator. The prepreg, the laminate, and the laminate for printed circuit that are made from the halogen-free flame retardant resin composition provided by the present invention, have excellent flame retardancy, as well as has high glass transition temperature (Tg), high thermal resistance, high flexural strength, high reliability, low dielectric dissipation factor, low moisture, low C.T.E, good chemical resistance, and good processability.
摘要翻译：本发明提供一种无卤阻燃树脂组合物，以及由无卤阻燃树脂组合物制成的无卤阻燃树脂组合物，预浸料，层压板和印刷电路用叠层体。无卤阻燃树脂组合物包含：（A）40-80重量份的苯氧基磷腈化合物（A1）和含二氢苯并恶嗪环的化合物（A2）的混合物，以及苯氧基磷腈化合物（ A1），含二氢苯并恶嗪环的化合物（A2）为1:10〜1:2;（B）15〜45重量份的聚环氧化合物;（C）5-25重量份酚醛树脂型硬化剂; 和（D）0.1-1重量份作为固化促进剂的咪唑型化合物。由本发明提供的无卤阻燃树脂组合物制成的预浸料，层压板和印刷电路用层压体具有优异的阻燃性，并且具有高玻璃化转变温度（Tg），高耐热性抗弯强度高，可靠性高，介电损耗因数低，水分低，CTE低，耐化学性好，加工性好。

13. 发明公开

EP2241589A2 Composite material and high-frequency circuit substrate made therefrom 审中-公开
标题翻译：。und。。。。。。。。。。。。。
公开(公告)号：EP2241589A2
公开(公告)日：2010-10-20
申请号：EP10152472.6
申请日：2010-02-03
申请人： Guangdong Shengyi Sci. Tech Co., Ltd.
发明人： Su, Min She
IPC分类号： C08J5/24 , C08J5/04 , H05K1/03
摘要： The invention relates to a composite material and a high-frequency circuit substrate made from the composite material. The composite material includes: a thermosetting composition in an amount of 20 to 70 by weight with respect to the composite material, a fiberglass cloth processed by coupling agent; a powder filler; a fire retardant and a cure initiator. The thermosetting composition includes a resin with molecular weight thereof being less than 11,000, and a low-molecular-weight solid allyl resin. The resin is composed of carbon and hydrogen element. More than 60 percent of the resin is vinyl.; The high-frequency circuit substrate made from the composite material comprises: a plurality of prepregs mutually overlapped and copper foils respectively covered on both sides of overlapped prepregs, wherein each prepreg is made from the composite material. The composite material of the present invention realizes easy manufacture of the prepreg and high bonding of the copper foil. The high-frequency circuit substrate made from the composite material has low dielectric constant, low dielectric loss tangent, and excellent heat resistance, and is convenient for process operation. Therefore, the composite material is suitable for making the circuit substrate.
摘要翻译：本发明涉及由复合材料制成的复合材料和高频电路基板。复合材料包括：相对于复合材料为20〜70重量％的热固性组合物，由偶联剂处理的玻璃纤维布; 粉末填料; 阻燃剂和固化引发剂。热固性组合物包括分子量小于11,000的树脂和低分子量固体烯丙基树脂。树脂由碳和氢元素组成。超过60％的树脂是乙烯基。由复合材料制成的高频电路基板包括：相互重叠的多个预浸料和分别覆盖在重叠的预浸料的两侧的铜箔，其中每个预浸料由复合材料制成。本发明的复合材料实现了预浸料的容易制造和铜箔的高粘合性。由复合材料制成的高频电路基板具有低介电常数，低介电损耗角正切和优异的耐热性，并且方便操作。因此，复合材料适于制造电路基板。

14. 发明授权

EP2241589B1 Composite material and high-frequency circuit substrate made therefrom 有权
公开(公告)号：EP2241589B1
公开(公告)日：2019-12-25
申请号：EP10152472.6
申请日：2010-02-03
申请人： Guangdong Shengyi Sci. Tech Co., Ltd.
发明人： Su, Min She
IPC分类号： C08J5/24 , C08J5/04 , H05K1/03

15. 发明公开

EP2770024A1 EPOXY RESIN COMPOSITION AND PREPREG AND COPPER CLAD LAMINATE MANUFACTURED BY USING THE SAME 审中-公开
标题翻译：环氧树脂
公开(公告)号：EP2770024A1
公开(公告)日：2014-08-27
申请号：EP11874126.3
申请日：2011-10-18
申请人： Guangdong Shengyi Sci. Tech Co., Ltd
发明人： ZENG, Xianping
IPC分类号： C08L63/00 , C08G59/20 , C08G59/40 , C08G59/32 , C08G59/42 , H05K1/03
CPC分类号： C08G59/4223 , C08G59/24 , C08G59/3218 , C08G59/4215 , C08G59/4276 , C08L63/04 , H05K1/0326 , H05K1/0366 , H05K1/056 , H05K3/022 , H05K2201/012 , H05K2201/0195 , H05K2201/0209 , H05K2201/0212 , H05K2201/0355 , Y10T428/31522 , C08L67/00
摘要： Epoxy resin composition and prepreg and copper clad laminate manufactured by using the same are provided. The epoxy resin composition comprises the following essential components: (A) epoxy resin containing naphthol structure; (B) active ester curing agent; (C) curing accelerant. The epoxy composition in this invention can be used to prepare epoxy resin condensate with low water absorption and low dielectric loss value. The prepreg and copper clad laminate manufactured have good dielectric properties, moisture and heat resistance performance and high glass transition temperature.
摘要翻译：提供环氧树脂组合物和使用它们的预浸料和覆铜层压板。环氧树脂组合物包含以下主要成分：（A）含有萘酚结构的环氧树脂; （B）活性酯固化剂; （C）固化促进剂。本发明的环氧组合物可用于制备具有低吸水性和低介电损耗值的环氧树脂缩合物。制造的预浸料和覆铜层压板具有良好的介电性能，耐湿性和耐热性能以及高玻璃化转变温度。

16. 发明公开

EP2706088A1 COMPOSITE MATERIAL, HIGH-FREQUENCY CIRCUIT BASEBOARD MADE THEREFROM AND PRODUCTION METHOD THEREOF 审中-公开
标题翻译：复合材料，用于RF其电路护墙板及其制造方法
公开(公告)号：EP2706088A1
公开(公告)日：2014-03-12
申请号：EP11865413.6
申请日：2011-09-14
申请人： Guangdong Shengyi Sci. Tech Co., Ltd
发明人： SU, Minshe
IPC分类号： C08J9/42 , H05K1/03
CPC分类号： H05K1/0373 , C08J5/18 , C08J9/42 , C08J2201/038 , C08J2327/18 , C08J2427/18 , H05K1/024 , H05K1/036 , H05K1/0366 , H05K2201/0116 , H05K2201/0209 , Y10T428/3154
摘要： Disclosed is a composite material, a high-frequency circuit baseboard made therefrom and a production method thereof. The composite material comprises: a dispersed emulsion of fluoropolymer with a low dielectric loss; a porous, expanded polytetrafluoroethylene film; and a powdery packing. The high-frequency circuit baseboard made from the composite material comprises: several laminated sheets of prepreg made from the composite material, and copper foils pressed over the two sides thereof. The baseboard uses a porous ePTFE film with an excellent dielectric property as a carrier material, which can lower the dielectric constant and dielectric loss angle tangent of the composite material and high-frequency circuit baseboard; due to good flatness and uniformity of the porous ePTFE film, the dielectric constant of the high-frequency circuit baseboard and prepreg made by using the film as the carrier material is isotropic in both X and Y directions; and the thickness of the prepreg made from the composite material can be regulated by employing porous ePTFE films with a different thickness, which avoids the cracking problem caused by using a thick film produced by casting.
摘要翻译：本发明公开了一种复合材料，由其制成的高频电路基板及其制造方法。复合材料包含：具有低介电损耗的氟聚合物分散乳液; 多孔的，膨胀的聚四氟乙烯膜; 和粉状填料。由复合材料制成的高频电路基板包括：压在其两侧由该复合材料制成的预浸料坯的若干层压板，和铜箔。该基板使用多孔ePTFE薄膜-具有优良的介电性能作为载体材料，其可以降低介电常数和复合材料和高频电路基板的介质损耗角正切; 由于良好的平坦性和多孔的ePTFE电影的均匀性，高频电路基板和预浸料坯，通过使用该膜作为载体材料制成的介电常数是在X和Y方向上各向同性的; 和由复合材料制成的预浸料的厚度可以通过用不同的厚度，从而避免了因使用通过铸造制造的厚膜的开裂问题用人多孔ePTFE薄膜来调节。

17. 发明授权

EP2150094B1 Composite material, high-frequency circuit substrate made therefrom and making method thereof 有权
标题翻译：由此其高频布线基板及其制造方法制备的复合材料
公开(公告)号：EP2150094B1
公开(公告)日：2012-05-16
申请号：EP09165921.9
申请日：2009-07-20
申请人： Guangdong Shengyi Sci. Tech Co., Ltd.
发明人： Su, Min She
IPC分类号： H05K1/03
CPC分类号： H05K1/0373 , H05K1/032 , H05K1/0366 , H05K2201/0158 , H05K2201/0209 , H05K2201/0212 , Y10T428/24355 , Y10T442/2418 , Y10T442/2475 , Y10T442/2992 , Y10T442/3594

18. 发明公开

EP2241589A3 Composite material and high-frequency circuit substrate made therefrom 审中-公开
标题翻译：复合材料，以及由其高频配线基板制造
公开(公告)号：EP2241589A3
公开(公告)日：2012-01-18
申请号：EP10152472.6
申请日：2010-02-03
申请人： Guangdong Shengyi Sci. Tech Co., Ltd.
发明人： Su, Min She
IPC分类号： C08J5/24 , C08J5/04 , H05K1/03
摘要： The invention relates to a composite material and a high-frequency circuit substrate made from the composite material. The composite material includes: a thermosetting composition in an amount of 20 to 70 by weight with respect to the composite material, a fiberglass cloth processed by coupling agent; a powder filler; a fire retardant and a cure initiator. The thermosetting composition includes a resin with molecular weight thereof being less than 11,000, and a low-molecular-weight solid allyl resin. The resin is composed of carbon and hydrogen element. More than 60 percent of the resin is vinyl.; The high-frequency circuit substrate made from the composite material comprises: a plurality of prepregs mutually overlapped and copper foils respectively covered on both sides of overlapped prepregs, wherein each prepreg is made from the composite material. The composite material of the present invention realizes easy manufacture of the prepreg and high bonding of the copper foil. The high-frequency circuit substrate made from the composite material has low dielectric constant, low dielectric loss tangent, and excellent heat resistance, and is convenient for process operation. Therefore, the composite material is suitable for making the circuit substrate.

19. 发明公开

EP2150094A3 Composite material, high-frequency circuit substrate made therefrom and making method thereof 有权
标题翻译：复合材料，由其制成的高频电路基板及其制造方法
公开(公告)号：EP2150094A3
公开(公告)日：2010-08-04
申请号：EP09165921.9
申请日：2009-07-20
申请人： Guangdong Shengyi Sci. Tech Co., Ltd.
发明人： Su, Min She
IPC分类号： H05K1/03
CPC分类号： H05K1/0373 , H05K1/032 , H05K1/0366 , H05K2201/0158 , H05K2201/0209 , H05K2201/0212 , Y10T428/24355 , Y10T442/2418 , Y10T442/2475 , Y10T442/2992 , Y10T442/3594
摘要： The invention relates to a composite material, a high-frequency circuit substrate made from the composite material and a making method of the high-frequency circuit substrate. The composite material includes: a thermosetting composition including a more than 60 percent of vinyl containing Butadiene styrene copolymer resin with molecular weight less than 11,000, a more than 60 percent of vinyl containing polybutadiene resin with polarity groups, and a maleic anhydride grafted polybutadiene styrene copolymer with molecular weight more than 50,000; a fiberglass cloth; a powder filler; and a cure initiator. The composite material of the prevent invention realizes easy manufacture of the prepreg and high bonding of the copper foil. The high-frequency circuit substrate made from the composite material has low dielectric constant, low dielectric loss tangent, and excellent heat resistance, and is convenient for process operation. Therefore, the composite material is suitable for making the circuit substrate.
摘要翻译：本发明涉及一种复合材料，由该复合材料制成的高频电路基板以及该高频电路基板的制造方法。该复合材料包括：热固性组合物，其包含超过60％的分子量小于11,000的含乙烯基的丁二烯苯乙烯共聚物树脂，超过60％的具有极性基团的含乙烯基的聚丁二烯树脂和马来酸酐接枝的聚丁二烯苯乙烯共聚物分子量超过50,000; 玻璃纤维布; 粉末填料; 和一个固化引发剂。本发明的复合材料实现了预浸料坯的容易制造和铜箔的高接合。由复合材料制成的高频电路基板具有低介电常数，低介电损耗角正切和优异的耐热性，并且便于工艺操作。因此，该复合材料适用于制作电路基板。

20. 发明公开

EP2657296A1 HALOGEN-FREE RESIN COMPOSITION AND METHOD FOR FABRICATING HALOGEN-FREE COPPER CLAD LAMINATE USING THE SAME 审中-公开
标题翻译： HALOGENFREIE HARZZUSAMMENSETZUNG UND VERFAHREN ZUR HERSTELLUNG EINES HALOGENFREIEN KUPFERKASCHIERTEN LAMINATS DAMIT
公开(公告)号：EP2657296A1
公开(公告)日：2013-10-30
申请号：EP11851266.4
申请日：2011-09-03
申请人： Guangdong Shengyi Sci. Tech Co., Ltd
发明人： HE, Yueshan , SU, Shiguo
IPC分类号： C08L63/00 , C08G59/62 , B32B15/08 , B32B15/14 , B32B15/20 , B32B17/02 , B32B17/10 , H05K1/03
CPC分类号： H01B3/40 , B32B5/024 , B32B15/14 , B32B2260/021 , B32B2260/046 , B32B2262/101 , C08J5/24 , C08J2363/00 , C08J2371/12 , C08J2379/04 , C08L63/00 , H01B19/04 , Y10T156/1062 , C08L71/02 , C08L79/04
摘要： The present invention relate to a halogen-free resin composition and a method for fabricating a halogen-free copper clad laminate using the same. The halogen-free resin composition comprises the following components: reactive small molecular polyphenylene oxide with a number average molecular weight of 500-3000, a polybenzoxazine resin, a phosphorus-containing epoxy resin, a composite curing agent, a curing promoter, a filler, and a benzene or ketone solvent. The method for fabricating a halogen-free copper clad laminate comprises: Step 1: dissolving reactive small molecular polyphenylene oxide with a number average molecular weight of 500-3000 in a benzene or ketone solvent, adding a polybenzoxazine resin after dissolution, and mixing by stirring, to prepare a solution for use; Step 2: adding a phosphorus-containing epoxy resin, a composite curing agent, a curing promoter, and a filler to the solution for use, and stirring uniformly, to obtain a colloidal solution; Step 3: evenly coating the prepared colloidal solution to E-glass cloth with an even surface and baking, to produce a B-stage partially cured prepreg; and Step 4: cutting the B-stage partially cured prepreg into a suitable size according to the size of a compressor, precisely overlaying, placing a copper foil on and under the laminated B-stage partially cured Prepregs, and pressing in a vacuum hot pressing machine, to obtain a halogen-free copper clad laminate.
摘要翻译：无卤素树脂组合物及其制造方法本发明涉及一种无卤素树脂组合物及其制造方法。无卤树脂组合物包括数均分子量为500-3000的反应性小分子聚苯醚，聚苯并恶嗪树脂，含磷环氧树脂，复合固化剂，固化促进剂，填料，和苯或酮溶剂。制造无卤覆铜层压板的方法包括：步骤1：在苯或酮溶剂中溶解数均分子量为500-3000的反应性小分子聚苯醚，在溶解后加入聚苯并恶嗪树脂，并搅拌混合，准备使用解决方案; 步骤2：向该溶液中加入含磷环氧树脂，复合固化剂，固化促进剂和填料，均匀搅拌，得到胶体溶液; 步骤3：均匀地将制备的胶体溶液涂布到具有均匀表面的E玻璃布上并烘烤，以制备B阶段部分固化的预浸料; 和步骤4：根据压缩机的尺寸将B阶段部分固化的预浸料坯切割成合适的尺寸，精确地覆盖，将铜箔放置在层压的B阶段部分固化的预浸料坯上和下方，并在真空热压机器，以获得无卤铜箔层压板。

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