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111. 发明公开

EP2490259A2 Light-Emitting Device Package and Method of Manufacturing the Same 有权
标题翻译：它们的制备包装发光装置的处理流程
公开(公告)号：EP2490259A2
公开(公告)日：2012-08-22
申请号：EP12155685.6
申请日：2012-02-16
申请人： Samsung LED Co., Ltd.
发明人： Yoo, Cheol-jun , Song, Young-hee
IPC分类号： H01L25/16 , H01L33/48
CPC分类号： H01L25/167 , H01L2224/16 , H01L2224/48091 , H01L2224/4824 , H01L2224/73265 , H01L2224/8592 , H01L2924/15151 , H01L2924/00014
摘要： A light-emitting device package and a method of manufacturing the light-emitting device package. The light-emitting device package includes a wiring substrate (110); a Zener diode (150) mounted on a first region of the wiring substrate; a light-emitting device chip (130) mounted on the first region and a second region of the wiring substrate; and a molding member (120) for fixing at least a portion of the wiring substrate, wherein the Zener diode is embedded in the molding member.

112. 发明公开

EP2487730A2 Flip chip LED package and manufacturing method thereof 审中-公开
标题翻译： Flipchip-LED-Baugruppe und Herstellungsverfahrendafür
公开(公告)号：EP2487730A2
公开(公告)日：2012-08-15
申请号：EP12153743.5
申请日：2012-02-03
申请人： Samsung LED Co., Ltd.
发明人： Kim, Kwon Joong , Paek, Ho Sun , Kim, Hak Hwan
IPC分类号： H01L33/48 , H01L33/36 , H01L33/62
CPC分类号： H01L33/486 , H01L33/36 , H01L33/62 , H01L2224/16245 , H01L2933/0016
摘要： A flip chip LED package (100) and a manufacturing method thereof are provided. The flip chip LED package (100) includes a package substrate (110) including a cavity (111) that exposes a circuit pattern (114,115), and a chip mounting portion (113) disposed on a bottom surface (112) of the cavity (111); a solder layer (120a,120b) disposed on the circuit pattern (114,115); a bonding tape layer (130) disposed on the chip mounting portion (113); and an LED chip (140) including a bonding object region (A) and a plurality of electrode pads (141,142) disposed on one surface, being mounted on the package substrate (110) such that the plurality of electrode pads (141,142) are bonded to the solder layer (120a,120b) and the bonding object region (A) is bonded to the bonding tape layer (130).
摘要翻译：提供了一种倒装芯片LED封装（100）及其制造方法。倒装芯片LED封装（100）包括包括暴露电路图案（114,115）的空腔（111）的封装基板（110）和设置在空腔的底表面（112）上的芯片安装部分（113） 111）; 设置在电路图案（114,115）上的焊料层（120a，120b）; 设置在所述芯片安装部分（113）上的接合带层（130）; 以及包括粘合对象区域（A）和设置在一个表面上的多个电极焊盘（141,142）的LED芯片（140），安装在所述封装基板（110）上，使得所述多个电极焊盘（141,142）被接合到焊料层（120a，120b）并且粘合物区域（A）被粘合到粘合带层（130）上。

113. 发明公开

EP2479809A2 Mold structure for light-emitting diode package 有权转让
标题翻译： FormstrukturfürLeuchtdiodenbauelemente
公开(公告)号：EP2479809A2
公开(公告)日：2012-07-25
申请号：EP11180993.5
申请日：2011-09-13
申请人： Samsung LED Co., Ltd.
发明人： Choi, Sun , Park, Jong-jin
IPC分类号： H01L33/48 , H01L33/54
CPC分类号： H01L33/486 , H01L33/62 , H01L2224/48247 , H01L2224/48465 , H01L2924/00
摘要： A mold structure for a light-emitting diode (LED) package (20). The mold structure includes a notch (22), which is formed at at least an end portion of a package mold, in which a cavity is formed to mount a LED therein. Furthermore, an electrode lead (23), may be formed at at least an end portion of the package mold and may be closely attached to the package mold, and thus the overall size of a LED package may be reduced.
摘要翻译：一种用于发光二极管（LED）封装（20）的模具结构。模具结构包括形成在封装模具的至少一个端部处的凹口（22），其中形成腔体以将LED安装在其中。此外，电极引线（23）可以形成在封装模具的至少一个端部处，并且可以紧密地附接到封装模具，因此可以减小LED封装的整体尺寸。

114. 发明公开

EP2472616A2 Light-emitting device package and method of manufacturing the same 有权转让
标题翻译：发光器件封装及其制造方法
公开(公告)号：EP2472616A2
公开(公告)日：2012-07-04
申请号：EP11195837.7
申请日：2011-12-28
申请人： Samsung LED Co., Ltd.
发明人： Kim, Hyung-kun
IPC分类号： H01L33/62 , H01L33/60 , H01L25/075
CPC分类号： H01L25/0753 , H01L33/50 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2924/01322 , H01L2924/00014
摘要： A light-emitting device package uses a metal layer (10) as a reflective region and includes a light-emitting device chip (50) and an electrode pad (60) that are disposed on an insulating layer (20). In addition, the electrode pad and an electrode pattern of a printed circuit board (30) are connected to each other by an electrode pattern (70) formed of conductive ink. A method of manufacturing a light-emitting device package includes forming an insulating layer on a metal layer, and bonding a light-emitting device chip and an electrode pad on the insulating layer. The electrode pad and a printed circuit board are connected to each other by conductive ink.
摘要翻译：发光器件封装使用金属层（10）作为反射区域并且包括设置在绝缘层（20）上的发光器件芯片（50）和电极焊盘（60）。另外，印刷电路板（30）的电极焊盘和电极图案通过由导电油墨形成的电极图案（70）彼此连接。一种制造发光器件封装的方法包括：在金属层上形成绝缘层;以及在绝缘层上接合发光器件芯片和电极焊盘。电极焊盘和印刷电路板通过导电墨水彼此连接。

115. 发明公开

EP2469612A2 Method of manufacturing light emitting diode 审中-公开
标题翻译：制造发光二极管的方法
公开(公告)号：EP2469612A2
公开(公告)日：2012-06-27
申请号：EP11177729.8
申请日：2011-08-17
申请人： Samsung LED Co., Ltd.
发明人： Han, Sang Heon , Rhee, Do Young , Lim, Jin Young , Kim, Ki Sung , Kim, Young Sun
IPC分类号： H01L33/00 , H01L21/02 , H01L33/32
CPC分类号： H01L33/007 , C30B25/02 , C30B29/403 , H01L21/0237 , H01L21/02458 , H01L21/02502 , H01L21/0254 , H01L21/02579 , H01L21/02581 , H01L21/0262 , H01L33/325
摘要： There is provided a method of manufacturing a light emitting diode, the method including: growing a first conductivity type nitride semiconductor layer and an active layer on a substrate in a first reaction chamber; transferring the substrate having the first conductivity type nitride semiconductor layer and the active layer grown thereon to a second reaction chamber; and growing a second conductivity type nitride semiconductor layer on the active layer in the second reaction chamber, wherein an atmosphere including a nitride source gas and a dopant source gas supplying a dopant to be included in the second conductivity type nitride semiconductor layer is created in an interior of the second reaction chamber prior to the transferring of the substrate to the second reaction chamber. This method improves a system's operational capability and productivity. In addition, the crystallinity and doping uniformity of semiconductor layers obtained by this method may be improved.
摘要翻译：提供了一种制造发光二极管的方法，该方法包括：在第一反应室中在衬底上生长第一导电型氮化物半导体层和有源层; 将具有第一导电型氮化物半导体层和在其上生长的有源层的衬底转移到第二反应室; 以及在所述第二反应室中的所述有源层上生长第二导电类型氮化物半导体层，其中在所述第二导电类型氮化物半导体层中形成包括氮化物源气体和提供待包括在所述第二导电类型氮化物半导体层中的掺杂剂的掺杂剂源气体的气氛在将衬底转移到第二反应室之前，第二反应室的内部。这种方法提高了系统的操作能力和生产力。另外，可以提高通过该方法获得的半导体层的结晶性和掺杂均匀性。

116. 发明公开

EP2463675A1 Test apparatus for power supply unit 失效转让
标题翻译： PrüfvorrichtungfürStromversorgungseinheit
公开(公告)号：EP2463675A1
公开(公告)日：2012-06-13
申请号：EP11192737.2
申请日：2011-12-09
申请人： Samsung LED Co., Ltd.
发明人： Kim, Jin Sung , Kang, Kyu Cheol , Bae, Jin Woo , Lee, Choul Ho , Choo, Jong Yang
IPC分类号： G01R31/40 , H05B33/00
CPC分类号： G01R31/40 , G01R31/2635 , H05B33/089
摘要： A test apparatus for a power supply unit is provided, which includes a body unit configured to define a space to receive a light emitting diode (LED) and to provide a test environment to test a supply state of power applied to the LED; and a test unit mounted in the body unit to face the LED and configured to detect flicker of the LED occurring when a power supply is abnormal. According to the foregoing structure, power supply with respect to the LED may be regularly detected and analyzed, thereby increasing quality of power supply with respect to the LED.
摘要翻译：提供一种用于电源单元的测试装置，其包括主体单元，该主体单元被配置为限定用于接收发光二极管（LED）的空间并且提供测试环境以测试施加到LED的电力的供应状态; 以及测试单元，其安装在所述主体单元中以面对所述LED并且被配置为检测当电源异常时发生的LED的闪烁。根据上述结构，可以定期检测和分析与LED相关的电源，从而提高相对于LED的供电质量。

117. 发明授权

EP2031437B1 Surface light source using white light emitting diodes and liquid crystal display backlight unit having the same 有权转让
标题翻译：面光源发射白光二极管和液晶显示顺序的背光单元
公开(公告)号：EP2031437B1
公开(公告)日：2012-05-23
申请号：EP08251483.7
申请日：2008-04-22
申请人： Samsung LED Co., Ltd.
发明人： Shin, Chang Ho , Cho, Dong Hyun , Yoo, Chul Hee , Kim, Dae Yeon , Kim, Hyung Suk , Hahm, Hun Joo , Shin, Jae Hong
IPC分类号： G02F1/13357 , G09G3/34
CPC分类号： G02F1/133603 , G02F1/133606 , G02F1/133611 , G09G3/3413 , G09G3/3426 , G09G2320/0233

118. 发明公开

EP2453306A1 Flash Lens and Flash Module Employing the Same 有权转让
标题翻译： LinsefürBlitzlicht und Blitzmodul damit。
公开(公告)号：EP2453306A1
公开(公告)日：2012-05-16
申请号：EP11188567.9
申请日：2011-11-10
申请人： Samsung LED Co., Ltd.
发明人： You, Jae-sung , Park, Cheon-ho , Oh, Sung-kyong , Oh, Kwan-young
IPC分类号： G03B15/03 , F21V5/04 , F21V7/00 , G02B3/08
CPC分类号： G03B15/03 , F21V13/04 , G02B3/08 , G02B19/0028 , G02B19/0061 , G03B15/05 , G03B2215/0503
摘要： A flash lens and a flash module employing the same. The flash lens includes a lens unit including an incident surface, a reflecting surface, and a light-emitting surface; and a lens seating portion disposed at a lower portion of an edge of the light-emitting surface, extending and protruding from the reflecting surface, and including a pattern formed in a lower surface thereof. In addition, the flash module according to an embodiment of the present invention may include the flash lens and a light emitting diode (LED) chip integrally formed with the flash lens.
摘要翻译：闪光镜头和使用其的闪光灯模块。闪光灯透镜包括具有入射面，反射面和发光面的透镜单元; 以及透镜座部，其设置在从所述反射面延伸并突出的所述发光面的边缘的下部，并且包括形成在所述发光面的下表面的图案。此外，根据本发明的实施例的闪光灯模块可以包括闪光镜头和与闪光镜片一体形成的发光二极管（LED）芯片。

119. 发明公开

EP2448014A2 Semiconductor light emitting device 有权转让
标题翻译：半导体发光器件
公开(公告)号：EP2448014A2
公开(公告)日：2012-05-02
申请号：EP11180652.7
申请日：2011-09-09
申请人： Samsung LED Co., Ltd.
发明人： Ryu, Yung Ho , Hwang, Hae Yeon , Shin, Young Chul
IPC分类号： H01L33/38 , H01L33/20 , H01L33/08 , H01L33/44 , H01L27/15
摘要： A semiconductor light emitting device includes: a first conductive semiconductor layer including first and second areas; an active layer disposed on the second area; a second conductive semiconductor layer disposed on the active layer; first and second electrode branches disposed on the first and second conductive semiconductor layers, respectively; a first electrode pad electrically connected to the first electrode branch and disposed on the first electrode branch; and a second electrode pad electrically connected to the second electrode branch and disposed on the second electrode branch.
摘要翻译：一种半导体发光器件包括：包括第一和第二区域的第一导电半导体层; 设置在第二区域上的有源层; 设置在有源层上的第二导电半导体层; 第一和第二电极分支，分别设置在第一和第二导电半导体层上; 电连接到第一电极分支并设置在第一电极分支上的第一电极焊盘; 以及电连接到第二电极分支并设置在第二电极分支上的第二电极焊盘。

120. 发明公开

EP2445017A2 Vertical light-emitting semiconductor device 审中-公开
标题翻译： Vertikale lichtemittierende Halbleitervorrichtung
公开(公告)号：EP2445017A2
公开(公告)日：2012-04-25
申请号：EP11180900.0
申请日：2011-09-12
申请人： Samsung LED Co., Ltd.
发明人： Hong, Hyun-kwon , Lee, Sang-don , Song, Kwang-min , Lee, Kee-won
IPC分类号： H01L33/14 , H01L33/20
CPC分类号： H01L33/14 , H01L33/20 , H01L33/38 , H01L33/405
摘要： A vertical light-emitting device includes: a substrate; a first electrode disposed on a bottom surface of the substrate; a reflection layer disposed on a top surface of the substrate; a current spreading layer disposed on the reflection layer and comprising a groove having a width narrower toward a top portion thereof; a light generation layer disposed on the current spreading layer; and a second electrode disposed on the light generation layer.
摘要翻译：垂直发光装置包括：基板（110）; 设置在所述基板的底面上的第一电极（151）设置在所述基板的顶表面上的反射层（120）设置在反射层上的电流扩展层（130），包括宽度朝向其顶部变窄的凹槽（161）; 设置在电流扩散层上的发光层（140）; 和设置在光产生层上的第二电极（152）。

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