专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

101. 发明公开

EP0764973A3 Processing system 失效
标题翻译： Bearbeitungssystem
公开(公告)号：EP0764973A3
公开(公告)日：1998-05-20
申请号：EP96116123
申请日：1992-10-22
申请人： ELECTROTECH LTD
发明人： JEFFRYES ANDREW ISAAC , GREEN GORDON ROBERT
IPC分类号： C23C14/56 , C23C14/58 , C23C26/00 , H01L21/00 , H01L21/324 , H01L21/677 , H01L21/768
CPC分类号： H01L21/67751
摘要： In order to subject a workpiece, such as a semiconductor wafer, to elevated pressures the workpiece is enclosed in a void (16) between two enclosure parts (6,7) which have been forced together by upper and lower actuators (12,13). The enclosure parts (6,7) are themselves enclosed in a vacuum chamber (1) evacuatable by a vacuum pumping system. The enclosure parts (6,7) are connected to the vacuum chamber by bellows (4,5).
摘要翻译：为了使诸如半导体晶片之类的工件承受升高的压力，工件被封闭在两个外壳部件（6,7）之间的空间（16）中，所述两个外壳部件（6,7）已经被上部和下部致动器（12,13）。外壳部件（6,7）本身被封装在真空室（1）中，抽真空系统可抽真空。外壳部分（6,7）通过波纹管（4,5）连接到真空室。

102. 发明公开

EP0829904A2 Improved substrate cooldown chamber 失效
标题翻译： Verbesserte Kammer zurSubstratkühlung
公开(公告)号：EP0829904A2
公开(公告)日：1998-03-18
申请号：EP97307199.6
申请日：1997-09-16
申请人： APPLIED MATERIALS, INC.
发明人： Rogelstad, Terrance R.
IPC分类号： H01L21/00
CPC分类号： H01L21/67751 , H01L21/67109 , H01L21/6719 , H01L21/68742 , H01L21/6875
摘要： The disclosure relates to a cooldown chamber (22) allowing more efficient and rapid cooling of a substrate. The substrate (35) is cooled in the cooldown chamber (22) utilizing a pair of cooling members (38,40), preferably mating "clam shell" style members, positioned adjacent the top and bottom surfaces of the substrate. While the top surface of the substrate should not be contacted directly, the upper cooling member can approach the substrate surface, preferably to within about 0.025 to 0.076 cms. The bottom cooling member should also approach the bottom substrate surface, preferably making contact or being within about 0.025 to 0.076 cms. With the cooling members closed to define an enclosure around a hot substrate, an inert gas is supplied to the enclosure to the space (68) surrounding the substrate at pressures between about 0.66 x 10 2 to 40 x 10 2 N/m 2 to allow efficient thermal conduction from the substrate to the cooling members. After the substrate has been given a sufficient amount of time to cool, the cooling members are separated and the high pressure gas within the enclosure is allowed to escape and diffuse into the gases occupying the remaining volume of the cooldown chamber.
摘要翻译：本公开涉及一种冷却室（22），其允许基板的更有效和快速的冷却。使用一对冷却构件（38,40）在基座（35）内冷却基底（35），优选地配合“蛤壳”型构件，邻近基底的顶表面和底表面。尽管基板的顶表面不应直接接触，但是上部冷却构件可以接近基板表面，优选在约0.025至0.076厘米的范围内。底部冷却构件也应接近底部基底表面，优选接触或在约0.025至0.076厘米的范围内。随着冷却构件关闭以限定围绕热衬底的外壳，惰性气体在约0.66×10 2至40×10 2 N / cm 2之间的压力下被供应到围绕衬底的空间（68） m 2以允许从衬底到冷却构件的有效的热传导。在基板被给予足够的时间冷却之后，冷却构件被分离并且外壳内的高压气体被允许逸出并扩散到占据冷却室的剩余容积的气体中。

103. 发明授权

EP0584076B1 SEMICONDUCTOR WAFER PROCESSING MODULE 失效
标题翻译： MODULE FOR处理半导体圆片
公开(公告)号：EP0584076B1
公开(公告)日：1997-05-14
申请号：EP92905171.2
申请日：1992-01-21
申请人： MATERIALS RESEARCH CORPORATION
发明人： HODOS, Julian , HURWITT, Steven
IPC分类号： H01L21/00 , C23C14/50
CPC分类号： H01L21/67748 , C23C14/505 , C23C14/568 , H01L21/67751 , H01L21/68707 , H01L21/68764 , H01L21/68771 , H01L21/68785 , Y10T29/41
摘要： A sputtering module incorporated into a wafer processing system (10) includes an evacuatable housing (26) connectable to one or more other evacuatable housings and a wafer handling turret (32) adapted to receive a wafer (34) in horizontal orientation at a load/unload position (38) and rotate the wafer (34) 180° about an inclined axis (46) into vertical orientation at a sputtering position (48) across from a sputtering target (52). After sputter coating, the wafer handling turret (32) again rotates 180° about the inclined axis (46) to rotatably return the wafer (34) to the horizontal load/unload position (38), whereupon the wafer (34) is lowered to a horizontal receiving position for subsequent retrieval by an arm (21) extendible into the module from an adjacently situated housing (20). The wafer handling turret (32) includes three wafer rings (85) and a disc-shaped shutter (44) that is rotatably located in front of the target (52) during precleaning.

104. 发明公开

EP0764973A2 Processing system 失效
标题翻译： Bearbeitungssystem
公开(公告)号：EP0764973A2
公开(公告)日：1997-03-26
申请号：EP96116123.9
申请日：1992-10-22
申请人： ELECTROTECH LIMITED
发明人： Jeffryes,Andrew Isaac , Green,Gordon Robert
IPC分类号： H01L21/00
CPC分类号： H01L21/67751
摘要： In order to subject a workpiece, such as a semiconductor wafer, to elevated pressures the workpiece is enclosed in a void (16) between two enclosure parts (6,7) which have been forced together by upper and lower actuators (12,13). The enclosure parts (6,7) are themselves enclosed in a vacuum chamber (1) evacuatable by a vacuum pumping system. The enclosure parts (6,7) are connected to the vacuum chamber by bellows (4,5).
摘要翻译：为了使工件（例如半导体晶片）受到升高的压力，工件被封闭在由上下致动器（12,13）被强制在一起的两个外壳部件（6,7）之间的空隙（16）中，。外壳部件（6,7）本身被封闭在真空室（1）中，可通过真空抽吸系统抽空。外壳部分（6,7）通过波纹管（4,5）连接到真空室。

105. 发明公开

EP0676086A1 WAFER TRANSPORT MODULE WITH ROTATABLE AND HORIZONTALLY EXTENDABLE WAFER HOLDER 失效转让
标题翻译：带有旋转和水平拉出HOLDER半导体晶片传输模块。
公开(公告)号：EP0676086A1
公开(公告)日：1995-10-11
申请号：EP94912146.0
申请日：1993-12-16
申请人： MATERIALS RESEARCH CORPORATION
发明人： HODOS, Julian
IPC分类号： B23Q7 , B65G49 , H01L21
CPC分类号： H01L21/67751 , Y10S414/136 , Y10S414/139 , Y10S414/141
摘要： A wafer transport module (10) interconnects a horizontal wafer handler (11) with a vertical wafer processor (12) and includes an evacuatable housing (26) with a first port (36) in communication with the horizontal wafer handler (11) and sized to permit passage of a wafer (35) therethrough in horizontal orientation and a second port (38) in communication with a load/unload station of the vertical wafer processor (12) and sized to permit passage of wafers (35) therethrough in vertical orientation. The transport module (10) includes a wafer holder (25) which supports a wafer (35) on a pedestal (52) and rotates the pedestal (52) and wafer (35) about an inclined axis (28) between horizontal orientation adjacent the first port (36) and vertical orientation adjacent and in alignment with the second port (38). The wafer holder (25) horizontally extends the vertically oriented platen (52) and wafer (35) from the second position through the second port (38) to the load/undload station of the vertical processor (12). After wafer processing, the sequence is reversed to return the wafer (35) to the horizontal wafer handler (11).

106. 发明公开

EP0584076A1 SEMICONDUCTOR WAFER PROCESSING MODULE 失效
标题翻译： MODULE FOR处理半导体光盘。
公开(公告)号：EP0584076A1
公开(公告)日：1994-03-02
申请号：EP92905171.0
申请日：1992-01-21
申请人： MATERIALS RESEARCH CORPORATION
发明人： HODOS, Julian , HURWITT, Steven
IPC分类号： B65G49 , C23C14 , H01L21
CPC分类号： H01L21/67748 , C23C14/505 , C23C14/568 , H01L21/67751 , H01L21/68707 , H01L21/68764 , H01L21/68771 , H01L21/68785 , Y10T29/41
摘要： Module de pulvérisation incorporé à un système de traitement de plaquettes (10) comprenant un boîtier pouvant être vidé (26) reliable à un ou plusieurs autres boîtiers pouvant être vidés et une tourelle de manipulation de plaquettes (32) adaptée pour recevoir une plaquette (34) orientée horizontalement dans une position e chargement/déchargement (38) et pour faire tourner ladite plaquette (34) de 180° autour d'un axe incliné (46) afin de la placer verticalement dans une position de pulvérisatin (48) face à une cible de pulvérisation (52). Après le revêtement par pulvérisation, la tourelle de manipulation de plaquettes (32) effectue à nouveau une rotation de 180° autour d'un axe incliné (46) afin de remettre rotativement la plaquette (34) en position horizontale de chargement/déchargement (38), après quoi ladite plaquette (34) est abaissée à une position horizontale de réception afin d'être ensuite récupérée par un bras (21) capable de pénétrer à l'intérieur du module depuis un boîtier adjacent (20). Ladite tourelle de manipulation de plaquettes (32) comprend trois anneaux de retenue (85) de plaquette et un obturateur en forme de disque (44) situé rotatif face à la cible (52) pendant le prénettoyage.

107. 发明授权

EP0389820B1 Vorrichtung zum Ein- und Ausschleusen eines Werkstücks in eine Vakuumkammer 失效转让
标题翻译：用于将工作传送到真空室的设备
公开(公告)号：EP0389820B1
公开(公告)日：1993-06-16
申请号：EP90104004.8
申请日：1990-03-01
申请人： LEYBOLD AKTIENGESELLSCHAFT
发明人： Kempf, Stefan
IPC分类号： C23C14/50 , C23C14/56 , H01L21/00
CPC分类号： H01L21/67751 , C23C14/50 , C23C14/566

108. 发明公开

EP0516136A2 Semiconductor manufacturing apparatus 失效转让
标题翻译： Halbleiter-Herstellungseinrichtung。
公开(公告)号：EP0516136A2
公开(公告)日：1992-12-02
申请号：EP92109073.4
申请日：1992-05-29
申请人： Tokyo Electron Kabushiki Kaisha
发明人： Kumagai, Hiromi
IPC分类号： H01L21/00
CPC分类号： H01L21/67069 , H01L21/67739 , H01L21/67742 , H01L21/67745 , H01L21/67751 , H01L21/67754 , Y10S414/137 , Y10S414/139 , Y10S414/14
摘要： In a semiconductor manufacturing apparatus, provided are a vacuum processing chamber (2) which implements a required processing to an object (4) of processing under an atmosphere of reduced pressure, a single spare vacuum processing chamber (3) provided to one side and adjacent to the vacuum processing chamber (2) and provided with a support mechanism (6) to support the object (4) of processing and a conveyor (5) arm to convey the object (4) of processing internally. Thus the object of processing (4) is conveyed to the vacuum processing chamber (2) and conveyed from the vacuum processing chamber (2) via the spare vacuum processing chamber (3).
摘要翻译：在半导体制造装置中，设置有在减压气氛下进行处理对象物（4）的真空处理室（2），设置在一侧和相邻的单个备用真空处理室（3）到真空处理室（2）并且设置有用于支撑处理物体（4）的支撑机构（6）和输送机（5）臂以在内部传送处理物体（4）。因此，处理（4）的目的被传送到真空处理室（2）并且经由备用真空处理室（3）从真空处理室（2）传送。

109. 发明公开

EP0421498A3 Device for the rapid loading of substrates or other articles into vacuum plants 失效
标题翻译：将基材或其他物品快速装入真空植物的装置
公开(公告)号：EP0421498A3
公开(公告)日：1991-09-04
申请号：EP90201910.8
申请日：1990-07-13
申请人： CONSORZIO CE.TE.V. CENTRO TECNOLOGIE DEL VUOTO
发明人： Misiano, Carlo , Simonetti, Enrico
IPC分类号： C23C14/56 , B01L1/02
CPC分类号： H01L21/67751 , B01L1/02 , C23C14/566
摘要： Device for the rapid loading of substrates into vacuum plants, comprising a small evacuable forechamber (1) of restricted dimensions, equipped with an opening (1A) towards the ambient atmosphere and an opening (11) towards the deposition chamber (5). The invention is best used in association with a vacuum chamber where it can be advantageously used for processes involving deposition of thin layers. It ensures faster working cycles, and is capable of the simultaneous treatment of several different samples under different conditions, whilst keeping the vacuum chamber at the pressure and purity wanted. Such a device can be used with any vacuum chamber and/or any treatment chamber.
摘要翻译：用于将基板快速装载到真空设备中的装置，包括装配有朝向环境大气的开口（1A）的朝向沉积室（5）的开口（11）的有限尺寸的小的可排出的前室（1）。本发明最好与真空室结合使用，其中它可以有利地用于涉及沉积薄层的工艺。它确保更快的工作周期，并且能够在不同条件下同时处理几个不同的样品，同时保持真空室处于压力和纯度要求。这种装置可以与任何真空室和/或任何处理室一起使用。

110. 发明公开

EP0367424A3 Sealing apparatus for a vacuum processing system 失效
标题翻译：真空加工系统的密封装置
公开(公告)号：EP0367424A3
公开(公告)日：1991-01-02
申请号：EP89310366.3
申请日：1989-10-11
申请人： EATON CORPORATION
发明人： Bramhall Jr., Robert Billings , Cloutier, Richard Michael , Laber, Albert Pual , Muka, Richard Stephen
IPC分类号： H01L21/00
CPC分类号： H01L21/67748 , H01L21/67126 , H01L21/67751 , H01L21/68707 , Y10S414/139 , Y10S414/141
摘要： A sealing arrangement for a vacuum processing system for semiconductor wafers which is effective to apply a sealing force to a valve element (66) between chambers of the processing system. The valve element is defined by a platen which holds wafers (30) for transfer between a horizontal receiving position within a staging chamber (14) to a vertical position within a processing chamber (16-19). The sealing arrangement includes a pair of toggle mechanisms (268) which are manually operable from outside the staging chamber and which, in conjunction with the closing force applied by the platen operating mechanism (165) are effective to maintain vacuum integrity within the staging chamber when the process chamber is at atmospheric pressure or removed for servicing.
摘要翻译：一种用于半导体晶片的真空处理系统的密封装置，其有效地向处理系统的室之间的阀元件（66）施加密封力。阀元件由保持用于在分级室（14）内的水平接收位置与处理室（16-19）内的垂直位置之间传送的晶片（30）的压板限定。密封装置包括一对肘节机构（268），其可以从分级室的外部手动操作，并且结合由压板操作机构（165）施加的闭合力有效地在分级室中保持真空完整性，处理室处于大气压力或去除维修。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式