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1. 发明公开

EP3271765A1 A CONNECTOR DEVICE FOR CONNECTING AT LEAST ONE OPTICAL FIBER END PIECE AND MANUFACTURING METHOD 审中-公开
标题翻译：用于连接至少一个光纤端部件和制造方法的连接器装置
公开(公告)号：EP3271765A1
公开(公告)日：2018-01-24
申请号：EP16709242.8
申请日：2016-03-01
申请人： Corning Optical Communications LLC
发明人： DEMERITT, Jeffery Alan , GIZIEWICZ, Wojciech Piotr , LEWALLEN, Christopher Paul , LUTHER, James Phillip , OVERCASH, Jerald Lee , SCHAEVITZ, Rebecca Kayla
IPC分类号： G02B6/42
CPC分类号： G02B6/4214 , G02B6/423 , G02B6/4249 , G02B6/4257 , G02B6/4259 , G02B6/428 , G02B6/4292
摘要： A connector device for connecting optical fiber endpieces comprising an optoelectronic chip, a fiber end piece holder and a reflection surface. The chip is oriented for emitting and/or detecting optical signals along a first propagation direction normal to a circuit board. The reflection surface changes a propagation direction of optical signals from the first propagation direction to a different, second propagation direction and/or vice versa. The connector device comprises a layered optical stack mounted to the circuit board and designed for propagation of optical signals along the first propagation direction. The connector device further comprises a coupling adapter piece mounted to the layered optical stack that holds and/or secures the fiber end piece holder in an orientation enabling propagation of signals radiation along the second propagation direction. The reflection surface for changing between both propagation directions is comprised in the coupling adapter piece.

2. 发明公开

EP3250954A1 PACKAGED OPTO-ELECTRONIC MODULE 无效
标题翻译：包装的光电模块
公开(公告)号：EP3250954A1
公开(公告)日：2017-12-06
申请号：EP16701713.6
申请日：2016-01-12
申请人： ORACLE INTERNATIONAL CORPORATION
发明人： THACKER, Hiren D. , KRISHNAMOORTHY, Ashok V. , ZHENG, Xuezhe , CUNNINGHAM, John E.
IPC分类号： G02B6/42
CPC分类号： G02B6/12004 , G02B6/30 , G02B6/32 , G02B6/4219 , G02B6/4257 , G02B6/4274 , G02B2006/12061 , G02B2006/12142 , H01L23/49827 , H01L23/49838 , H01L23/49894 , H01L25/167 , H01L2224/16225 , H01L2924/0002 , H01L2924/15311 , H04B10/803 , H01L2924/00
摘要： A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are proximate to each other in the chip package. The integrated circuit includes electrical circuits that modulate data, communicate data, and serialize/deserialize data, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a top surface of an interposer, and a top surface of the integrated circuit is electrically coupled to a front surface of the optical integrated circuit. Furthermore, a bottom surface of the optical integrated circuit faces the top surface of the interposer, and the front surface of the optical integrated circuit is optically coupled to an optical-fiber receptacle, which in turn is optically coupled to an optical-fiber connector.

3. 发明公开

EP3161537A1 OPTICAL TRANSMITTER, OPTICAL RECEIVER, OPTICAL CABLE AND LIGHT TRANSMISSION METHOD 无效转让
标题翻译：光发射机，光接收机，光缆和光传输方法
公开(公告)号：EP3161537A1
公开(公告)日：2017-05-03
申请号：EP15725900.3
申请日：2015-05-13
申请人： Sony Corporation
发明人： YAMAMOTO, Masanari , TOBA, Kazuaki , SUZUKI, Kazuyoshi , KONDO, Kazumoto , MIYAZAKI, Satoshi , NAKAJIMA, Yasuhisa
IPC分类号： G02B6/42
CPC分类号： H04B10/2503 , G02B6/4206 , G02B6/4214 , G02B6/425 , G02B6/4257 , G02B6/4292
摘要： An optical transmitter including an optical connector port, a first light emitter, and a second light emitter. The optical connector port is configured to connect to a connector of an optical cable in a first orientation or a second orientation. The first light emitter is configured to transmit a first optical signal for transmission through the optical cable. The first optical signal transmitted by the first light emitter is reflected by a region of the connector when the connector is attached in the first orientation. The second light emitter is configured to transmit a second optical signal for transmission through the optical cable. The second optical signal transmitted by the second light emitter is reflected by the region when the connector is connected in the second orientation different from the first orientation.
摘要翻译：一种光发射器，包括光连接器端口，第一光发射器和第二光发射器。光学连接器端口被配置为以第一取向或第二取向连接到光缆的连接器。第一光发射器被配置为传输用于通过光缆传输的第一光信号。当连接器以第一取向连接时，由第一发光体发送的第一光信号被连接器的区域反射。第二发光器被配置为发送用于通过光缆传输的第二光信号。当连接器以与第一取向不同的第二取向连接时，由第二发光体发送的第二光信号被该区域反射。

4. 发明授权

EP3001230B1 COUPLEUR OPTIQUE INTÉGRÉ SUR UN SUBSTRAT ET COMPRENANT TROIS ELEMENTS 有权
标题翻译：光电耦合器在基片集成IS和三个要素INCLUDES
公开(公告)号：EP3001230B1
公开(公告)日：2017-03-22
申请号：EP15186780.1
申请日：2015-09-25
申请人： Commissariat à l'Énergie Atomique et aux Énergies Alternatives
发明人： FAVREAU, Julien , BOUTAMI, Salim , BRUN, Mickaël
IPC分类号： G02B6/10 , G02B6/42
CPC分类号： G02B6/4204 , G02B6/12004 , G02B6/122 , G02B6/1228 , G02B6/132 , G02B6/136 , G02B6/4257 , G02B2006/12121

5. 发明公开

EP3114517A2 METHODS OF FORMING A FIBER COUPLING DEVICE AND FIBER COUPLING DEVICE 审中-公开
标题翻译： VERFAHREN ZUR HERSTELLUNG EINER FASERKOPPLUNGSVORRICHTUNG UND FASERKOPPLUNGSVORRICHTUNG
公开(公告)号：EP3114517A2
公开(公告)日：2017-01-11
申请号：EP15709815.3
申请日：2015-03-04
申请人： CCS Technology, Inc.
发明人： DE JONG, Michael , FORTUSINI, Davide Domenico , MATISS, Andreas , SPREEMANN, Martin , TEN HAVE, Eric Stephan
IPC分类号： G02B6/42
CPC分类号： G02B6/4214 , B23K2203/42 , B23K2203/50 , B29C64/135 , B29C64/35 , B29K2105/0058 , B29L2031/36 , B33Y10/00 , B33Y40/00 , B33Y80/00 , G02B6/138 , G02B6/4221 , G02B6/4239 , G02B6/424 , G02B6/4243 , G02B6/425 , G02B6/4257
摘要： The application provides a method of forming a fiber coupling device comprising at least one optoelectronic and/or photonic element (50) and a fiber coupling alignment structure (5) that is optically transmissive, - wherein the method at least comprises: a) applying a polymerizable material (2) to the substrate surface (16) of the substrate (15), b) selectively polymerizing, using a method of 3D lithography, a region of the polymerizable material (2) so as to convert the region of the polymerizable material (2) into a polymer material (4), thereby forming at least one fiber coupling alignment structure (5) that comprises: - a support interface surface (6) at which the polymer material (4) is in direct contact with the substrate surface (16) of the substrate (15), - a fiber support region (7) adapted to support at least one optical fiber in an aligned position for optical coupling to the substrate (15), and - a reflection surface (8) for reflecting light propagating between an optical fiber and the substrate (15), and c) cleaning the substrate (15) and the polymer material (4) from remaining non-polymerized polymerizable material (2), thereby exposing the at least one fiber coupling alignment structure (5) of the fiber coupling device (1).
摘要翻译：该应用提供了形成光纤耦合器件的方法，该光纤耦合器件包括至少一个光电子和/或光子元件（50）和光学透射的光纤耦合对准结构（5），其中该方法至少包括：a）可聚合材料（2）到基板（15）的基板表面（16），b）使用3D光刻的方法选择性聚合可聚合材料（2）的区域，以便将可聚合材料的区域（2）转化成聚合物材料（4），从而形成至少一个纤维耦合对准结构（5），该结构包括： - 支撑界面（6），聚合物材料（4）与基底表面直接接触（15）的光纤耦合器（16）; - 光纤支撑区域（7），其适于将至少一个光纤支撑在对准位置以与所述衬底（15）进行光学耦合;以及 - 反射表面（8）在光学f之间传播的光以及c）从剩余的未聚合的可聚合材料（2）清洁所述基底（15）和所述聚合物材料（4），从而暴露所述至少一个纤维结合对准结构（5）光纤耦合器（1）。

6. 发明公开

EP3018510A1 OPTICAL MODULE HAVING OPTICAL BLOCK FOR PASSIVE OPTICAL ALIGNMENT AND METHOD FOR MANUFACTURING SAME 审中-公开
标题翻译：用光学块及其制造无源光学对准和方法光模块
公开(公告)号：EP3018510A1
公开(公告)日：2016-05-11
申请号：EP14819310.5
申请日：2014-07-07
申请人： Ls Mtron Ltd.
发明人： LEE, Seung Hun , KIM, Young Ho , WOO, Kyung Nyung , LEE, Ick Kyun , PARK, Keon Cheol
IPC分类号： G02B6/13
CPC分类号： G02B6/424 , G02B6/00 , G02B6/32 , G02B6/4204 , G02B6/4221 , G02B6/4227 , G02B6/423 , G02B6/4242 , G02B6/4255 , G02B6/4257 , G02B6/4274 , G02B6/43
摘要： The present invention relates to an optical module which is modularized including an optical element and an optical transmission member for mass data high-speed transmission of a board in a device and mass data high-speed transmission between devices, and in which optical alignment is completed between the optical element and the optical transmission member in the module, thereby removing an optical alignment error occurring when mounting it on an external PCB substrate, and provides an optical module includes an optical transmission member (100), an optical element 200, a substrate 210, an electrode pad 220 between the optical element 200 and an external circuit, and optical block 300 including an optical transmission member mounting portion, wherein the optical transmission member mounting portion is formed on the optical block in an optical axis direction such that optical transmission efficiency is the maximum. In addition, a manufacturing method of the optical module includes mounting and electrically connecting the optical element 200 on one face of the substrate 210, calculating a position on a 2-dimensional plane of an optical input/output point of the optical element 200, then forming a base material of the optical block 300 to impregnate the optical element 200 onto the substrate 210, thereafter, forming the optical transmission member mounting portion 310 at the position on the 3-dimensional plane of the optical input/output point calculated in the former step on the base material, and mounting the optical transmission member 100 on the optical transmission member mounting portion 310.
摘要翻译：本发明涉及到光模块的所有被模块化包括用于在设备之间的设备和大容量数据的高速传输的基板的大容量数据的高速传输的光传输部件的光学元件上，并且，并且其中光学对准完成所述光学元件和所述模块中的光传输部件之间，由此在光学对准误差去除时发生上安装它到外部PCB的基板，并提供了光模块包括光学元件200，一基底的光传输部件（100） 210至电极垫220的光学元件200之间，并且连接到外部电路，并且光学块300包括上光学传输部件安装部，worin光传输构件安装部分在光轴方向上搜索该光学块上形成在没有光传输效率为最大。此外，该光学模块的制造方法包括：装配和电在基板210的一个面的光学元件200的连接，在计算的位置上的二维平面的光学输入的光学元件200的/输出点，然后形成光学块300的基体材料浸渍光学元件200到基底210，之后，在形成光传输部件的位置处关于前计算的光输入/输出点的三维平面安装部310 步骤在基材上，并且安装所述光传输部件100中的光传输部件上安装部第三百一十

7. 发明公开

EP3018509A1 OPTICAL MODULE, OPTICAL MODULE MOUNTING METHOD, OPTICAL MODULE-MOUNTED CIRCUIT SUBSTRATE, OPTICAL MODULE EVALUATION KIT SYSTEM, CIRCUIT SUBSTRATE AND COMMUNICATION SYSTEM 审中-公开
标题翻译：用于光模块的光模块的光模块装配工艺安装的电路衬底检测试剂盒SYSTEM FOR光模块，电路基板和通信系统
公开(公告)号：EP3018509A1
公开(公告)日：2016-05-11
申请号：EP13888578.5
申请日：2013-07-05
申请人： Furukawa Electric Co., Ltd.
发明人： NEKADO, Yoshinobu , ISHIKAWA, Yozo , NISHIMURA, Naoya , UEMURA, Toshinori , NASU, Hideyuki
IPC分类号： G02B6/122 , G02B6/42
CPC分类号： G02B6/325 , G02B6/30 , G02B6/32 , G02B6/4204 , G02B6/421 , G02B6/423 , G02B6/4231 , G02B6/4232 , G02B6/4239 , G02B6/4244 , G02B6/4249 , G02B6/4257 , G02B6/428 , G02B6/4292 , G02B6/4293 , H05K1/0269 , H05K1/0274 , H05K1/141 , H05K1/181 , H05K3/368 , H05K2201/09918 , H05K2201/10106 , H05K2203/0195 , Y02P70/611
摘要： An optical module (100) includes a housing (10) including an internal space (14) that has an opening in a substrate mounting surface (12a), an element mounting surface (11a) that forms a portion of an inner surface of the internal space, and a waveguide introduction opening (15) that is formed in a side surface intersecting the substrate mounting surface and is opened to the opening of the substrate mounting surface and communicated with the internal space, an optical element (20) that is mounted on the element mounting surface, and an electronic element (30) that is mounted on the element mounting surface and is connected to the optical element. When the substrate mounting surface is mounted on a circuit substrate (200), an optical waveguide (210) that protrudes from a surface of the circuit substrate is introduced into the internal space through the waveguide introduction opening.
摘要翻译：一种光学模块（100）包括壳体（10）包括在内部空间（14），其具有到元件搭载面（11A）的开口中的基板安装面（12A）做形式内部的内表面的一部分空间，并且波导导入口（15）并在一个侧表面相交的基板安装面形成，并且被打开以在基板安装面的开口并连通，其中光学元件（20）确实安装在内部空间元件安装表面上，并且电子元件（30）也被安装在元件安装表面上，并连接到所述光学元件。当安装表面基板被安装在光波导（210）的电路基板（200）的确从电路基板的表面突出被引入到经由所述波导引入开口的内部空间。

8. 发明公开

EP2952944A1 PACKAGE FOR HOUSING OPTICAL SEMICONDUCTOR ELEMENT AND OPTICAL SEMICONDUCTOR DEVICE 有权
标题翻译：包装用于记录光学半导体部件和光学半导体部件
公开(公告)号：EP2952944A1
公开(公告)日：2015-12-09
申请号：EP14746069.5
申请日：2014-01-28
申请人： Kyocera Corporation
发明人： SATAKE, Takeo , TANAKA, Daisuke , SAKUMOTO, Daisuke
IPC分类号： G02B6/42 , H01L23/02 , H01S5/022
CPC分类号： G02B6/4248 , G02B6/4251 , G02B6/4256 , G02B6/4257 , G02B6/426 , G02B6/4265 , H01S5/02216 , H01S5/02284
摘要： An optical semiconductor element housing package includes a base body (1) having an optical semiconductor element mounting portion (1a) on an upper main surface thereof; a frame body (2) joined to the base body (1) so as to surround the mounting portion (1a); and an optical fiber securing member (3) fitted in a through hole (2c) which penetrates through from an inside to an outside of the frame body (2). The frame body (2) is formed by bending a single strip-like plate member at its several positions, and then bonding one end (2a) side and an other end (2b) side thereof, the through hole (2c) being provided so as to be located at a juncture of the one end (2a) side and the other end (2b) side. By bonding with the interposition of the optical fiber securing member (3) fitted in the through hole (2c), an easy optical semiconductor element housing package characterized by easy assembling and a uniform joining force is obtained.
摘要翻译：的光学半导体元件收纳用封装包括具有到光半导体元件搭载到其上主表面部分（1a）中的基体（1）; 的框体（2）连接到所述基体（1），以包围所述安装部分（1A）; 和光纤固定构件（3）装配在通孔部（2c），其从内到外穿过到在框体（2）。框体（2）通过在其数个位置弯曲单个带状板构件，然后接合一个端部（2a）的侧面和（2b）侧，所述通孔部（2c）被设置成一个另一端上形成以位于在该一个端部（2a）的侧面的接合处，而另一端（2b）的一侧。通过与光纤固定构件的插入键合（3）装配在通孔（2c）中，一个简单的光学半导体元件收纳用封装通过组装容易和均匀的接合力获得特征的。

9. 发明公开

EP2940739A1 SILICA-ON-SILICON-BASED HYBRID INTEGRATED OPTOELECTRONIC CHIP AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：混合器，INTEGRIERTER OPTOELEKTRONISCHER SILICA-AUF-SILICIUM-CHIP UND HERSTELLUNGSVERFAHRENDAFÜR
公开(公告)号：EP2940739A1
公开(公告)日：2015-11-04
申请号：EP13867481.7
申请日：2013-12-26
申请人： Wuhan Telecommunication Devices Co., Ltd.
发明人： ZHOU, Liang , CAO, Xiaoge , YU, Xianghong
IPC分类号： H01L31/12 , H01L31/18
CPC分类号： G02B6/4257 , G02B6/122 , G02B6/305 , G02B6/42 , G02B6/4224 , G02B6/4232 , H01L31/02327 , H01L31/12 , H01L31/18
摘要： Provided are a silica-on-silicon-based hybrid integrated optoelectronic chip and a manufacturing method therefor. The hybrid integrated optoelectronic chip comprises a silicon substrate (1), wherein the surface of the silicon substrate (1) is provided with a platform (8), lug bosses (6,7) and a groove (10); a silica waveguide element (2) is arranged in the groove (10), the lug bosses (6,7) are protruded from the surface of the platform (8), and the surface of the platform (8) is provided with a discontinuous metal electrode layer (3); and the surface of the metal electrode layer (3) is provided with solder bumps (4), and an active optoelectronic chip (5) is arranged above the solder bumps (4) and the lug bosses (6, 7). In the manufacturing method, multi-step processes including material growth, hot oxygen bonding, flip-chip bonding, lithography alignment and the like are adopted, thereby guaranteeing the high-efficiency light coupling among waveguide devices of different materials, and reducing the light reflection between waveguide end faces. A high-frequency electrode composed of alternating current electrode areas (26) is manufactured between the alignment lug bosses (6, 7). Due to the fact that flip-chip bonding technology is beneficial to the transmission of high-frequency signals, integration level between devices is improved. Meanwhile, the process design not only can achieve the chip-level probe test, but also can be used for the subsequent gold ball bonding or wedge bonding process, thereby facilitating the achievement of encapsulation and mass production of hybrid integrated chips.
摘要翻译：提供了一种硅基硅基复合集成光电芯片及其制造方法。混合集成光电芯片包括硅衬底（1），其中硅衬底（1）的表面设置有平台（8），凸耳凸起（6,7）和凹槽（10）; 在所述凹槽（10）中布置有二氧化硅波导元件（2），所述凸耳凸起（6,7）从所述平台（8）的表面突出，并且所述平台（8）的表面设置有不连续的金属电极层（3）; 并且金属电极层（3）的表面设置有焊锡凸块（4），并且在焊料凸块（4）和凸耳凸起（6,7）上方布置有源光电芯片（5）。在制造方法中，采用包括材料生长，热氧键合，倒装芯片接合，平版印刷对准等多步法，从而保证不同材料的波导器件之间的高效率的光耦合，并减少光反射在波导端面之间。在对准凸耳（6,7）之间制造由交流电极区域（26）构成的高频电极。由于倒装芯片接合技术有利于高频信号的传输，提高了器件之间的集成度。同时，该工艺设计不仅可以实现芯片级探头测试，而且可以用于随后的金球接合或楔形粘合工艺，从而有助于实现混合集成芯片的封装和批量生产。

10. 发明公开

EP2937897A2 DEVICE PACKAGE AND METHODS FOR THE FABRICATION AND TESTING THEREOF 审中-公开
标题翻译： VORFAHUNG SPAKET UND VERFAHREN ZUR HERSTELLUNG UNDPRÜFUNGDAVON
公开(公告)号：EP2937897A2
公开(公告)日：2015-10-28
申请号：EP15171706.3
申请日：2004-09-13
申请人： Nuvotronics LLC
发明人： Sherrer, David W , Rasnake, Larry J , Fisher, John J
IPC分类号： H01L21/768 , H01L23/522 , G02B6/42
CPC分类号： G02B6/4248 , G01B11/16 , G01B11/26 , G02B6/3692 , G02B6/4201 , G02B6/4204 , G02B6/4206 , G02B6/421 , G02B6/4214 , G02B6/423 , G02B6/4239 , G02B6/4243 , G02B6/4244 , G02B6/4257 , G02B6/4271 , G02B6/4292 , H01L23/481 , H01L2924/0002 , H01S5/0014 , H01S5/022 , H01S5/02208 , H01S5/02216 , H01S5/0222 , H01S5/02252 , H01S5/02272 , H01S5/02284 , H01S5/02288 , H01S5/02415 , H01S5/02469 , H01S5/0683 , H01L2924/00012 , H01L2924/00
摘要： Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer, the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer, wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures, methods of detecting leakage in a sealed device package, sealed device packages, device packages containing cooling structures, and methods of bonding a first component to a second component.
摘要翻译：提供形成密封通孔结构的方法。一种方法包括：（a）提供具有第一表面和与第一表面相对的第二表面的半导体衬底; （b）在所述基板的第一表面上形成层; （c）从所述第二表面到所述层蚀刻穿过所述基板的通孔，所述通孔在所述第一表面具有第一周边; （d）在所述层中形成孔，其中所述孔在所述第一周边内具有第二周边; 和（e）提供用于密封通孔结构的导电结构。还提供了密封通孔结构，检测密封装置封装中的泄漏的方法，密封装置封装，包含冷却结构的装置封装以及将第一部件结合到第二部件的方法。

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