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    • 1. 发明公开
    • THERMOSETTING RESIN COMPOSITION
    • 热固性树脂组合物
    • EP3192834A1
    • 2017-07-19
    • EP15839512.9
    • 2015-09-09
    • Teijin Limited
    • SHOJI, ShinichiroENDO, KouheiSHIBANO, Masaya
    • C08L63/00C08K5/29
    • C08G59/4042C07D491/113C08G59/5033C08G59/686C08K5/18C08K5/29C08L63/00
    • A thermosetting resin composition which produces no free isocyanate even when a carbodiimide compound is used and provides a cured resin having high heat resistance.
      The thermosetting resin composition makes it possible to reduce the curing temperature, cures in a short time and provides a cured rein having a high glass transition temperature.
      The thermosetting resin composition comprises:
      (A) an epoxy resin (component A); and
      (B) a cyclic carbodiimide compound (component B) including a cyclic structure having one carbodiimide group and represented by the following formula (B-i) in which first nitrogen and second nitrogen are bonded together by a bond group and having 8 to 50 atoms forming the cyclic structure:

      (wherein Q is bivalent to tetravalent bond group which is an aliphatic group, alicyclic group, aromatic group, or a combination of these groups and may contain a hetero atom or substituent); and/or
      (b) a polyvalent amine-based curing agent (component b) represented by the following formula (b-i):
      (wherein Ar 1 to Ar 4 are each independently a phenylene group or naphthalene-diyl group which may be substituted by a substituent).
    • 即使在使用碳化二亚胺化合物时也不产生游离异氰酸酯并提供具有高耐热性的固化树脂的热固性树脂组合物。 热固性树脂组合物使得能够降低固化温度,在短时间内固化并且提供具有高玻璃化转变温度的固化树脂。 该热固性树脂组合物包含:(A)环氧树脂(组分A); 和(B)包含具有1个碳二亚胺基的环状结构且由下述式(Bi)表示的环状碳二亚胺化合物(B成分),其中,第一氮与第二氮通过键合基团键合而成的原子数为8〜50的原子 (其中Q是脂族基团,脂环族基团,芳族基团或这些基团的组合并且可以含有杂原子或取代基的二价至四价键基团)。 (b)由下式(bi)表示的多元胺类固化剂(b成分):(式中,Ar 1〜Ar 4分别独立地表示可以被取代基取代的亚苯基或萘二基) 。
    • 2. 发明公开
    • EPOXY COMPOUND, PRODUCTION METHOD THEREFOR, AND CURABLE EPOXY RESIN COMPOSITION
    • EPOXIDVERBINDUNG,HERSTELLUNGSVERFAHRENDAFÜRUNDHÄRTBAREEPOXIDHARZZUSAMMENSETZUNG
    • EP2921513A1
    • 2015-09-23
    • EP13852931.8
    • 2013-10-30
    • Daicel Corporation
    • INOUE, Hiroko
    • C08G59/20C07D491/044C08G59/02
    • C08G59/26C07D209/48C07D491/044C08G59/24C08G59/4042
    • An object of the present invention is to provide a novel epoxy compound capable of forming a highly heat-resistant cured product. The epoxy compound of the present invention is a compound represented by the following formula (1):

      wherein X 1 and X 2 are the same or different and represent an alkylene group, an oxygen atom, a sulfur atom, or no bond; R represents a bivalent group having one or more atoms; R 1 to R 8 are the same or different and represent a hydrogen atom, an alkenyl group which may have a substituent, an epoxidized alkenyl group which may have a substituent, or an alkyl group which may have a substituent; and Y 1 and Y 2 are the same or different and are a bivalent group represented by the following formula (a) :

      or a bivalent group represented by the following formula (b) :

      provided that least one of R 1 to R 12 in formula (1) is an alkenyl group which may have a substituent, an epoxidized alkenyl group which may have a substituent, or an alkyl group which may have a substituent. Besides, when both Y 1 and Y 2 in formula (1) are a bivalent group represented by formula (a), at least one of R 1 to R 10 is an epoxidized alkenyl group which may have a substituent.
    • 本发明的目的是提供一种能够形成高耐热固化产物的新型环氧化合物。 本发明的环氧化合物是由下式(1)表示的化合物:其中X 1和X 2相同或不同,表示亚烷基,氧原子,硫原子或无键; R表示具有一个或多个原子的二价基团; R 1〜R 8相同或不同,表示氢原子,可具有取代基的烯基,可具有取代基的环氧化烯基或可具有取代基的烷基; Y 1和Y 2相同或不同,为由下式(a)表示的二价基团或由下式(b)表示的二价基团:式 (1)可以具有取代基的烯基,可以具有取代基的环氧化烯基或可以具有取代基的烷基。 此外,当式(1)中的Y 1和Y 2都是由式(a)表示的二价基团时,R 1至R 10中的至少一个是可以具有取代基的环氧化烯基。
    • 6. 发明公开
    • INKJET HEAD AND METHOD FOR PRODUCING INKJET HEAD
    • TINTENSTRAHLKOPF UND HERSTELLUNGSVERFAHRENFÜREINEN TINTENSTRAHLKOPF
    • EP2639072A1
    • 2013-09-18
    • EP11840264.3
    • 2011-10-25
    • Konica Minolta, Inc.
    • YAMADA AkihisaHIRANO Tadashi
    • B41J2/16B41J2/045B41J2/055C09J11/00C09J163/00
    • B41J2/162B41J2/14024B41J2/14209B41J2/1433B41J2/1603B41J2/1609B41J2/1623C08G59/4042C08G59/72C09J163/00
    • The objective is to provide an inkjet head and a production method thereof, wherein, even if a joint surface of a head main body is irregular upon adhesion of a nozzle plate, defect injection due to flowing of an adhesive agent to a nozzle or a void in an adhesive agent layer can be easily prevented, and the injection does not curve. A method for producing an inkjet head wherein a film is formed on a head chip comprising a flow path member in which an ink channel is formed, and an end surface of the head chip covered by the film is jointed to a nozzle plate, characterized in that the method comprises a step for coating an adhesive agent which contains 0.1% by volume to 10.0% by volume inclusive of spherical particles each having a volume average particle diameter of 0.95 x Rz (MV) to 2.0 x Rz (MV) inclusive, on at least one of the end surface of the head chip and the joint surface of the nozzle plate, and thereafter, jointing the nozzle plate.
    • 目的在于提供一种喷墨头及其制造方法,即使在喷头板粘接时头主体的接合表面不规则,由于粘合剂流到喷嘴或空隙中而导致的缺陷注入 可以容易地防止在粘合剂层中,并且注入不弯曲。 一种喷墨头的制造方法,其中,在包括形成油墨通道的流路构件的头芯片上形成有膜,并且由所述膜覆盖的所述头芯片的端面与喷嘴板接合,其特征在于, 该方法包括涂覆粘合剂的步骤,其包含0.1体积%至10.0体积%,包括体积平均粒径为0.95×Rz(MV)至2.0×Rz(MV)的球形颗粒 头芯片的端面和喷嘴板的接合表面中的至少一个,然后连接喷嘴板。