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1. 发明公开

EP3192834A1 THERMOSETTING RESIN COMPOSITION 有权
标题翻译：热固性树脂组合物
公开(公告)号：EP3192834A1
公开(公告)日：2017-07-19
申请号：EP15839512.9
申请日：2015-09-09
申请人： Teijin Limited
发明人： SHOJI, Shinichiro , ENDO, Kouhei , SHIBANO, Masaya
IPC分类号： C08L63/00 , C08K5/29
CPC分类号： C08G59/4042 , C07D491/113 , C08G59/5033 , C08G59/686 , C08K5/18 , C08K5/29 , C08L63/00
摘要： A thermosetting resin composition which produces no free isocyanate even when a carbodiimide compound is used and provides a cured resin having high heat resistance.
The thermosetting resin composition makes it possible to reduce the curing temperature, cures in a short time and provides a cured rein having a high glass transition temperature.
The thermosetting resin composition comprises:
(A) an epoxy resin (component A); and
(B) a cyclic carbodiimide compound (component B) including a cyclic structure having one carbodiimide group and represented by the following formula (B-i) in which first nitrogen and second nitrogen are bonded together by a bond group and having 8 to 50 atoms forming the cyclic structure:

(wherein Q is bivalent to tetravalent bond group which is an aliphatic group, alicyclic group, aromatic group, or a combination of these groups and may contain a hetero atom or substituent); and/or
(b) a polyvalent amine-based curing agent (component b) represented by the following formula (b-i):
(wherein Ar 1 to Ar 4 are each independently a phenylene group or naphthalene-diyl group which may be substituted by a substituent).
摘要翻译：即使在使用碳化二亚胺化合物时也不产生游离异氰酸酯并提供具有高耐热性的固化树脂的热固性树脂组合物。热固性树脂组合物使得能够降低固化温度，在短时间内固化并且提供具有高玻璃化转变温度的固化树脂。该热固性树脂组合物包含：（A）环氧树脂（组分A）; 和（B）包含具有1个碳二亚胺基的环状结构且由下述式（Bi）表示的环状碳二亚胺化合物（B成分），其中，第一氮与第二氮通过键合基团键合而成的原子数为8〜50的原子（其中Q是脂族基团，脂环族基团，芳族基团或这些基团的组合并且可以含有杂原子或取代基的二价至四价键基团）。（b）由下式（bi）表示的多元胺类固化剂（b成分）：（式中，Ar 1〜Ar 4分别独立地表示可以被取代基取代的亚苯基或萘二基）。

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