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1. 发明公开

EP2397862A2 Simultaneous testing of semiconductor components on a wafer 审中-公开
标题翻译： SimultanesPrüfenvon Halbleiterkomponenten auf einem Wafer
公开(公告)号：EP2397862A2
公开(公告)日：2011-12-21
申请号：EP11004345.2
申请日：2011-05-26
申请人： Broadcom Corporation
发明人： Behzad, Arya Reza , Zhao, Sam Ziqun , Boers, Michael , Rofougaran, Ahmadreza , Castaneda, Jesus Alfonso
IPC分类号： G01R31/28
CPC分类号： G01R31/2834 , G01R31/3025 , G01R31/311
摘要： Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation.
摘要翻译：公开了同时无线地测试形成在半导体晶片上的半导体元件的方法和装置。半导体部件通过公共通信信道将各自的测试结果传送到无线自动测试设备。多个接收天线在三维空间中观察多个方向的结果。无线自动测试设备确定一个或多个半导体组件是否按预期运行，并且可选地，可以使用三维空间的属性来确定一个或多个半导体组件的位置。无线测试设备可以通过检测在独立测试操作之前，期间和/或之后由半导体晶片发射，传输和/或反射的红外能量来另外确定半导体组件的性能。

2. 发明公开

EP2575171A1 Wirelessly communicating among vertically arranged integrated circuits (ICs) in a semiconductor package 审中-公开
标题翻译：在半导体封装中垂直排列的集成电路（IC）之间进行无线通信
公开(公告)号：EP2575171A1
公开(公告)日：2013-04-03
申请号：EP12005567.8
申请日：2012-07-31
申请人： Broadcom Corporation
发明人： Castaneda, Jesus , Rofougaran, Ahmadreza , Boers, Michael , Behzad, Arya , Zhao, Sam
IPC分类号： H01L25/065 , H01L25/10 , G02B6/10
CPC分类号： H01L25/0657 , G02B6/12002 , G02B6/43 , H01L23/5222 , H01L23/66 , H01L25/0652 , H01L25/0655 , H01L25/105 , H01L2223/6627 , H01L2223/6677 , H01L2224/16225 , H01L2225/06517 , H01L2225/06531 , H01L2225/06572 , H01L2225/1005 , H01L2924/1461 , H01P3/00 , H01P3/12 , H01P3/121 , H04L7/0091 , H01L2924/00
摘要： Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.
摘要翻译：公开了用于集成电路内的集成电路和/或功能模块之间的无线通信的方法和设备。半导体器件制造操作使用预定顺序的照相和/或化学处理步骤在半导体衬底上形成一个或多个功能模块。功能模块耦合到形成在半导体衬底上和/或附接到半导体衬底上以形成集成电路的集成波导。功能模块彼此以及通过集成波导使用多路访问传输方案的其他集成电路进行通信。一个或多个集成电路可以耦合到集成电路载体以形成多芯片模块。多芯片模块可以被耦合到半导体封装以形成封装的集成电路。

3. 发明公开

EP2575272A3 Signal distribution and radiation in a wireless enabled integrated circuit (IC) 审中-公开
标题翻译：在集成电路（IC）具有无线功能的信号分配和辐射
公开(公告)号：EP2575272A3
公开(公告)日：2014-06-11
申请号：EP12005673.4
申请日：2012-08-03
申请人： Broadcom Corporation
发明人： Boers, Michael , Behzad, Arya , Rofougaran, Ahmadreza , Zhao, Sam , Castaneda, Jesus
IPC分类号： H04B7/26 , H01L23/66 , H01L23/48 , H01L23/552 , H01L25/065 , H01P3/12 , H01L23/522
CPC分类号： H01P3/12 , H01L23/5222 , H01L23/66 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L2223/6627 , H01L2224/16225 , H01L2225/06517 , H01L2225/06531 , H01L2225/06572 , H01L2924/1461 , H01L2924/00
摘要： Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.

4. 发明公开

EP2575170A3 Semiconductor package including an integrated waveguide 有权转让
标题翻译：的半导体封装件具有集成波导
公开(公告)号：EP2575170A3
公开(公告)日：2013-10-16
申请号：EP12005674.2
申请日：2012-08-03
申请人： Broadcom Corporation
发明人： Boers, Michael , Behzad, Arya , Rofougaran, Ahmadreza , Zhao, Sam , Castaneda, Jesus
IPC分类号： H01L23/66 , H01L23/522 , H01L25/065 , H01P3/08 , H01P3/12 , H01P5/18 , H01Q23/00 , H01L23/48
CPC分类号： H01L23/49811 , H01L23/5222 , H01L23/66 , H01L24/16 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L2223/6627 , H01L2223/6677 , H01L2223/6683 , H01L2224/0401 , H01L2224/0557 , H01L2224/05647 , H01L2224/131 , H01L2224/14181 , H01L2224/16225 , H01L2224/17181 , H01L2224/81815 , H01L2225/06531 , H01L2225/06572 , H01L2924/00014 , H01L2924/1461 , H01L2924/15311 , H01P1/182 , H01P3/023 , H01P3/12 , H01P3/121 , H01L2924/014 , H01L2924/00 , H01L2224/05552
摘要： Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.

5. 发明公开

EP2575272A2 Signal distribution and radiation in a wireless enabled integrated circuit (IC) 审中-公开
标题翻译：信号处理器和信号处理器
公开(公告)号：EP2575272A2
公开(公告)日：2013-04-03
申请号：EP12005673.4
申请日：2012-08-03
申请人： Broadcom Corporation
发明人： Boers, Michael , Behzad, Arya , Rofougaran, Ahmadreza , Zhao, Sam , Castaneda, Jesus
IPC分类号： H04B7/26 , H01L23/66 , H01L23/48
CPC分类号： H01P3/12 , H01L23/5222 , H01L23/66 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L2223/6627 , H01L2224/16225 , H01L2225/06517 , H01L2225/06531 , H01L2225/06572 , H01L2924/1461 , H01L2924/00
摘要： Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.
摘要翻译：公开了用于在集成电路内的集成电路和/或功能模块之间进行无线通信的方法和装置。半导体器件制造操作使用预定的照相和/或化学处理步骤顺序在半导体衬底上形成一个或多个功能模块。功能模块耦合到形成在半导体衬底上和/或连接到其上以形成集成电路的集成波导。功能模块通过集成波导使用多址传输方案彼此通信并且与其他集成电路通信。一个或多个集成电路可以耦合到集成电路载体以形成多芯片模块。多芯片模块可以耦合到半导体封装以形成封装的集成电路。

6. 发明公开

EP2634803A1 Wirelessly communicating among vertically arranged integrated circuits (ICs) in a semiconductor package 审中-公开
标题翻译：无线通信中的半导体封装垂直布置的集成电路（IC）
公开(公告)号：EP2634803A1
公开(公告)日：2013-09-04
申请号：EP13001728.8
申请日：2012-07-31
申请人： Broadcom Corporation
发明人： Castaneda, Jesus , Behzad, Arya , Rofougaran, Ahmadreza , Zhao, Sam , Boers, Michael
IPC分类号： H01L25/065 , H01L25/10 , G02B6/10 , H01L23/66 , G02B6/43 , G02B6/12
CPC分类号： H01L25/0657 , G02B6/12002 , G02B6/43 , H01L23/5222 , H01L23/66 , H01L25/0652 , H01L25/0655 , H01L25/105 , H01L2223/6627 , H01L2223/6677 , H01L2224/16225 , H01L2225/06517 , H01L2225/06531 , H01L2225/06572 , H01L2225/1005 , H01L2924/1461 , H01P3/00 , H01P3/12 , H01P3/121 , H04L7/0091 , H01L2924/00
摘要： Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.
摘要翻译：的方法和装置是游离缺失盘用于集成电路内的集成电路和/或功能模块之间进行无线通信。一种半导体器件制造手术使用的照相和/或化学处理步骤的预定序列，以形成到半导体衬底的一个或多个功能模块。所述功能模块在集成波导耦合到也形成到半导体衬底和/或附接到其上，以形成集成电路的。各功能模块彼此以及到其它集成电路通过集成波导使用多址传输方案进行通信。一个或多个集成电路可以在集成电路载体被耦合到以形成多芯片模块。该多芯片模块可被耦合到半导体封装，以形成封装的集成电路。

7. 发明公开

EP2439776A3 Antenna on an integrated circuit 审中-公开
标题翻译：在集成电路上毫米设备
公开(公告)号：EP2439776A3
公开(公告)日：2013-08-28
申请号：EP11008116.3
申请日：2011-10-06
申请人： Broadcom Corporation
发明人： Zhao, Sam Ziqun , Behzad, Arya , Boers, Michael , Rofougaran, Ahmadreza , Castaneda, Jesus
IPC分类号： H01L23/66 , H01L23/48 , H01L23/367 , H01Q1/38 , H01Q1/22
CPC分类号： H01L23/66 , H01L23/48 , H01L23/481 , H01L23/5227 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L2223/6627 , H01L2223/6677 , H01L2224/0401 , H01L2224/0557 , H01L2224/06181 , H01L2224/16225 , H01L2224/16227 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H01L2924/01087 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/1903 , H01L2924/19041 , H01L2924/19042 , H01L2924/19051 , H01L2924/19104 , H01Q1/38 , H01Q9/285 , H01Q23/00 , H01L2924/0665 , H01L2924/00 , H01L2924/00012 , H01L2224/05552
摘要： An integrated circuit (IC) device arrangement includes a substrate (202), an IC die (204) coupled to the substrate, an antenna (206) coupled to the IC die, and a first wirelessly enabled functional block (210) coupled to the IC die. The wirelessly enabled functional block is configured to wirelessly communicate with a second wirelessly enabled functional block (212) coupled to the substrate. The antenna is configured to communicate with another antenna coupled to another device.

8. 发明公开

EP2575416A1 A device having wirelessly enabled functional blocks 有权转让
标题翻译： Vorrichtung mit drahtlos aktiviertenFunktionsblöcken
公开(公告)号：EP2575416A1
公开(公告)日：2013-04-03
申请号：EP12005675.9
申请日：2012-08-03
申请人： Broadcom Corporation
发明人： Zhao, Sam , Rofougaran, Ahmadreza , Castaneda, Jesus , Boers, Michael , Behzad, Arya
IPC分类号： H05K1/16
CPC分类号： H05K1/00 , H01L23/48 , H01L23/49805 , H01L23/552 , H01L23/66 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L2223/6677 , H01L2224/0401 , H01L2224/05568 , H01L2224/131 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2924/14 , H01L2924/15311 , H01L2924/3025 , H01L2924/014 , H01L2924/00
摘要： Embodiments described herein provide enhanced integrated circuit (IC) devices. In an embodiment, an IC device includes a substrate, an IC die coupled to a surface of the substrate, a first wirelessly enabled functional block located on the IC die, the first wirelessly enabled functional block being configured to wirelessly communicate with a second wirelessly enabled functional block located on the substrate, and a ground ring configured to provide electromagnetic shielding for the first and second wirelessly enabled functional blocks.
摘要翻译：本文所述的实施例提供增强型集成电路（IC）装置。在一个实施例中，IC器件包括衬底，耦合到衬底的表面的IC管芯，位于IC管芯上的第一无线功能功能块，第一无线功能功能块被配置为与第二无线使能位于所述基板上的功能块，以及被配置为为所述第一和第二无线功能块提供电磁屏蔽的接地环。

9. 发明公开

EP2397862A3 Simultaneous testing of semiconductor components on a wafer 审中-公开
标题翻译：一个晶片上的半导体元件的同时测试
公开(公告)号：EP2397862A3
公开(公告)日：2012-08-08
申请号：EP11004345.2
申请日：2011-05-26
申请人： Broadcom Corporation
发明人： Behzad, Arya Reza , Zhao, Sam Ziqun , Boers, Michael , Rofougaran, Ahmadreza , Castaneda, Jesus Alfonso
IPC分类号： G01R31/319 , G01R31/28 , G01R31/302 , G01R31/303 , G01R31/317
CPC分类号： G01R31/2834 , G01R31/3025 , G01R31/311
摘要： Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation.

10. 发明公开

EP2400545A2 Package for a wireless enabled integrated circuit 审中-公开
标题翻译： Baugruppefüreine integrierte Schaltung mit Drahtlosfunktion
公开(公告)号：EP2400545A2
公开(公告)日：2011-12-28
申请号：EP11005016.8
申请日：2011-06-20
申请人： Broadcom Corporation
发明人： Zhao, Sam Ziquin , Rofougaran, Ahmadreza , Behzad, Arya , Castaneda, Jesus , Boers, Michael
IPC分类号： H01L23/48 , H01L23/522
CPC分类号： H01L23/48 , H01L23/522 , H01L23/66 , H01L24/73 , H01L2223/6677 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2924/14 , H01L2924/15311 , H01L2924/16251 , H01L2924/3025 , H01L2924/00012 , H01L2924/00
摘要： An integrated circuit (IC) device is provided. The IC device includes a substrate, an IC die coupled to the substrate, and a first wirelessly enabled functional block formed on the IC die. The first wirelessly enabled functional block is configured to wirelessly communicate with a second wirelessly enabled functional block formed on the substrate.
摘要翻译：提供集成电路（IC）装置。 IC器件包括衬底，耦合到衬底的IC管芯和形成在IC管芯上的第一无线功能块。第一无线功能块被配置为与形成在衬底上的第二无线功能功能块无线通信。

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