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1. 发明授权

US06665930B2 Printed circuit board with SMD components 失效
标题翻译：带SMD元件的印刷电路板
公开(公告)号：US06665930B2
公开(公告)日：2003-12-23
申请号：US09261844
申请日：1999-03-03
申请人： Peter Matuschik
发明人： Peter Matuschik
IPC分类号： H05K346
CPC分类号： H01R12/57 , H05K3/3405 , H05K3/403 , H05K2201/0376 , H05K2201/09181 , H05K2201/1034 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153
摘要： A printed circuit board with SMD components electrically connected to the printed circuit board by means of a reflow soldering process. In order to provide the printed circuit board with connection elements which can be mounted at minimal cost, the printed circuit board is provided with one or more connection elements for making an electric connection to other electric components. These connection elements are journaled in recesses of the printed circuit board and do not project to the exterior via the surface of the printed circuit board on which the SMD components are secured.
摘要翻译：具有通过回流焊接工艺将印刷电路板与印刷电路板电连接的印刷电路板。为了向印刷电路板提供可以以最低成本安装的连接元件，印刷电路板设置有用于与其他电气部件电连接的一个或多个连接元件。这些连接元件被记录在印刷电路板的凹槽中，并且不经由其上固定SMD部件的印刷电路板的表面突出到外部。

2. 发明授权

US06756663B2 Semiconductor device including wiring board with three dimensional wiring pattern 有权
标题翻译：半导体器件包括具有三维布线图案的布线板
公开(公告)号：US06756663B2
公开(公告)日：2004-06-29
申请号：US10337879
申请日：2003-01-08
申请人： Tsukasa Shiraishi , Tsutomu Mitani , Kazuyoshi Amami , Yoshihiro Bessho
发明人： Tsukasa Shiraishi , Tsutomu Mitani , Kazuyoshi Amami , Yoshihiro Bessho
IPC分类号： H05K346
CPC分类号： H01L21/563 , H01L23/5385 , H01L24/45 , H01L24/48 , H01L25/0652 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/15174 , H01L2924/15192 , H01L2924/19041 , H01L2924/19106 , H01L2924/19107 , H05K1/0284 , H05K1/141 , H05K1/147 , H05K1/189 , H05K3/328 , H05K3/3421 , H05K3/3442 , H05K3/363 , H05K3/368 , H05K2201/056 , H05K2201/10386 , H05K2201/10674 , H05K2203/049 , H05K2203/1572 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor device is made by mounting semiconductor elements on both sides of a wiring board having three-dimensional wiring including inner-via holes. A high operating speed and smaller size are made possible by employing a laminated structure of semiconductor elements without using the chip-on-chip configuration. Semiconductor elements are mounted on both sides of a wiring board having three-dimensional wiring including inner via holes so that the semiconductor elements oppose each other via the wiring board. The electrodes of the semiconductor elements are connected with each other by the three-dimensional wiring of the wiring board.
摘要翻译：半导体器件通过将半导体元件安装在具有包括内通孔的三维布线的布线板的两侧上而制成。通过采用半导体元件的叠层结构而不使用片上芯片配置，可以实现高工作速度和较小尺寸。半导体元件安装在具有包括内部通孔的三维布线的布线板的两侧，使得半导体元件经由布线板彼此相对。半导体元件的电极通过布线板的三维布线彼此连接。

3. 发明授权

US06525414B2 Semiconductor device including a wiring board and semiconductor elements mounted thereon 有权
标题翻译：包括安装在其上的布线板和半导体元件的半导体器件
公开(公告)号：US06525414B2
公开(公告)日：2003-02-25
申请号：US09725283
申请日：2000-11-29
申请人： Tsukasa Shiraishi , Tsutomu Mitani , Kazuyoshi Amami , Yoshihiro Bessho
发明人： Tsukasa Shiraishi , Tsutomu Mitani , Kazuyoshi Amami , Yoshihiro Bessho
IPC分类号： H05K346
CPC分类号： H01L21/563 , H01L23/5385 , H01L24/45 , H01L24/48 , H01L25/0652 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/15174 , H01L2924/15192 , H01L2924/19041 , H01L2924/19106 , H01L2924/19107 , H05K1/0284 , H05K1/141 , H05K1/147 , H05K1/189 , H05K3/328 , H05K3/3421 , H05K3/3442 , H05K3/363 , H05K3/368 , H05K2201/056 , H05K2201/10386 , H05K2201/10674 , H05K2203/049 , H05K2203/1572 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor device is made by mounting semiconductor elements on both sides of a wiring board having three-dimensional wiring including inner-via holes. A high operating speed and smaller size are made possible by employing a laminated structure of semiconductor elements without using the chip-on-chip configuration. Semiconductor elements are mounted on both sides of a wiring board having three-dimensional wiring including inner via holes so that the semiconductor elements oppose each other via the wiring board. The electrodes of the semiconductor elements are connected with each other by the three-dimensional wiring of the wiring board.
摘要翻译：半导体器件通过将半导体元件安装在具有包括内通孔的三维布线的布线板的两侧上而制成。通过采用半导体元件的叠层结构而不使用片上芯片配置，可以实现高工作速度和较小尺寸。半导体元件安装在具有包括内部通孔的三维布线的布线板的两侧，使得半导体元件经由布线板彼此相对。半导体元件的电极通过布线板的三维布线彼此连接。

4. 发明授权

US06488795B1 Multilayered ceramic substrate and method of producing the same 有权
标题翻译：多层陶瓷基板及其制造方法
公开(公告)号：US06488795B1
公开(公告)日：2002-12-03
申请号：US09654724
申请日：2000-09-05
申请人： Norio Sakai
发明人： Norio Sakai
IPC分类号： H05K346
CPC分类号： H05K3/4629 , H01L21/4857 , H05K1/0306 , H05K3/4611 , Y10S428/901 , Y10T29/49163 , Y10T428/24926
摘要： A method of producing a multilayered ceramic substrate in which wiring conductors can be provided on both main surfaces and the density of the wiring conductors can be increased by a non-shrinkage process. In the producing method, a green composite laminated product in which metallic foils are arranged to cover both main surfaces of a green laminated structure comprising a plurality of ceramic green sheets on which conductive paste is coated for forming internal wiring conductors is burned. In this burning step, shrinkage of the ceramic green sheets is suppressed by the metallic foils in the direction of the main surfaces thereof. After burning, the metallic foils are patterned by etching based on photolithographic technology to form external conductor films.
摘要翻译：制造可以在两个主表面上设置布线导体并且可以通过非收缩工艺来增加布线导体的密度的多层陶瓷基板的制造方法。在该制造方法中，生成金属箔被布置成覆盖包括多个陶瓷生片的生坯层叠结构的两个主表面的绿色复合层压制品，其上涂覆有导电浆料以形成内部布线导体的绿色复合层压制品被烧毁。在该烧成工序中，金属箔沿其主表面方向抑制陶瓷生片的收缩。燃烧后，通过基于光刻技术的蚀刻将金属箔图案化，以形成外部导体膜。

5. 发明授权

US06350387B2 Multilayer combined rigid/flex printed circuit board containing flexible soldermask 失效
标题翻译：多层组合刚性/柔性印刷电路板包含柔性焊接掩模
公开(公告)号：US06350387B2
公开(公告)日：2002-02-26
申请号：US09260198
申请日：1999-03-01
申请人： A. Roland Caron , Sandra L. Jean , James E. Keating , Robert S. Larmouth , Lee J. Millette
发明人： A. Roland Caron , Sandra L. Jean , James E. Keating , Robert S. Larmouth , Lee J. Millette
IPC分类号： H05K346
CPC分类号： H05K3/4691 , H05K3/0023 , H05K3/28 , H05K2203/0759
摘要： A multilayer rigid flex printed circuit board wherein the board laminate comprises a basestock composite containing a flexible core, formed by laminating a first conductive layer to a flexible insulator layer, a second insulator layer affixed to the basestock, said second insulator layer having a cutout region proximate to the flexible core of the basestock composite to expose a portion of said first conducting layer on said flexible core, a second conductive layer attached to said second insulator layer said second conductive layer having a cutout region proximate to the flexible core of the basestock composite, and a photo-imageable soldermask applied to the exposed portion said first conducting layer, and to the second conductive layer, wherein said photoimageable soldermask allows for photo definition of openings on the conductive layers to which it is applied.
摘要翻译：一种多层刚性柔性印刷电路板，其中所述板层叠体包括通过将第一导电层层压到柔性绝缘体层上而形成的包含柔性芯的基础材料复合体，固定到所述基础材料上的第二绝缘体层，所述第二绝缘体层具有切除区域靠近所述基础复合材料的柔性芯以暴露所述柔性芯上的所述第一导电层的一部分，附着到所述第二绝缘体层的第二导电层，所述第二导电层具有靠近所述基础复合材料的柔性芯的切除区域以及施加到所述第一导电层的暴露部分的光可成像焊接掩模，以及第二导电层，其中所述可光成像的焊接掩模允许在其所施加的导电层上的开口的照片定义。

6. 发明授权

US06770965B2 Wiring substrate using embedding resin 有权
标题翻译：使用嵌入树脂的布线基板
公开(公告)号：US06770965B2
公开(公告)日：2004-08-03
申请号：US10026454
申请日：2001-12-27
申请人： Hiroki Takeuchi , Toshifumi Kojima , Kazushige Ohbayashi , Hisahito Kashima
发明人： Hiroki Takeuchi , Toshifumi Kojima , Kazushige Ohbayashi , Hisahito Kashima
IPC分类号： H05K346
CPC分类号： H01L21/568 , H01L21/563 , H01L21/6835 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H01L2924/19041 , H05K1/0231 , H05K1/185 , Y10T428/24917 , H01L2924/00
摘要： A wiring substrate includes (1) an insulating substrate having an opening, or a core substrate and a build-up layer wherein at least one of the core substrate and the build-up layer has an opening, (2) at least one electronic part disposed in the opening, and (3) an embedding resin comprising a thermoplastic resin, an acid anhydride curing agent, a curing accelerator, and a filler, wherein the embedding resin shows a viscosity of not higher than 85 Pa·s in a shear rate of 8.4 s−1 after allowing to stand for 24 hours at 25° C.±1° C.
摘要翻译：布线基板包括（1）具有开口的绝缘基板或芯基板和堆积层，其中芯基板和堆积层中的至少一个具有开口，（2）至少一个电子部件（3）包含热塑性树脂，酸酐固化剂，固化促进剂和填料的嵌入树脂，其中嵌入树脂在剪切速率下显示不高于85Pa.s的粘度在25℃±1℃下静置24小时后为8.4s -1。

7. 发明授权

US06605868B2 Insulating substrate including multilevel insulative ceramic layers joined with an intermediate layer 有权
标题翻译：绝缘基板包括与中间层连接的多层绝缘陶瓷层
公开(公告)号：US06605868B2
公开(公告)日：2003-08-12
申请号：US09457335
申请日：1999-12-09
申请人： Yutaka Ishiwata , Kosoku Nagata , Toshio Shimizu , Hiroyuki Hiramoto , Yasuhiko Taniguchi , Kouji Araki , Hiroshi Fukuyoshi , Hiroshi Komorita
发明人： Yutaka Ishiwata , Kosoku Nagata , Toshio Shimizu , Hiroyuki Hiramoto , Yasuhiko Taniguchi , Kouji Araki , Hiroshi Fukuyoshi , Hiroshi Komorita
IPC分类号： H05K346
CPC分类号： H05K1/0256 , H01L23/34 , H01L23/49822 , H01L23/562 , H01L24/48 , H01L2224/05599 , H01L2224/48137 , H01L2224/85399 , H01L2924/00014 , H01L2924/01019 , H01L2924/01057 , H01L2924/01079 , H01L2924/01322 , H01L2924/16152 , H01L2924/181 , H05K1/0306 , H05K2201/09145 , Y10S428/901 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49165 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： An insulating substrate (1) has insulative ceramic layers (2, 3) laid one upon another, an intermediate layer (4) made of a material that is different from a material of the ceramic layers and arranged between adjacent ones of the ceramic layers to join the adjacent ceramic layers to each other, a first conductive layer (5) joined to the top surface of a top one of the ceramic layers, and a second conductive layer (6) joined to the bottom surface of a bottom one of the ceramic layers. Even if any one of the ceramic layers has strength lower than design strength and causes a breakage due to, for example, thermal stress, the remaining ceramic layers are sound to secure a specified breakdown voltage for the insulating substrate.
摘要翻译：绝缘基板（1）具有彼此层叠的绝缘陶瓷层（2,3），由与陶瓷层的材料不同并且布置在相邻的陶瓷层之间的材料制成的中间层（4）将相邻的陶瓷层彼此接合，接合到顶部陶瓷层的顶表面的第一导电层（5）和接合到陶瓷的底部陶瓷层的底表面的第二导电层（6）层。即使陶瓷层中的任何一个具有低于设计强度的强度并且由于例如热应力而引起断裂，剩余的陶瓷层声音可以确保绝缘基板的规定的击穿电压。

8. 发明授权

US06274242B1 Liquid crystal polymer film, laminate, method of making them and multi-layered parts-mounted circuit board 有权
标题翻译：液晶聚合物膜，层压板，制造方法和多层部件安装电路板
公开(公告)号：US06274242B1
公开(公告)日：2001-08-14
申请号：US09283871
申请日：1999-04-01
申请人： Minoru Onodera , Yoshinobu Tanaka
发明人： Minoru Onodera , Yoshinobu Tanaka
IPC分类号： H05K346
CPC分类号： B32B15/08 , B32B27/28 , B32B38/0036 , B32B2457/08 , C08J5/18 , C08J2367/00 , H05K1/0313 , H05K3/4676 , Y10T428/31504 , Y10T428/31786
摘要： A polymer film capable of forming an optically anisotropic melt phase is, after having been laminated on a base material capable of supporting the shape of the film during heat treatment, is heat-treated at a temperature of from the thermal deformation temperature Tdef of the film to a temperature lower by &agr; (&agr;=10 to 35° C.) than the melting point Tm of the film until the fusion peak temperature TA of the film attains a temperature which is higher by &bgr; (&bgr;=5 to 30° C.) than the melting point Tm of the film before the heat treatment and is subsequently heat-treated at a temperature of from a temperature not lower than the melting point Tm of the film to a temperature lower than the fuision peak temperature TA for a length of time over which the TA increases by &ggr; (&ggr;=5 to 20° C.), and thereafter the base material is removed to produce the film.
摘要翻译：能够形成光学各向异性熔融相的聚合物膜在热处理之后被层压在能够支撑膜的形状的基材上，在从膜的热变形温度Tdef的温度下进行热处理达到比膜的熔点Tm低α（α= 10〜35℃）的温度，直到膜的熔融峰温度TA达到高于β（β= 5〜30℃）的温度。）比在热处理前的膜的熔点Tm高，然后在不低于膜的熔点Tm的温度的温度下进行温度处理至低于引发峰温度TA的温度，长度为 TA通过伽玛（γ= 5至20℃）增加的时间，然后除去基材以产生膜。

9. 发明授权

US06252176B1 Printed wiring board, and manufacture thereof 失效
标题翻译：印刷电路板及其制造
公开(公告)号：US06252176B1
公开(公告)日：2001-06-26
申请号：US08839253
申请日：1997-04-17
申请人： Munehiro Kuramochi , Hiroshi Hagiwara , Kouichi Maeyama
发明人： Munehiro Kuramochi , Hiroshi Hagiwara , Kouichi Maeyama
IPC分类号： H05K346
CPC分类号： H05K3/4655 , H05K1/024 , H05K3/4069 , H05K3/4652 , H05K2201/0191 , H05K2201/0195 , H05K2201/09845 , H05K2203/063
摘要： A printed wiring board includes an insulating layer, conductive layers respectively formed into predetermined circuit patterns on the upper and lower surfaces of at least the insulating layer, and a conducting section formed in a portion of the insulating layer so as to enable electrical connection between the upper and lower conductive layers. A thickness of the insulating layer is varied to change the electric characteristics of the printed wiring board according to a circuit configuration of the conductive layers.
摘要翻译：印刷布线板包括绝缘层，至少绝缘层的上表面和下表面上分别形成为预定电路图形的导电层，以及形成在绝缘层的一部分中的导电部分，以使得能够在上下导电层。根据导电层的电路结构，改变绝缘层的厚度以改变印刷电路板的电特性。

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