会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明授权
    • Multilayer combined rigid/flex printed circuit board containing flexible soldermask
    • 多层组合刚性/柔性印刷电路板包含柔性焊接掩模
    • US06350387B2
    • 2002-02-26
    • US09260198
    • 1999-03-01
    • A. Roland CaronSandra L. JeanJames E. KeatingRobert S. LarmouthLee J. Millette
    • A. Roland CaronSandra L. JeanJames E. KeatingRobert S. LarmouthLee J. Millette
    • H05K346
    • H05K3/4691H05K3/0023H05K3/28H05K2203/0759
    • A multilayer rigid flex printed circuit board wherein the board laminate comprises a basestock composite containing a flexible core, formed by laminating a first conductive layer to a flexible insulator layer, a second insulator layer affixed to the basestock, said second insulator layer having a cutout region proximate to the flexible core of the basestock composite to expose a portion of said first conducting layer on said flexible core, a second conductive layer attached to said second insulator layer said second conductive layer having a cutout region proximate to the flexible core of the basestock composite, and a photo-imageable soldermask applied to the exposed portion said first conducting layer, and to the second conductive layer, wherein said photoimageable soldermask allows for photo definition of openings on the conductive layers to which it is applied.
    • 一种多层刚性柔性印刷电路板,其中所述板层叠体包括通过将第一导电层层压到柔性绝缘体层上而形成的包含柔性芯的基础材料复合体,固定到所述基础材料上的第二绝缘体层,所述第二绝缘体层具有切除区域 靠近所述基础复合材料的柔性芯以暴露所述柔性芯上的所述第一导电层的一部分,附着到所述第二绝缘体层的第二导电层,所述第二导电层具有靠近所述基础复合材料的柔性芯的切除区域 以及施加到所述第一导电层的暴露部分的光可成像焊接掩模,以及第二导电层,其中所述可光成像的焊接掩模允许在其所施加的导电层上的开口的照片定义。