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1. 发明专利

AU2001248398B2 Method for making an electroconductive joint 未知
公开(公告)号：AU2001248398B2
公开(公告)日：2004-07-01
申请号：AU2001248398
申请日：2001-03-21
申请人： OUTOKUMPU OY
发明人： POLVI VEIKKO
IPC分类号： B23K1/00 , B23K35/00 , B23K35/02 , B23K35/14 , B23K35/28 , B23K35/30 , C22C5/06 , H01R4/02 , H01R43/02 , H05K3/34 , H01R004/02 , B23K001/00 , H01R043/02 , B23K035/24
摘要： A method for creating an electroconductive joint in connection with conductor rails made of copper or copper alloy, in which method in between the conductor rail elements to be joined, there is applied soldering/brazing agent, whereafter at least the junction area is heated, so that a joint is created. According to the method, the employed soldering/brazing agent is a layered soldering/brazing agent foil (3) comprising surface layers (4, 6) and an intermediate layer (5) therebetween, and the junction area is thermally treated, so that a diffusion joint is created.

2. 发明申请

US20040089463A1 Coupling sleeve for a mineral-insulated cable and connection method 审中-公开
标题翻译：用于矿物绝缘电缆的连接套和连接方法
公开(公告)号：US20040089463A1
公开(公告)日：2004-05-13
申请号：US10616386
申请日：2003-07-09
发明人： Coralie Nguyen , Jean-Louis Tourraine
IPC分类号： H02G015/22 , H01B013/20 , H01R043/02
CPC分类号： H02G15/085 , H01R4/023 , H01R9/0503 , Y10T29/49123 , Y10T29/49179 , Y10T29/49194
摘要： Coupling sleeve with a generally cylindrical shape designed for connection between a mineral-insulated coaxial cable and a matching device which is itself coaxial. The sleeve protects a first contact and directly provides a second contact between two ends respectively of the cable and of the matching device. The sleeve is preferably designed with an aperture to enable filling after final assembly. The filling is done with insulating materials. After filling, the aperture is plugged. Preferably, the sleeve is soldered respectively to the second contact of the cable and to the second contact of the matching device.
摘要翻译：耦合套筒具有设计用于连接绝缘同轴电缆和自身同轴的匹配装置之间的大致圆柱形形状。套筒保护第一触点并且直接在电缆和匹配装置的两端之间提供第二触点。该套筒最好设计成具有孔，以便在最终组装之后能够填充。填充是用绝缘材料完成的。填充后，孔径被堵塞。优选地，套筒分别焊接到电缆的第二接触件和匹配装置的第二接触件。

3. 发明申请

US20030234451A1 Stabilized wire bonded electrical connections and method of making same 失效
标题翻译：稳定的导线接合电连接及其制造方法
公开(公告)号：US20030234451A1
公开(公告)日：2003-12-25
申请号：US10179560
申请日：2002-06-25
发明人： Eli Razon
IPC分类号： H05K013/00 , H01R043/00 , H01R043/02 , B23P021/00
CPC分类号： H01L24/85 , H01L21/4825 , H01L23/49811 , H01L24/10 , H01L24/13 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/13 , H01L2224/13099 , H01L2224/131 , H01L2224/13144 , H01L2224/16225 , H01L2224/32225 , H01L2224/43 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45611 , H01L2224/45616 , H01L2224/45639 , H01L2224/45644 , H01L2224/45655 , H01L2224/4809 , H01L2224/48091 , H01L2224/48227 , H01L2224/48455 , H01L2224/48472 , H01L2224/73204 , H01L2224/78302 , H01L2224/78313 , H01L2224/78318 , H01L2224/85205 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01075 , H01L2924/01079 , H01L2924/01084 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/19042 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01R13/2407 , H05K3/325 , H05K2201/10265 , H05K2201/10719 , H01L2924/00011 , H01L2924/00 , H01L2924/00015 , H01L2224/85399 , H01L2224/05599
摘要： A new and improved electrical connector is provided for Ball Grid Array (BGA) devices and Direct Chip Attach (DCA) devices that solves the prior art problems of mismatch in the coefficient of thermal between a semiconductor die and its substrate, PC board or carrier. The electrical connector consists of a resilient loop of wire that is permanently wire bonded at a first and a second bond position to an electrode or contact pad of a die or an interposer. The closed loop of wire is stable in the X and Y direction and resilient in the Z direction which enables the wire bonded die or interposer to be temporarily attached to a carrier or test board for all forms of tests as well as being removable and reworkable even after being permanently soldered in place on a substrate or PC board. Since the loop shaped connectors are resilient in X, Y and Z directions, the die or interposer may be clamped onto a PC board or substrate to provide a lead free electrical connection that does not require any underfill. The loop size may be made with highly conductive and/or plated (coated) wire in sizes from about 2.5 mils diameter up to about 30 mils using wire having a diameter of about 1.0 mils up to 5.0 mils to replace prior art balls used on pads of about 3 mils size or greater.
摘要翻译：为球栅阵列（BGA）器件和直接芯片连接（DCA）器件提供了一种新的改进的电连接器，其解决了半导体管芯及其衬底，PC板或载体之间的热系数不匹配的现有技术问题。电连接器由电线的弹性回路组成，其在第一和第二接合位置处永久地引线接合到模具或插入件的电极或接触焊盘。线的闭环在X和Y方向上是稳定的，并且在Z方向上具有弹性，这使得线接合模具或插入件能够临时连接到载体或测试板以进行所有形式的测试，并且甚至可移除和再加工在基板或PC板上永久焊接到位之后。由于环形连接器在X，Y和Z方向上具有弹性，所以芯片或插入件可夹紧在PC板或基板上，以提供不需要任何底部填充的无铅电连接。可以使用具有约1.0密耳至高达5.0密耳直径的线的直径大约2.5密耳直径至约30密耳的高导电性和/或电镀（涂覆）线制成环尺寸，以代替用于垫上的现有技术球约3密耳尺寸或更大。

4. 发明申请

US20030229983A1 Method for the manufacture of bundles of metal sheets of annular shape 失效
公开(公告)号：US20030229983A1
公开(公告)日：2003-12-18
申请号：US10386643
申请日：2003-03-13
发明人： Raymond Bourgeois
IPC分类号： H02K015/00 , B23P019/00 , H01R043/02
CPC分类号： H02K15/024 , B21D5/015 , B21D11/10 , Y10T29/49009 , Y10T29/49075 , Y10T29/49179 , Y10T29/53143 , Y10T29/53161 , Y10T29/5317
摘要： The method makes it possible to form a stator of an electric motor by means of a multiple-slide press (21, 22, 23). The starting point is a bundle consisting of rectilinear segments of sheets obtained by stamping and welded. The stator is formed by means of four successive operations carried out by four groups of slides of a multiple-slide press and corresponding dies. The cylinder formed is subsequently welded along its joining generatrix and is calibrated in a hydraulic press.

5. 发明申请

US20030136000A1 Process for treating coil end upon winding of coil 有权
标题翻译：线圈绕组处理线圈端的工艺
公开(公告)号：US20030136000A1
公开(公告)日：2003-07-24
申请号：US10214012
申请日：2002-08-07
发明人： Yoshihide Goto
IPC分类号： H01R043/02 , H01F007/06
CPC分类号： H01F41/076 , H01F5/04 , H01F41/10 , H01R43/033 , Y10T29/49071 , Y10T29/49073 , Y10T29/49162 , Y10T29/49179 , Y10T29/49192 , Y10T29/514 , Y10T29/5183 , Y10T29/53213
摘要： A process for treating a coil end is provided, by which upon automatic winding of the coil, an electric connection between a portion of a wire at the front or rear end of the coil and a terminal of a winding object by arc welding can be securely carried out. A stripping section strips an insulating coating off from the portions of the wire at the front and rear ends of the coil while the wire is wound around the winding object with the portions of the wire being bound to the terminal. Each portion of the wire, the insulating coating of which is stripped off, bound to the terminal is electrically connected to the terminal by arc welding.
摘要翻译：提供了一种处理线圈端的方法，通过该线圈的自动绕线，可以可靠地在线圈的前端或后端的线的一部分与绕组物体的端子之间的电连接执行。剥线部分在丝线的前端和后端处的线的部分剥离绝缘涂层，同时线缠绕在绕线物体上，线的部分被绑在端子上。剥离的绝缘涂层的每个部分与终端结合，通过电弧焊接与端子电连接。

6. 发明申请

US20030066187A1 Method for removing a braiding layer of coaxial cable 失效
标题翻译：去除同轴电缆编织层的方法
公开(公告)号：US20030066187A1
公开(公告)日：2003-04-10
申请号：US10293669
申请日：2002-11-12
发明人： Jim Zhao
IPC分类号： H01B013/20 , H01R043/02 , B23P023/00
CPC分类号： H02G1/1202 , Y10T29/49117 , Y10T29/49123 , Y10T29/49179 , Y10T29/514
摘要： A method for removing a braiding layer of a coaxial cable which includes a core conductor; a layer of insulator coated over the core conductor; a layer of braiding layer encapsulated the insulator; and 4) an outer insulator, comprises the steps of a) removing a section of the outer insulator to expose a section of the braiding layer; b) dipping the section of the braiding layer into a solder bath such that the braiding layer is coated with a layer of solder to form a consolidated section; c) scoring a cut along traverse section of the consolidated section and dividing the consolidated section into first and second portions; d) bending the consolidated section along the cut to break the first and second portions; and e) removing the first portion and exposing the inner insulator.
摘要翻译：一种用于去除包括芯导体的同轴电缆的编织层的方法; 覆盖在芯导体上的绝缘层; 一层编织层封装绝缘体; 和4）外绝缘体，包括以下步骤：a）去除所述外绝缘体的一部分以暴露所述编织层的一部分; b）将编织层的部分浸入焊料槽中，使得编织层涂覆有一层焊料以形成固结部分; c）沿着合并部分的横截面划分切割，并将合并的部分划分成第一和第二部分; d）沿着切口弯曲固结部分以破坏第一和第二部分; 以及e）去除所述第一部分并暴露所述内绝缘体。

7. 发明申请

US20030001950A1 Device for metal welding 失效
标题翻译：金属焊接装置
公开(公告)号：US20030001950A1
公开(公告)日：2003-01-02
申请号：US10203507
申请日：2002-08-08
发明人： Ingemar Eriksson
IPC分类号： H04N007/18 , H04N009/47 , A61B001/04 , H04N007/16 , B23P017/04 , H01R043/02
CPC分类号： A61F9/06 , B23K9/32 , G05B2219/35487 , H04N7/181 , Y10T29/49 , Y10T29/49179
摘要： The invention relates to a device for metal welding, comprising a shielding element (1) which allows visual monitoring of the working process but protects the eyes from light radiation. The device comprises a video camera (5) which is directable towards the welding zone for recording the welding process in the form of video signals transmitted, via an image processing unit, to a video display unit (7), which the user is able to view and which is placed in or on the inside of the shielding element (1). The image processing unit reads process data from the video signals and presents the same via the video display unit.
摘要翻译：本发明涉及一种用于金属焊接的装置，包括屏蔽元件（1），其允许视觉监视工作过程，但保护眼睛免受光辐射。该装置包括可以朝向焊接区域定向的摄像机（5），用于以经由图像处理单元传送到视频显示单元（7）的视频信号的形式记录焊接处理，用户能够视图，并且放置在屏蔽元件（1）的内部或其上。图像处理单元从视频信号读取处理数据并经由视频显示单元呈现它们。

8. 发明申请

US20040163249A1 METHOD OF ASSEMBLING A BOBBIN 失效
标题翻译：组装BOBBIN的方法
公开(公告)号：US20040163249A1
公开(公告)日：2004-08-26
申请号：US10375317
申请日：2003-02-26
发明人： Cecilia Hernandez , Miguel Antonio Maldonado
IPC分类号： H01F007/06 , H01R043/02
CPC分类号： H01F41/10 , H01F41/076 , H01F2027/297 , H01R4/14 , H01R43/02 , Y10T29/49002 , Y10T29/49071 , Y10T29/49174 , Y10T29/49179 , Y10T29/49194
摘要： A method for assembling an electrical bobbin requires a spool of wire extending between first and second leads, a housing having first and second opening, and first and second terminal posts, each having a predetermined width. The method includes the step of placing the spool of wire into the housing. The first lead is then extended through the first opening. Like the first lead, the second lead is then extended through the second opening. The first terminal post is extended into the first opening and the second terminal post is extended into the second opening. The first lead is wrapped around the first terminal post to create a first wire wrap. The second lead is wrapped around the second terminal post to create a second wire wrap. The first wire wrap is soldered to the first terminal post. The second wire wrap is soldered to the second terminal post. Each of the first and second terminal posts are moved further into the first and second opening to reduce the amount of first and second terminal posts extending out of the housing.
摘要翻译：一种用于组装电线轴的方法需要在第一和第二引线之间延伸的线芯，具有第一和第二开口的壳体以及具有预定宽度的第一和第二端子柱。该方法包括将线轴卷绕到壳体中的步骤。然后，第一个引导线通过第一个开口延伸。像第一个引线一样，第二个引导线延伸穿过第二个开口。第一端子柱延伸到第一开口中，并且第二端子柱延伸到第二开口中。第一个引线缠绕在第一个终端柱上，以创建第一个线缠绕。第二个引线缠绕在第二个端子柱上，以产生第二个电线缠绕。第一个电线包被焊接到第一个终端柱。第二个电线包被焊接到第二个终端柱。第一和第二端子柱中的每一个进一步移动到第一和第二开口中以减少从壳体延伸出的第一和第二端子柱的量。

9. 发明申请

US20030156402A1 Method for making a build-up package of a semiconductor die and structure formed from the same 有权
标题翻译：用于制造半导体管芯的堆积封装的方法及由其形成的结构
公开(公告)号：US20030156402A1
公开(公告)日：2003-08-21
申请号：US10075231
申请日：2002-02-15
申请人： Advanced Semiconductor Engineering, Inc.
发明人： Yi-Chuan Ding , In-De Ou , Kun-Ching Chen
IPC分类号： H01L023/02 , H05K003/02 , H01R043/02
CPC分类号： H01L24/97 , H01L23/49811 , H01L23/49816 , H01L23/5389 , H01L24/19 , H01L2224/04105 , H01L2224/20 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/12042 , H01L2924/1433 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H05K1/185 , H05K3/4614 , H05K3/4647 , H05K2201/0355 , H05K2203/0733 , H05K2203/1189 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49156 , Y10T29/49158 , Y10T29/49208 , H01L2924/00
摘要： A method for making a build-up package of a semiconductor die and a structure formed from the same. A copper foil with conductive columns is bonded to an encapsulated die by thermal compression, between thereof there is a pre-curing dielectric film sandwiched. The dielectric film is cured to form a dielectric layer of a die build-up package and the copper foil on the dielectric layer is etched to form the conductive traces. At least one conductive column in one of the dielectric layers is vertically corresponding to one of conductive column in the adjacent dielectric layer.
摘要翻译：一种用于制造半导体管芯的堆积封装的方法和由其形成的结构。具有导电柱的铜箔通过热压合而结合到封装的管芯上，其间夹有预固化电介质膜。电介质膜被固化以形成模具积聚封装的电介质层，并且蚀刻介电层上的铜箔以形成导电迹线。电介质层之一中的至少一个导电柱垂直对应于相邻电介质层中的导电柱之一。

10. 发明申请

US20020137404A1 I-channel surface-mount connector 有权
标题翻译： I通道表面贴装连接器
公开(公告)号：US20020137404A1
公开(公告)日：2002-09-26
申请号：US10138139
申请日：2002-05-02
发明人： Apurba Roy
IPC分类号： H01R004/02 , H05K003/34 , H01R043/02
CPC分类号： H01R12/57 , H01L23/49811 , H01L2924/0002 , H01L2924/3011 , H01R12/52 , H05K3/3426 , H05K3/368 , H05K2201/1031 , H05K2201/10666 , H05K2201/10856 , Y02P70/611 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49211 , H01L2924/00
摘要： In accordance with the invention, a low impedance surface-mount connector comprises a length of cylindrical rod having an I-shaped cross section. The device permits interconnection by pick-and-place techniques, and the interconnection has advantageous qualities of low resistance, low inductance, mechanical compliance and ease of manufacture. A first circuit device having one or more circuit components is interconnected with a second circuit device by surface mounting such connectors on the first circuit device, providing corresponding solder pads on the second circuit device, and mounting the connectors of the first circuit device onto the pads of the second.
摘要翻译：根据本发明，低阻抗表面安装连接器包括具有I形横截面的一定长度的圆柱形杆。该器件允许通过拾取和放置技术进行互连，并且互连具有低电阻，低电感，机械符合性和易于制造的优点。具有一个或多个电路部件的第一电路装置通过将这种连接器表面安装在第一电路装置上而与第二电路装置互连，在第二电路装置上提供相应的焊盘，并将第一电路装置的连接器安装到焊盘的第二。

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