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1. 发明专利

AU2001248398B2 Method for making an electroconductive joint 未知
公开(公告)号：AU2001248398B2
公开(公告)日：2004-07-01
申请号：AU2001248398
申请日：2001-03-21
申请人： OUTOKUMPU OY
发明人： POLVI VEIKKO
IPC分类号： B23K1/00 , B23K35/00 , B23K35/02 , B23K35/14 , B23K35/28 , B23K35/30 , C22C5/06 , H01R4/02 , H01R43/02 , H05K3/34 , H01R004/02 , B23K001/00 , H01R043/02 , B23K035/24
摘要： A method for creating an electroconductive joint in connection with conductor rails made of copper or copper alloy, in which method in between the conductor rail elements to be joined, there is applied soldering/brazing agent, whereafter at least the junction area is heated, so that a joint is created. According to the method, the employed soldering/brazing agent is a layered soldering/brazing agent foil (3) comprising surface layers (4, 6) and an intermediate layer (5) therebetween, and the junction area is thermally treated, so that a diffusion joint is created.

2. 发明申请

US20030017756A1 Circular electrical connector 有权
公开(公告)号：US20030017756A1
公开(公告)日：2003-01-23
申请号：US10247443
申请日：2002-09-19
申请人： Antaya Technologies Corporation
发明人： John Pereira , Manuel Machado , Stephen Antaya
IPC分类号： H01R004/02
CPC分类号： H05B3/84 , H01R4/02 , H01R4/028 , H01R4/58 , H01R12/57 , H01R13/20 , H01R13/207 , H01R13/213 , H01R13/639 , H01R43/0235 , H01R43/0256 , H01R43/0263 , H05B2203/016 , H05K3/341 , H05K2201/1031 , H05K2201/2036 , Y02P70/611 , Y02P70/613 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49217 , Y10T29/49218 , Y10T29/49222
摘要： An electrical connector includes a hollow conductive post member having a circular periphery, a foot portion and a distal end. The distal end has a generally cup shaped indentation. A base member is included having top and bottom surfaces. The foot portion of the post member is mounted to the top surface. At least one standoff extends from the bottom surface of the base member. The at least one standoff is for resting against a contact surface when soldering the electrical connector to the contact surface, thereby separating the bottom surface from the contact surface to define a minimum volume therebetween for occupation by solder.

3. 发明申请

US20010021611A1 Bus bar structure 失效
标题翻译：母线结构
公开(公告)号：US20010021611A1
公开(公告)日：2001-09-13
申请号：US09860451
申请日：2001-05-21
申请人： Harness System Technologies Research, Ltd.
发明人： Takahiro Onizuka , Atsuhiko Fujii , Yoshifumi Saka , Atsuhiro Togawa
IPC分类号： H01R004/02
CPC分类号： H05K3/328 , H01R9/2458 , H01R9/2491 , H01R43/0221 , H05K3/202 , H05K3/222 , H05K3/361 , H05K3/4015 , Y10S439/907 , Y10S439/949
摘要： A bus bar structure includes: a bus bar stored in an electric junction box; and a tab terminal electrically connected to a pattern portion of the bus bar. The tab terminal is separately formed with the bus bar. The pattern portion is welded with the tab terminal by using a laser beam.
摘要翻译：母线结构包括：存储在电接线盒中的母线; 以及电连接到母线的图案部分的接片端子。标签端子与母线分开形成。图案部分通过使用激光束与突片端子焊接。

4. 发明申请

US20010018980A1 Terminal-processed structure of tape-shaped cable including plurality of coaxial cables arranged in parallel and method for processing terminal of the same 失效
公开(公告)号：US20010018980A1
公开(公告)日：2001-09-06
申请号：US09774707
申请日：2001-02-01
申请人： Hitachi Cable Ltd.
发明人： Masashi Kunii , Hideki Saito , Hajime Kimura , Takaaki Ichikawa
IPC分类号： H01R004/02
CPC分类号： H01R43/28 , H01R9/0506 , H01R12/598 , H01R12/7076 , H01R13/6592 , Y10T29/49117 , Y10T29/49123 , Y10T29/49174 , Y10T29/49183 , Y10T29/49185 , Y10T29/49194 , Y10T29/49211
摘要： A method for processing a terminal of a cable including a plurality of fine coaxial cables arranged in parallel and a terminal-processed tape-shaped cable are provided. After sheaths closer to the terminal of a plurality of fine coaxial cables are removed to expose outer conductors, the outer conductors thus exposed are removed in such a way that the entirety of the outer conductors thus exposed are covered with a solder layer, then the solder layer and the outer conductors are separated at a processing groove formed at a predetermined position on this solder layer, and respective portions of the outer conductors closer to the end of the cable relative to the position of the separation are removed in a lump.

5. 发明申请

US20040092174A1 Circuit board inter-connection system and method 失效
标题翻译：电路板互连系统及方法
公开(公告)号：US20040092174A1
公开(公告)日：2004-05-13
申请号：US10666945
申请日：2003-09-19
发明人： Daniel S. Eichorn , Michael W. Allender , Dominic Anthony Messuri , Christopher Alan Brandon
IPC分类号： H01R004/02
CPC分类号： H01R12/58 , H01R12/523 , H05K3/306 , H05K3/3447 , H05K2201/10303 , H05K2201/10424 , H05K2201/10568 , H05K2201/2036 , Y10T29/49147
摘要： An electrical inter-connection is provided such that a terminal pin which is positioned in a pin block extends through a plated through-hole in a circuit board substrate and is connected with the circuit board using a conductive bonding agent such as solder. The terminal pin is capable of inter-connection with conductive elements located on each major side of the circuit board and eliminates the need for an interference fit between the terminal pin and circuit board. The pin block includes a body and at least one stand-off. The stand-off maintains the body a sufficient distance from the circuit board substrate to enable a solder fillet to form between the plated through-hole and the terminal pin during re-flow processing. The electrical inter-connection further includes an eccentric aperture in the circuit board suitable for interference fit inter-connection with a protruding cylindrical feature such as on an electrical ground that has poor solderability characteristics. The preferred embodiment limits normal forces caused by temperature cycling, vibration, and other conditions to two areas of contact yet enables adequately low electrical contact resistance.
摘要翻译：提供电连接，使得定位在销块中的端子销延伸穿过电路板基板中的电镀通孔，并且使用诸如焊料的导电粘合剂与电路板连接。端子引脚能够与位于电路板的每个主要侧面上的导电元件相互连接，并且不需要端子引脚和电路板之间的过盈配合。销块包括主体和至少一个支架。支架将主体与电路板基板保持足够的距离，以便在再流动处理期间能够在电镀通孔和端子销之间形成焊锡圆角。电气互连还包括电路板中的偏心孔，其适于与诸如在具有差的可焊性特性的电气接地上的突出圆柱形特征相互连接的过盈配合。优选的实施例将由温度循环，振动和其他条件引起的正常力限制到两个接触区域，但是能够实现足够低的电接触电阻。

6. 发明申请

US20020187689A1 Bonded structure and electronic circuit board 有权
标题翻译：保税结构和电子电路板
公开(公告)号：US20020187689A1
公开(公告)日：2002-12-12
申请号：US09959482
申请日：2002-02-04
发明人： Kenichiro Suetsugu , Masuo Suetsugu , Kenichiro Todoroki , Shunji Hibino , Hiroaki Takano , Mikiya Nakata , Yukio Maeda
IPC分类号： H01R004/02
CPC分类号： H05K3/3447 , H05K1/0293 , H05K1/115 , H05K1/116 , H05K3/3452 , H05K3/3463 , H05K3/4092 , H05K2201/0373 , H05K2201/0397 , H05K2201/09663 , H05K2201/0979 , H05K2201/099
摘要： A connection structure of the present invention has a board with a through hole perforating therethrough, a land formed around the through hole, and a lead extending from an electronic component and disposed in the through hole. The land includes a wall surface land portion formed on a wall surface of the through hole, and front and back surface land portions formed on the front and back surfaces of the board respectively. A fillet connecting the land and the lead includes upper and lower fillet portions respectively contacting with the front and back surface land portions. A profile of the upper fillet portion is smaller than that of the lower fillet portion and is not smaller than that of the through hole. Therefore, occurrence of lift-off is effectively reduced while using a lead-free solder material.
摘要翻译：本发明的连接结构具有贯穿孔的通孔，形成在通孔周围的台面，以及从电子部件延伸设置在通孔中的引线。所述平台包括形成在所述通孔的壁面上的壁面陆部，以及分别形成在所述板的前后表面上的前表面和后表面接合部。连接陆地和铅的圆角包括分别与前表面和后表面陆部接触的上下圆角部分。上部圆角部分的轮廓小于下圆角部分的轮廓，并且不小于通孔的轮廓。因此，使用无铅焊料材料时，有效地减少了剥离的发生。

7. 发明申请

US20020061687A1 Solder bearing grid array 审中-公开
标题翻译：焊接网格阵列
公开(公告)号：US20020061687A1
公开(公告)日：2002-05-23
申请号：US09991055
申请日：2001-11-21
申请人： TEKA INTERCONNECTIONS SYSTEMS, INC.
发明人： Joseph S. Cachina , James R. Zanolli
IPC分类号： H01R004/02
CPC分类号： H05K3/3426 , H01R43/0235 , H01R43/0256 , Y02P70/613
摘要： The present invention provides a solder ball grid array (SBGA) type connector and method of manufacture thereof. The SBGA connector includes a number of contacts which each have a solder ball formed at one end thereof. According to the present invention the solder ball is formed by disposing and retaining a solder mass along a body of the contact. The contact is then heated to a predetermined temperature resulting in the solder mass reflowing to one end of the body so that a solder ball is formed at the one end.
摘要翻译：本发明提供了一种焊球栅阵列（SBGA）型连接器及其制造方法。 SBGA连接器包括多个在其一端形成有焊球的触点。根据本发明，通过沿着接触体的主体设置和保持焊料块来形成焊球。然后将接触件加热到预定温度，导致焊料质量回流到主体的一端，使得在一端形成焊球。

8. 发明申请

US20020058446A1 Solder-holding clips for applying solder to connectors or the like 有权
公开(公告)号：US20020058446A1
公开(公告)日：2002-05-16
申请号：US10038418
申请日：2002-01-02
申请人： North American Specialties Corporation
发明人： Joseph Cachina , Jack Seidler , James R. Zanolli
IPC分类号： H01R004/02
CPC分类号： B23K35/0244 , H01R4/024 , H01R43/0235 , H01R43/0256 , H01R43/16 , H05K3/3447 , H05K3/3478 , H05K2201/10189 , H05K2201/10984 , H05K2203/0415 , Y10T29/49149 , Y10T29/49204
摘要： An array and method of forming an array of solder-holding clips is provided, suitable for fabrication by automatic progressive stamping techniques, and for ganged application to a corresponding array of terminal pins of an electrical device, for soldering such pins directly to the conductive pads or internally plated holes of a substrate, or to provide a lead connecting such pins to a substrate.

9. 发明申请

US20010016459A1 ELECTROMAGMETIC JOINING OR WELDING OF METAL OBJECTS 无效
标题翻译：电磁接合或焊接金属物体
公开(公告)号：US20010016459A1
公开(公告)日：2001-08-23
申请号：US09071885
申请日：1998-05-05
发明人： YURI LIVSHIZ , OREN GAFRI
IPC分类号： H01R004/02 , H01R004/10
CPC分类号： B21D26/14 , B23K20/00 , B23K20/06
摘要： A method of joining or welding of at least a portion of a first metal workpiece to at least a portion of one or more second metal workpieces, comprising inducing movement in said portion of the first workpiece by means of a pulsed magnetic force so as to impact said portion of the second workpiece, the movement imparting a kinetic energy on the at least portion of the first workpiece to cause the two at least portions to join or weld to one another.
摘要翻译：一种将第一金属工件的至少一部分的至少一部分接合或焊接到一个或多个第二金属工件的至少一部分的方法，包括通过脉冲磁力诱导在所述第一工件的所述部分中的移动以便冲击所述第二工件的所述部分，所述运动在第一工件的至少部分上施加动能，以使两个至少部分彼此连接或焊接。

10. 发明申请

US20040209529A1 Electric contact and housing of plug connector 有权
标题翻译：插头连接器的电接点和外壳
公开(公告)号：US20040209529A1
公开(公告)日：2004-10-21
申请号：US10824246
申请日：2004-04-13
申请人： J. S. T. Mfg. Co., Ltd.
发明人： Keiji Kuroda , Kiyoshi Aramoto , Ryo Moriwake
IPC分类号： H01R004/02
CPC分类号： H01R13/4223 , H01R43/16
摘要： The objective of the present invention is to reconcile assurance of the barrel's function of crimping thin wire and enhancement in the strength of the tab, and fit the top end of the tab on the housing to prevent the tab from lifting from the supporting wall, and in turn, to prevent defective fitting-in or failure of fitting-in between the plug connector and the receptacle connector. The electric contact of plug connector of the present invention is formed by folding a blank of a certain configuration, inserted into the receiving cell of the housing and fitted on the housing. The tab of the electric contact comprises a base plate and a contact plate formed by folding a part of the blank and overlapping them in the thickness direction. The rear end in the depth direction of the base plate protrudes beyond the rear end in the depth direction of the contact plate to provide a protruding part. When the body is set in the receiving cell of the housing, the base plate of the tab protruding out of the receiving cell is supported by the housing, and the protruding part is fitted on the housing to prevent the tab from lifting in the thickness direction from the housing.
摘要翻译：本发明的目的在于调节圆筒的压接细丝的功能的保证，并提高突片的强度，并且将突片的顶端装配在外壳上以防止突片从支撑壁上抬起，以及反过来也可防止插头连接器和插座连接器之间插入或插入不良。本发明的插头连接器的电接点通过折叠插入壳体的接收单元中并安装在壳体上的某种构造的坯料而形成。电接触件的突片包括基板和通过折叠坯件的一部分并在厚度方向上重叠它们而形成的接触板。基板的深度方向的后端在接触板的深度方向上突出超过后端，以提供突出部。当主体设置在壳体的接收单元中时，从接收单元突出的突片的基板由壳体支撑，并且突出部分装配在壳体上以防止突片在厚度方向上提升从房屋。

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