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    • 1. 发明授权
    • LDMOS transistor
    • LDMOS晶体管
    • US07141860B2
    • 2006-11-28
    • US10875105
    • 2004-06-23
    • Vishnu K. KhemkaVijay ParthasarathyRonghua ZhuAmitava Bose
    • Vishnu K. KhemkaVijay ParthasarathyRonghua ZhuAmitava Bose
    • H01L27/95H01L29/47
    • H01L29/782H01L27/0727H01L29/0619H01L29/0653H01L29/47H01L29/66659H01L29/66681H01L29/7835
    • An LDMOS transistor has a Schottky diode inserted at the center of a doped region of the LDMOS transistor. A Typical LDMOS transistor has a drift region in the center. In this case a Schottky diode is inserted at the center of this drift region which has the effect of providing a Schottky diode connected from source to drain in the forward direction so that the drain voltage is clamped to a voltage that is lower than the PN junction threshold, thereby avoiding forward biasing the PN junction. An alternative is to insert the Schottky diode at the well in which the source is formed, which is on the periphery of the LDMOS transistor. In such case the Schottky diode is formed differently but still is connected from source to drain in the forward direction to achieve the desired voltage clamping at the drain.
    • LDMOS晶体管具有插入在LDMOS晶体管的掺杂区域的中心处的肖特基二极管。 典型的LDMOS晶体管在中心具有漂移区域。 在这种情况下,肖特基二极管被插入该漂移区的中心,其具有在正向上提供从源极到漏极连接的肖特基二极管的作用,使得漏极电压被钳位到低于PN结的电压 阈值,从而避免正向偏置PN结。 一种替代方案是将肖特基二极管插入其中形成源的阱,其位于LDMOS晶体管的外围。 在这种情况下,肖特基二极管的形成方式不同,但仍然在正向方向上从源极到漏极连接,以在漏极处实现所需的电压钳位。
    • 3. 发明授权
    • Semiconductor device incorporating protective diode with stable ESD protection capabilities
    • 具有稳定ESD保护功能的保护二极管的半导体器件
    • US07420255B2
    • 2008-09-02
    • US11396192
    • 2006-03-30
    • Akira Shimizu
    • Akira Shimizu
    • H01L27/95
    • H01L27/0255H01L29/0638H01L29/0696H01L29/0878H01L29/42368H01L29/66568H01L29/66659H01L29/66681H01L29/7818H01L29/7821H01L29/7835H01L29/7836
    • A semiconductor device provided with stable ESD protection capabilities, incorporating a transistor and a protective diode to form a power control IC. The semiconductor device includes a semiconductor substrate of a first conductivity type; a well region of a second conductivity type, formed in the semiconductor substrate; the transistor formed in the well region; a guard ring region of the second conductivity type having an impurity concentration higher than the well region, formed on the surface of the semiconductor substrate inside the periphery of, and spatially separated from the boundary of, the well region; a substrate pickup region of the first conductivity type having an impurity concentration higher than the semiconductor substrate, formed on the periphery of the well region in contact with the well region and the semiconductor substrate; and a thick oxide film formed on the surface of the semiconductor substrate between the guard ring region and the substrate pickup region. The protective diode is formed including the well region, the guard ring region, and the substrate pickup region.
    • 具有稳定的ESD保护能力的半导体器件,结合了晶体管和保护二极管以形成功率控制IC。 半导体器件包括第一导电类型的半导体衬底; 形成在所述半导体衬底中的第二导电类型的阱区; 所述晶体管形成在所述阱区中; 第二导电类型的保护环区域,具有比阱区高的杂质浓度,形成在半导体衬底的外围的表面上,并且与该区域的边界在空间上分离; 形成在与阱区和半导体衬底接触的阱区的周围的具有比半导体衬底高的杂质浓度的第一导电类型的衬底拾取区; 以及在保护环区域和基板拾取区域之间形成在半导体衬底的表面上的厚氧化膜。 保护二极管形成包括阱区,保护环区和衬底拾取区。
    • 4. 发明授权
    • IGBT with a Schottky barrier diode
    • 具有肖特基势垒二极管的IGBT
    • US06921958B2
    • 2005-07-26
    • US10689058
    • 2003-10-21
    • Yukio Yasuda
    • Yukio Yasuda
    • H01L27/04H01L21/822H01L21/8234H01L27/06H01L27/07H01L27/088H01L29/78H01L31/0328H03K17/04H03K17/0812H01L27/95
    • H01L27/0716H03K17/0406H03K17/08128
    • A semiconductor device which IGBT (Z1) and a control circuit (B1) for driving the IGBT (Z1) are formed on the same semiconductor substrate by using a junction isolation technology, includes an input terminal (P1) for inputting a drive signal of the IGBT (Z1), a Schottky barrier diode (D2) having an anode connected to the input terminal (P1) and a cathode connected to an input terminal (B11) of the control circuit (B1), and a p-channel MOSFET (T1) for shorting both ends of the Schottky barrier diode (D2) when the voltage of the drive signal input to the input terminal (P1) is higher than a predetermined voltage, thereby latch-up of the parasitic element is prevented and a transmission loss of the input signal can be reduced.
    • 通过使用结隔离技术,在同一半导体衬底上形成用于驱动IGBT(Z 1)的IGBT(Z 1)和控制电路(B 1)的半导体装置包括:输入端子(P1) IGBT(Z 1)的驱动信号,具有连接到输入端子(P 1)的阳极的肖特基势垒二极管(D 2)和连接到控制电路(B1)的输入端子(B11)的阴极, 以及当输入到输入端子(P1)的驱动信号的电压高于预定电压时,用于短路肖特基势垒二极管(D 2)两端的p沟道MOSFET(T 1) 防止寄生元件的上升,并且可以减小输入信号的传输损耗。