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    • 3. 发明申请
    • Apparatus for photolithographic processing
    • 光刻处理设备
    • US20040191702A1
    • 2004-09-30
    • US10816973
    • 2004-04-01
    • Kevin DuesmanRandal Chance
    • G03F007/20
    • G03F7/70466
    • Photolithographic processing apparatus and methods are disclosed. In one embodiment, a method of photolithographically patterning a surface of a substrate includes forming a photoreactive layer on the surface of the substrate, transmitting light through a first patterning portion of a first photolithographic mask to expose a first patterned portion of the photoreactive layer, transmitting light through a second patterning portion of a second photolithographic mask to expose a second patterned portion of the photoreactive layer. In an alternate embodiment, transmitting light through the first patterning portion of the first photolithographic mask is performed simultaneously with transmitting light through the second patterning portion of the second photolithographic mask. In a further embodiment, the light being transmitted through the second patterning portion of a second photolithographic mask has already been transmitted through a first transparent portion of the first photolithographic mask.
    • 公开了光刻处理装置和方法。 在一个实施例中,光刻地图案化衬底的表面的方法包括在衬底的表面上形成光反应层,透过第一光刻掩模的第一图案化部分透射光以暴露光反应层的第一图案化部分,透射 光通过第二光刻掩模的第二图案化部分以暴露光致反应层的第二图案化部分。 在替代实施例中,透射第一光刻掩模的第一图案化部分的光透过第二光刻掩模的第二图案形成部分同时进行。 在另一个实施例中,透射通过第二光刻掩模的第二图案化部分的光已经透射通过第一光刻掩模的第一透明部分。
    • 5. 发明申请
    • Method and apparatus for recycling gases used in a lithography tool
    • 用于回收光刻工具中使用的气体的方法和装置
    • US20040183030A1
    • 2004-09-23
    • US10392793
    • 2003-03-20
    • ASML Netherlands B.V.
    • Stephen Roux
    • G03F007/20
    • G03F7/70933B82Y10/00G03F7/70033G03F7/70841G03F7/70883
    • A system and method are used to recycle gases in a lithography tool. A first chamber includes an element that emits light based on a first gas. A second chamber uses the emitted light to perform a process and includes the second gas. The first and second gases converge between the two chambers, and at least one of the gases is pumped to a storage device. From the storage device, at least one of the two gases is recycled either within the system or remote from the system and possibly reused within the system. A gaslock can couple the first chamber to the second chamber. A gas source supplies a third gas between the first and the second gas in the gaslock, such that the first gas is isolated from the second gas in the gaslock. The first, second, and/or third gas can be pumped to the storage device and routed to the recycling device. The first, second, and/or third gas can be recycled for reuse to form the emitting light.
    • 系统和方法用于回收光刻工具中的气体。 第一室包括基于第一气体发光的元件。 第二室使用发射的光进行处理并且包括第二气体。 第一和第二气体在两个室之间会聚,并且至少一个气体被泵送到存储装置。 从存储装置中,两种气体中的至少一种在系统内或远离系统再循环,并且可能在系统内重新使用。 气闸可以将第一腔室连接到第二腔室。 气体源在气闸中的第一和第二气体之间提供第三气体,使得第一气体与气闸中的第二气体隔离。 第一,第二和/或第三气体可以被泵送到存储装置并且被路由到回收装置。 第一,第二和/或第三气体可以被再循环以重新使用以形成发射光。
    • 7. 发明申请
    • Method for forming multiple spacer widths
    • 形成多个间隔物宽度的方法
    • US20040137373A1
    • 2004-07-15
    • US10340245
    • 2003-01-09
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Ming-Ta LeiYih-Shung LinAl-Sen LiuCheng-Chung LinBaw-Ching PerngChia-Hui Lin
    • G03F007/20
    • H01L21/823468
    • A method of forming pluralities of gate sidewall spacers each plurality comprising different associated gate sidewall spacer widths including providing a plurality of gate structures formed overlying a substrate and a plurality of dielectric layers formed substantially conformally overlying the gate structures; exposing a first selected portion of the plurality followed by anisotropically etching through a thickness portion comprising at least the uppermost dielectric layer to form a first sidewall spacer width; exposing a first subsequent selected portion of the plurality followed by etching through at least a thickness portion of the uppermost dielectric layer; and, exposing a second subsequent selected portion of the plurality followed by anisotropically etching through at least a thickness portion of the uppermost dielectric layer to form a subsequent sidewall spacer width.
    • 一种形成多个栅极侧壁间隔物的方法,每个栅极侧壁间隔件包括不同的相关栅极侧壁间隔物宽度,包括提供形成在衬底上的多个栅极结构和基本上共形地覆盖栅极结构的多个电介质层; 暴露多个的第一选定部分,然后通过各向异性蚀刻穿过包括至少最上面的介电层的厚度部分以形成第一侧壁间隔物宽度; 暴露多个的第一后续选定部分,然后蚀刻通过至少最上层介电层的厚度部分; 并且暴露多个随后的第二部分,然后通过各向异性蚀刻穿过至少最上面的介电层的厚度部分以形成随后的侧壁间隔物宽度。
    • 10. 发明申请
    • Method for manufacturing a semiconductor device
    • 半导体器件的制造方法
    • US20040058280A1
    • 2004-03-25
    • US10430112
    • 2003-05-05
    • Samsung Electronics Co., Ltd.
    • Bong-Cheol KimDae-Youp Lee
    • G03F007/16G03F007/20G03F007/30G03F007/40
    • H01L21/76808
    • Disclosed is a method for manufacturing a semiconductor device by employing a dual damascene process. After a first insulation film including a conductive pattern is formed on a substrate, at least one etch stop film and at least one insulation film are alternatively formed on the first insulation film. A via hole for a contact or a trench for a metal wiring is formed through the insulation film, and then the via hole or the trench is filled with a filling film including a water-soluble polymer. After a photoresist film is coated on the filling film, the photoresist film is patterned to form a photoresist pattern and to remove the filling film. The DOF and processing margin of the photolithography process for forming the photoresist pattern can be improved because the photoresist film can have greatly reduced thickness due to the filling film.
    • 公开了采用双镶嵌工艺制造半导体器件的方法。 在基板上形成包括导电图案的第一绝缘膜之后,在第一绝缘膜上交替地形成至少一个蚀刻停止膜和至少一个绝缘膜。 通过绝缘膜形成接触用通孔或金属配线用沟槽,然后在通孔或沟槽中填充有包含水溶性聚合物的填充膜。 将光致抗蚀剂膜涂覆在填充膜上之后,将光致抗蚀剂膜图案化以形成光致抗蚀剂图案并除去填充膜。 由于光致抗蚀剂膜由于填充膜而可以大大减小厚度,所以可以提高用于形成光致抗蚀剂图案的光刻工艺的DOF和处理余量。