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1. 发明专利

CZ1238U1 Suspension bar 未知
公开(公告)号：CZ1238U1
公开(公告)日：1994-03-16
申请号：CZ100093
申请日：1992-04-03
申请人： STRECKER GUNTHER
发明人： STRECKER GUNTHER
IPC分类号： C23C2/40 , C25D17/06 , C25D17/08 , H05K3/24 , C23C002/40 , C25D017/06
摘要： PCT No. PCT/DE92/00270 Sec. 371 Date Jun. 30, 1993 Sec. 102(e) Date Jun. 30, 1993 PCT Filed Apr. 3, 1992 PCT Pub. No. WO93/09259 PCT Pub. Date May 13, 1993.In a rack bar (12) for immersion electroplating of printed circuit boards (14) elongated spring clips (34) are provided for clamping the printed circuit boards, which spring clips extend substantially in the direction of the rack bar, are rigidly connected to the rack bar at one of their ends and are movable with their other end contacting the printed circuit board between a clamping position and a disengagement position in which the spring clip is lying as a whole beside the printed circuit board. This arrangement permits an easy frontal loading and unloading of the printed circuit boards, has little wear and allows a great exploitation also of the edge area of the printed circuit board.

2. 发明申请

US20010040098A1 Processing apparatus and processing system 失效
标题翻译：处理装置和处理系统
公开(公告)号：US20010040098A1
公开(公告)日：2001-11-15
申请号：US09846660
申请日：2001-05-01
发明人： Wataru Okase , Takenobu Matsuo
IPC分类号： C25D003/38 , C25D021/12 , C25D007/12 , H01L021/445 , C25D017/00 , C25D017/06
CPC分类号： C25D17/001 , C25D7/123
摘要： A plating system is composed of a transfer device for performing transfer of a wafer, a plating unit and a washing/drying unit provided around the transfer device. Each unit is structured to be detachable from the plating system. The plating unit is divided into a wafer transfer section and a plating section by a separator, and atmosphere of each section is independently set.
摘要翻译：电镀系统由设置在转印装置周围的晶片，电镀单元和洗涤/干燥单元的转印用转印装置构成。每个单元被构造成可从电镀系统拆卸。电镀单元通过隔板分为晶片转印部和镀层部，各部分的气氛被独立设定。

3. 发明申请

US20010040097A1 Web conveying apparatus, and apparatus and method for electrodeposition using web conveying apparatus 失效
标题翻译：纸幅输送装置以及使用纸幅输送装置的电沉积的装置和方法
公开(公告)号：US20010040097A1
公开(公告)日：2001-11-15
申请号：US09817301
申请日：2001-03-27
发明人： Kozo Arao , Noboru Toyama , Yuichi Sonoda , Yusuke Miyamoto
IPC分类号： C25D021/12 , C25D009/06 , C25D011/34 , C25D019/00 , C25D017/06
CPC分类号： B65H23/105 , B21B37/68 , B21C47/003 , B21C47/34 , B21C47/3425 , B21C47/345 , B65H23/038 , B65H2511/214 , B65H2555/24 , B65H2220/01
摘要： The present invention provides a web conveying apparatus for conveying a web while holding the web and applying tension to the web, wherein the conveying apparatus has a plurality of rollers with which the web contacts to be conveyed, and at least one roller of the plurality of rollers has a mechanism for limiting deformation of the web within Y/E, and a web conveying method using a web conveying apparatus for conveying a web while holding the web and applying tension to the web, wherein the conveying apparatus has a plurality of rollers with which the web contacts to be conveyed, and the web is conveyed while the deformation of the web is limited within Y/E by a mechanism that is provided for at least one roller of the plurality of rollers. The apparatus and the method prevent meandering of the web.
摘要翻译：本发明提供一种纸幅输送装置，用于在保持纸幅并且向纸幅施加张力的同时传送纸幅，其中，所述输送装置具有多个辊，所述纸幅与所述辊接触以被输送，并且所述多个辊中的至少一个辊辊子具有用于限制幅材在Y / E内的变形的机构，以及使用幅材输送装置的幅材输送方法，所述幅材输送装置用于在保持纸幅并且向纸幅施加张力的同时输送纸幅，其中所述输送装置具有多个辊，当纸幅的变形被限制在Y / E内时，通过为多个辊中的至少一个辊提供的机构来传送纸幅。该装置和方法防止网页的曲折。

4. 发明申请

US20030010626A1 System for plating planar articles 审中-公开
标题翻译：平面制品电镀系统
公开(公告)号：US20030010626A1
公开(公告)日：2003-01-16
申请号：US09907332
申请日：2001-07-16
发明人： Daniel J. Gramarossa , Gary C. Downes
IPC分类号： C25D017/00 , C25C007/00 , C25B009/00 , C25F007/00 , B23H011/00 , B23H007/26 , C25D017/04 , C25D017/06 , C25D017/16
CPC分类号： H01L21/67748 , C25D17/001 , H01L21/2885 , H01L21/67712 , H01L21/67718 , H01L21/67751 , H01L21/6776
摘要： A wafer plating system horizontally transporting vertically oriented wafers into one or more process cells. The wafer processing system includes a carrier rotatable from a substantially horizontal orientation to a substantially vertical orientation. A cathode assembly secures the wafer onto the carrier and electrically couples the wafer to a power supply.
摘要翻译：将垂直取向的晶片水平地输送到一个或多个处理单元中的晶圆电镀系统。晶片处理系统包括可从基本上水平的方向旋转到基本垂直取向的载体。阴极组件将晶片固定在载体上并将晶片电耦合到电源。

5. 发明申请

US20020112954A1 Plating rack for plating procedures and processes for making and using same 审中-公开
标题翻译：电镀步骤及其制造和使用过程的电镀架
公开(公告)号：US20020112954A1
公开(公告)日：2002-08-22
申请号：US10061157
申请日：2002-02-04
申请人： Associated Plating Co.
发明人： Michael W. Evans
IPC分类号： C25D017/28 , C25D017/06
CPC分类号： C25D17/08
摘要： Plating rack for releasably holding parts in a plating process, as well as processes for fabricating and using such a rack, including spring members mounted to a frame which releasably hold plate-shaped parts from the opposite side edges of the parts in a manner permitting the part to move sufficiently, without disengagement, when immersed in an agitated plating fluid such that plating occurs on all the exterior surface regions of the plate and scarring is avoided.
摘要翻译：用于在电镀工艺中可释放地保持部件的电镀架，以及用于制造和使用这种齿条的工艺，其包括安装到框架上的弹簧构件，该框架以可允许的方式将板状部件从部件的相对侧边缘可释放地保持当浸没在搅拌的电镀液中时，部分足够的移动而没有脱离，从而避免了在板的所有外表面区域发生电镀和疤痕。

6. 发明申请

US20010023821A1 Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same 有权
标题翻译：用于工件加工站的提升和旋转组件及其附接方法
公开(公告)号：US20010023821A1
公开(公告)日：2001-09-27
申请号：US09875424
申请日：2001-06-05
发明人： Randy Harris , Daniel J. Woodruff
IPC分类号： C25D017/00 , C25D017/04 , C25D017/06 , B05C013/00
CPC分类号： H01L21/67017 , C25D7/12 , C25D17/06
摘要： A lift and rotate assembly for use in a workpiece processing station. The lift and rotate assembly includes a body having a slim profile and pins located on opposite sides for mounting the assembly onto a tool frame. The lift and rotate assembly is removably and pivotally mounted to an exposed outer surface of the frame. The lift and rotate assembly has a body, a process head movably connected to the body, and control components mounted within the body and configured to move the process head relative to the body. The lift and rotate assembly in one embodiment is positionable in a forward, operating position with the body adjacent to the frame, and in a tilted, service position with the body tilted away from the frame.
摘要翻译：用于工件加工台的升降和旋转组件。提升和旋转组件包括具有细长轮廓的主体和位于相对侧上的销，用于将组件安装到工具框架上。提升和旋转组件可拆卸地枢转地安装到框架的暴露的外表面。提升和旋转组件具有主体，可移动地连接到主体的过程头，以及安装在主体内并被配置为相对于主体移动过程头的控制部件。一个实施例中的提升和旋转组件可定位在身体相邻于框架的向前的操作位置中，并且在倾斜的使用位置，其中身体从框架倾斜。

7. 发明申请

US20040055879A1 Cathode current control system for a wafer electroplating apparatus 有权
标题翻译：晶圆电镀设备的阴极电流控制系统
公开(公告)号：US20040055879A1
公开(公告)日：2004-03-25
申请号：US10667814
申请日：2003-09-22
发明人： Robert W. Berner , Joseph J. Fatula JR. , Robert Hitzfeld , Richard Contreras , Andrew Chiu
IPC分类号： C25D017/04 , C25D017/06 , C25D017/10 , C25D017/16 , C25B009/00 , C25B011/00 , C25C007/00 , C25C007/02 , C25F007/00
CPC分类号： C25D17/007 , C25D17/00 , C25D17/001
摘要： A cathode current control system employing a current thief for use in electroplating a wafer is set forth. The current thief comprises a plurality of conductive segments disposed to substantially surround a peripheral region of the wafer. A first plurality of resistance devices are used, each associated with a respective one of the plurality of conductive segments. The resistance devices are used to regulate current through the respective conductive finger during electroplating of the wafer. Various constructions are used for the current thief and further conductive elements, such as fingers, may also be employed in the system. As with the conductive segments, current through the fingers may also be individually controlled. In accordance with one embodiment of the overall system, selection of the resistance of each respective resistance devices is automatically controlled in accordance with predetermined programming.
摘要翻译：阐述了一种使用电流窃电用于电镀晶片的阴极电流控制系统。当前的小偷包括设置成基本上围绕晶片周边区域的多个导电段。使用第一多个电阻器件，每个电阻器件与多个导电段中的相应一个相连。电阻器件用于在晶片的电镀期间调节通过相应的导电指状物的电流。各种结构用于当前的小偷，并且还可以在系统中使用诸如手指的其它导电元件。与导电段一样，通过手指的电流也可以单独控制。根据整个系统的一个实施例，根据预定的程序自动控制对各个电阻装置的电阻的选择。

8. 发明申请

US20030217916A1 Electroplating reactor 有权
标题翻译：电镀反应器
公开(公告)号：US20030217916A1
公开(公告)日：2003-11-27
申请号：US10154426
申请日：2002-05-21
发明人： Daniel J. Woodruff , Kyle M. Hanson
IPC分类号： C25D017/06
CPC分类号： C25D17/001 , C25D7/123 , C25D17/06
摘要： A reactor for electroplating a workpiece includes a vessel having a ring contact arranged to support a workpiece in a horizontal orientation. In an embodiment of the invention, an electrode is arranged below the ring contact, and a pressing member is arranged above the ring contact to press a workpiece into electrical engagement with the ring contact. The vessel may be adapted to contain an electroplating fluid between a top of the ring contact and the electrode. In one embodiment, a movable intermediate workpiece support assembly is carried by the vessel, the support assembly being actuatable to lower a workpiece carried thereby to deliver the workpiece to be supported accurately and precisely on the ring contact.
摘要翻译：用于电镀工件的反应器包括具有环形接触件的容器，该环形接触件被布置成在水平取向上支撑工件。在本发明的一个实施例中，电极布置在环形触点下方，并且按压构件设置在环形接触件的上方，以将工件压向与环形触点电接合。容器可以适于在环形接触件的顶部和电极之间容纳电镀液体。在一个实施例中，可移动中间工件支撑组件由容器承载，支撑组件可致动以降低由此携带的工件，从而将待被支撑的工件准确而准确地传送到环形接触件上。

9. 发明申请

US20020153246A1 Method and apparatus for electropolishing metal interconnections on semiconductor devices 失效
标题翻译：用于电解抛光半导体器件上的金属互连的方法和装置
公开(公告)号：US20020153246A1
公开(公告)日：2002-10-24
申请号：US10120570
申请日：2002-04-10
发明人： Hui Wang
IPC分类号： C25C007/00 , C25F007/00 , C25B009/00 , C25D017/04 , C25D017/06 , C25D017/16 , C25F003/00 , B23H005/00 , B23H007/00 , B23H007/26 , B23H009/00 , B23H003/00 , B23H011/00 , H01L021/00 , H05K003/07
CPC分类号： H01L21/32115 , C25F3/22 , C25F7/00 , H01L21/32134 , H01L21/7684
摘要： An apparatus for electropolishing a wafer includes a wafer chuck and a stationary jet. The wafer chuck is configured to rotate and translate the wafer. The stationary jet is configured to apply an electrolyte to the wafer when the wafer is translated and rotated by the wafer chuck.
摘要翻译：用于电抛光晶片的装置包括晶片卡盘和静止射流。晶片卡盘配置成旋转和平移晶片。固定喷射器构造成当晶片被晶片卡盘平移和旋转时，将电解质施加到晶片。

10. 发明申请

US20020050452A1 Electrode semiconductor workpiece holder and processing methods 有权
标题翻译：电极半导体工件夹具及加工方法
公开(公告)号：US20020050452A1
公开(公告)日：2002-05-02
申请号：US09811261
申请日：2001-03-16
发明人： Martin Bleck , Kenneth C. Haugan , Larry R. Radloff , Harry Geyer
IPC分类号： C25C007/00 , C25F007/00 , B23H007/26 , C25B009/00 , B23H011/00 , C25D017/04 , C25D017/06 , C25D017/16
CPC分类号： H01L21/68728 , H01L21/68785
摘要： A semiconductor workpiece holder for use in processing a semiconductor workpiece includes a workpiece support operatively mounted to support a workpiece in position for processing. A finger assembly is operatively mounted upon the workpiece support and includes a finger tip. The finger assembly is movable between an engaged position in which the finger tip is engaged against the workpiece, and a disengaged position in which the finger tip is moved away from the workpiece. Preferably, at least one electrode forms part of the finger assembly and includes an electrode contact for contacting a surface of said workpiece. At least one protective sheath covers at least some of the electrode contact. According to one aspect of the invention, a sheathed electrode having a sheathed electrode tip is positioned against a semiconductor workpiece surface in a manner engaging the workpiece surface with said sheathed electrode tip. A seal is formed about the periphery of the electrode tip, and with the electrode tip engaging the workpiece, a desired electrical contact is made to the workpiece. Thereafter, the workpiece is exposed to desired semiconductor processing conditions.
摘要翻译：用于处理半导体工件的半导体工件保持件包括可操作地安装以将工件支撑在适于处理的工件的工件支撑件。手指组件可操作地安装在工件支撑件上并且包括指尖。手指组件可在指尖接合工件的接合位置和指尖从工件移开的脱离位置之间移动。优选地，至少一个电极形成指状组件的一部分，并且包括用于接触所述工件的表面的电极接触。至少一个护套覆盖至少一些电极接触。根据本发明的一个方面，具有护套电极末端的护套电极以与所述护套电极末端接合工件表面的方式抵靠半导体工件表面定位。围绕电极末端的周边形成密封，并且电极末端与工件接合，对工件进行所需的电接触。此后，将工件暴露于期望的半导体加工条件。

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