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1. 发明专利

CZ4758U1 Staining machine 未知
公开(公告)号：CZ4758U1
公开(公告)日：1996-07-17
申请号：CZ509896
申请日：1996-03-12
申请人： KOZELKA PETR
发明人： KOZELKA PETR
IPC分类号： B05C13/00 , B05C013/00

2. 发明专利

CZ3354U1 Mobile device for attaching a component, particularly when painting 未知
公开(公告)号：CZ3354U1
公开(公告)日：1995-07-12
申请号：CZ359995
申请日：1995-02-24
申请人： KLEIN VYROBNI SDRUZENI KLEIN G
发明人： KLEIN MARTIN ING
IPC分类号： B05C13/00 , B05C013/00

3. 发明申请

US20040231584A1 Spin coating apparatus for coating photoresist 审中-公开
标题翻译：用于涂覆光致抗蚀剂的旋涂装置
公开(公告)号：US20040231584A1
公开(公告)日：2004-11-25
申请号：US10797579
申请日：2004-03-11
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Eun-sung Lee , Sung-hoon Choa , Min-seog Choi
IPC分类号： B05C013/00
CPC分类号： H01L21/6715
摘要： A spin coating apparatus for coating photoresist has a spin chuck and a nozzle part. The spin chuck has a mount part on which a wafer is mounted and an extended projection part on which edge-bead is formed. The nozzle part is for depositing photoresist onto the wafer mounted on the mount part of the spin chuck. By using the spin coating apparatus, edge-bead is formed on the extended projection part, and not on the wafer.
摘要翻译：用于涂覆光致抗蚀剂的旋涂装置具有旋转卡盘和喷嘴部分。旋转卡盘具有其上安装有晶片的安装部分和形成有边缘珠的延伸突起部分。喷嘴部分用于将光致抗蚀剂沉积到安装在旋转卡盘的安装部分上的晶片上。通过使用旋涂装置，在延伸的突出部分上而不是在晶片上形成边缘珠。

4. 发明申请

US20040052959A1 Method and installation for hot process and continuous dip coating of a metal strip 有权
标题翻译：金属条的热加工和连续浸涂的方法和安装
公开(公告)号：US20040052959A1
公开(公告)日：2004-03-18
申请号：US10416193
申请日：2003-10-10
发明人： Didier Dauchelle , Hugues Baudin , Patrice Lucas , Laurent Gacher , Yves Prigent
IPC分类号： B05D001/18 , B05C011/02 , B05C013/00 , B05C021/00
CPC分类号： C23C2/00
摘要： The subject of the invention is a process for the continuous dip-coating of a metal strip (1) in a tank (11) containing a liquid metal bath (12), in which process the metal strip (1) is made to run continuously through a duct (13), the lower part (13a) of which is immersed in the liquid metal bath (12) in order to define with the surface of the said bath a liquid seal (14). A natural flow of the liquid metal from the surface of the liquid seal (14) is set up in two overflow compartments (25, 29) made in the said duct (13) and each having an internal wall which extends the duct (13) in its lower part and the level of liquid metal in the said compartments is maintained at a level below the surface of the liquid seal (14). Another subject of the invention is a plant for implementing the process.
摘要翻译：本发明的主题是一种用于在包含液态金属浴（12）的罐（11）中连续浸涂金属带（1）的方法，其中使金属条（1）连续地运行通过管道（13），其下部（13a）浸没在液体金属浴（12）中，以便与所述浴的表面限定液体密封（14）。来自液体密封件（14）表面的液体金属的自然流动被设置在在所述管道（13）中制成的两个溢流隔室（25,29）中，并且每个具有延伸管道（13）的内壁，在其下部，并且所述隔室中的液态金属的水平保持在液体密封件（14）的表面以下的水平。本发明的另一主题是用于实施该方法的设备。

5. 发明申请

US20040011283A1 Method and apparatus for reducing warpage during application and curing of encapsulant materials on a printed circuit board 失效
标题翻译：用于在印刷电路板上施加和固化密封材料期间减少翘曲的方法和装置
公开(公告)号：US20040011283A1
公开(公告)日：2004-01-22
申请号：US10620053
申请日：2003-07-14
发明人： Derek J. Gochnour , Leonard E. Mess
IPC分类号： B05C013/00
CPC分类号： H05K13/00 , H01L2924/3511 , H05K3/284
摘要： A method and apparatus for preventing board warpage during the application and curing or drying of liquid epoxies, or the like, on printed circuit boards using a clamping fixture assembly, which includes at least one clamping fixture support and at least one clamping fixture overlay. If desired, a plurality of printed circuit boards may be processed using an appropriate clamping fixture assembly. Furthermore, the clamping fixture may be constructed so a slight bow or curvature thereof can counter either a convex or concave bow or curvature of the printed circuit board. In the method, at least one printed circuit board is mounted to a clamping fixture support whereby a clamping fixture overlay is placed on top of the first printed circuit board.
摘要翻译：一种用于在使用夹紧夹具组件的印刷电路板上施加和固化或干燥液体环氧树脂等期间防止板翘曲的方法和装置，其包括至少一个夹紧夹具支架和至少一个夹紧固定盖。如果需要，可以使用适当的夹具组件来处理多个印刷电路板。此外，夹持夹具可以被构造成轻微的弓形或其曲率可以对抗印刷电路板的凸形或凹形弓形或曲率。在该方法中，至少一个印刷电路板安装到夹具固定支架上，由此夹紧夹具覆盖物放置在第一印刷电路板的顶部上。

6. 发明申请

US20030075102A1 System for inverting substrates 审中-公开
标题翻译：反转基板的系统
公开(公告)号：US20030075102A1
公开(公告)日：2003-04-24
申请号：US10279145
申请日：2002-10-23
发明人： Ronald A. Crocker
IPC分类号： B05C013/00
CPC分类号： H01L21/68764 , B05B13/0264 , C23C14/505 , H01L21/68707 , H05K3/0091
摘要： The present invention is a substrate inverting apparatus mounted to a substrate-coating machine. The apparatus is used for inverting a substrate within a vacuum chamber. The apparatus includes a substrate holding means for holding the substrate substantially rigidly relative to the substrate holding means. The apparatus further includes an actuating means mounted to the substrate-coating machine for inverting the substrate holding means.
摘要翻译：本发明是安装在基板涂布机上的基板翻转装置。该装置用于使真空室内的基板反转。该装置包括用于相对于基板保持装置基本上刚性地保持基板的基板保持装置。该装置还包括安装到基板涂覆机用于翻转基板保持装置的致动装置。

7. 发明申请

US20020179014A1 Replaceable shielding apparatus 失效
标题翻译：可更换屏蔽装置
公开(公告)号：US20020179014A1
公开(公告)日：2002-12-05
申请号：US10195357
申请日：2002-07-16
发明人： Tue Nguyen
IPC分类号： B05C013/00
CPC分类号： C23C16/4585 , C23C16/042
摘要： A replaceable shielding apparatus provides a cost effective way of shielding a portion of a workpiece during processing. The apparatus includes a replaceable shield, made of comparable weight as the workpiece for allowing replacement of the shield in the same way as the replacement of the workpiece. With this feature, the replacement of the shield is a routine process and would not interfere much with the workpiece operation. The invention further includes a shield clamp for clamping the shield onto the workpiece. In a preferred embodiment, the invention further includes a non-reactive gas inlet for creating a pressurized cavity in the vicinity of the shielded portion of the workpiece.
摘要翻译：可替换的屏蔽装置提供了在加工期间屏蔽工件的一部分的成本有效的方法。该装置包括可替换的屏蔽件，其具有与工件相当的重量，用于允许以与更换工件相同的方式更换屏蔽件。使用此功能，更换屏蔽件是常规工艺，不会干扰工件操作。本发明还包括用于将屏蔽件夹持到工件上的屏蔽夹。在优选实施例中，本发明还包括用于在工件的屏蔽部分附近产生加压腔的非反应性气体入口。

8. 发明申请

US20020088395A1 Coating booth for film 失效
标题翻译：电影涂装亭
公开(公告)号：US20020088395A1
公开(公告)日：2002-07-11
申请号：US10001795
申请日：2001-12-05
申请人： Japan Alumibody Maintenance Co., Ltd.
发明人： Tomio Asahi
IPC分类号： B05C013/00
CPC分类号： B05B13/02 , B05B16/60 , Y10S55/46
摘要： A coating booth for film having a table on which a film to be coated is mounted, an air intake which is provided in the ceiling of the booth and through which open air is cleaned and introduced into the inside of the booth, and an exhaust system which sucks up the introduced air from the side walls of the table to make a substantially horizontal air flow inside the table and discharges the air outside, wherein the table has a substantially horizontal tabletop with a plurality of suction holes so that a film mounted thereon are held by suction by the action of the air flow inside the table.
摘要翻译：一种用于胶片的涂装室，其上安装有待涂覆的薄膜的台面，设置在展位的天花板中并通过其清洁并引入室内的空气的排气系统其从桌子的侧壁吸入引入的空气，以在桌子内部形成基本上水平的空气流并将空气排出到外部，其中桌子具有大致水平的台面，其具有多个吸孔，使得其上安装的薄膜是通过吸盘内的气流动作保持在桌子内。

9. 发明申请

US20020017237A1 Apparatus for processing a workpiece 有权
标题翻译：用于加工工件的设备
公开(公告)号：US20020017237A1
公开(公告)日：2002-02-14
申请号：US09907522
申请日：2001-07-16
申请人： Semitool, Inc.
发明人： Paul Z. Wirth , Steven L. Peace
IPC分类号： B05C013/00 , B05C013/02 , B05C021/00 , H01L021/31 , H01L021/469 , B25J001/00 , B65G049/07 , B05C003/00 , B05C019/02
CPC分类号： B08B3/04 , H01L21/32134 , H01L21/67017 , H01L21/67051 , H01L21/67057 , H01L21/6708 , H01L21/67086 , H01L21/6715 , Y10S118/90 , Y10S438/906 , Y10S438/913
摘要： A system for processing a workpiece includes a base having a bowl or recess for holding a liquid. A process reactor or head holds a workpiece between an upper rotor and a lower rotor. A head lifter lowers the head holding the workpiece into contact with the liquid. The head spins the workpiece during or after contact with the liquid. The upper and lower rotors have side openings for loading and unloading a workpiece into the head. The rotors are axially moveable to align the side openings.
摘要翻译：用于处理工件的系统包括具有用于保持液体的碗或凹部的底座。工艺反应器或头部将工件保持在上转子和下转子之间。头部升降器降低了将工件保持与液体接触的头部。头部在与液体接触期间或之后旋转工件。上下转子具有用于将工件装载和卸载到头部中的侧开口。转子可轴向移动以对准侧开口。

10. 发明申请

US20020007785A1 Semiconductor substrate support assembly having lobed o-rings therein 失效
标题翻译：半导体衬底支撑组件在其中具有凸起的O形环
公开(公告)号：US20020007785A1
公开(公告)日：2002-01-24
申请号：US09797217
申请日：2001-02-28
申请人： Applied Materials, Inc.
发明人： Rudolf Gujer , Thomas K. Cho , Tetsuya Ishikawa
IPC分类号： C23C016/00 , B05C013/00
CPC分类号： C23C16/4409 , C23C16/4412 , C23C16/45561 , C23C16/4586
摘要： A semiconductor wafer processing substrate support assembly, comprises a substrate support platform having a centrally disposed recess, coupled to a base disposed above the centrally disposed recess, a plate disposed above the base, and a substrate support disposed above the plate. The substrate support assembly further comprises a plurality of o-rings having a plurality of lobes, wherein a first lobed o-ring of the plurality of lobed o-rings is disposed between the support platform and the base, a second lobed o-ring is disposed between the base and the plate, and a third lobed o-ring is disposed between the plate and the substrate support. Moreover, the plurality of lobed o-rings are utilized in the support assembly for reducing the number of o-rings required in the support assembly.
摘要翻译：半导体晶片处理基板支撑组件包括具有中心设置的凹部的基板支撑平台，其联接到设置在中心设置的凹部上方的基座，设置在基座上方的板和设置在板上方的基板支撑。所述基板支撑组件还包括多个具有多个凸角的O形环，其中所述多个凸起的O形环的第一凸起的O形环设置在所述支撑平台和所述基座之间，第二凸起的O形环是设置在基座和板之间，并且第三叶片O形环设置在板和基板支撑件之间。此外，在支撑组件中使用多个凸起的O形环以减少支撑组件中所需的O形圈的数量。

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