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    • 1. 发明授权
    • Emery polishing machine
    • 金刚砂抛光机
    • US06743084B1
    • 2004-06-01
    • US10422693
    • 2003-04-25
    • Mao Nan Cheng
    • Mao Nan Cheng
    • B24B2100
    • B24B21/12
    • An emery polishing machine is provided with plural adjusting devices positioned between the opposite shaft ends of two emery polishing wheels and machine box. The adjusting devices enable the two emery-polishing wheels to be micro-adjusted to move upward and downward independently. Emery paper tapes of different-sized sands can be fitted on the two emery-polishing wheels to carry out rough and fine polishing at the same time. Two dust-collecting pipes are provided at one side of the dust-preventing cover of the machine box, and plural rollers are provided on the dust-preventing cover. Thus, after a wooden board has one side polished, it can be turned over and directly placed on the rollers on the dust-preventing cover to be moved in a feeding opening to have the other side polished. Thus a wooden board is quickly moved with less force and less space.
    • 金刚砂抛光机设置有位于两个砂轮抛光轮和机箱的相对的轴端之间的多个调节装置。 调整装置使得两个砂轮抛光轮被微调以独立地向上和向下移动。 不同尺寸的沙子的砂纸可以安装在两个砂轮抛光轮上,同时进行粗糙和精细的抛光。 在机箱的防尘罩的一侧设置有两个集尘管,在防尘罩上设置有多个辊。 因此,在木板一面抛光后,可以将其翻转并直接放置在防尘罩上的辊上,以在进给口中移动以使另一面抛光。 因此,木板快速移动,力量较小,空间更小。
    • 4. 发明授权
    • Hydrostatic fluid bearing support with adjustable inlet heights
    • 静压流体轴承支架,可调入口高度
    • US06454641B1
    • 2002-09-24
    • US09708219
    • 2000-11-07
    • David E. WeldonShu-Hsin KaoTim H. Huynh
    • David E. WeldonShu-Hsin KaoTim H. Huynh
    • B24B2100
    • F16C32/06B24B21/10B24B37/04B24B37/042B24B41/04B24B41/042H01L21/302
    • A polishing system such as a chemical mechanical belt polisher includes a hydrostatic fluid bearing that supports polishing pads and incorporates one or more of the following novel aspects. One aspect uses compliant surfaces surrounding fluid inlets in an array of inlets to extend areas of elevated support pressure around the inlets. Another aspect modulates or reverses fluid flow in the bearing to reduce deviations in the time averaged support pressure and to induce vibrations in the polishing pads to improve polishing performance. Another aspect provides a hydrostatic bearing with a cavity having a lateral extent greater than that of an object being polished. The depth and bottom contour of cavity can be adjusted to provide nearly uniform support pressure across an area that is surrounded by a retaining ring support. Changing fluid pressure to the retaining ring support adjusts the fluid film thickness of the bearing. Yet another aspect of the invention provides a hydrostatic bearing with spiral or partial cardiod drain grooves. This bearing has a non-uniform support pressure profile but provides a uniform average pressure to a wafer that is rotated relative to the center of the bearing. Another aspect of the invention provides a hydrostatic bearing with constant fluid pressure at inlets but a support pressure profile that is adjustable by changing the relative heights of fluid inlets to alter local fluid film thicknesses in the hydrostatic bearing.
    • 诸如化学机械带抛光机的抛光系统包括支撑抛光垫并且包含以下新颖方面中的一个或多个的静压流体轴承。 一个方面使用围绕入口阵列的流体入口周围的顺应性表面来延伸围绕入口的升高的支撑压力的区域。 另一方面调节或反转轴承中的流体流动,以减少时间平均支撑压力的偏差并且引起抛光垫中的振动以改善抛光性能。 另一方面提供一种具有空腔的静压轴承,该空腔的横向范围大于被抛光物体的横向范围。 可以调节空腔的深度和底部轮廓,以在由保持环支撑件包围的区域上提供几乎均匀的支撑压力。 将流体压力改变到保持环支架可调节轴承的流体膜厚度。 本发明的另一方面提供一种具有螺旋或部分心碘排泄槽的静压轴承。 该轴承具有不均匀的支撑压力分布,但是相对于轴承的中心旋转的晶片提供均匀的平均压力。 本发明的另一方面提供了一种静压轴承,其在入口处具有恒定的流体压力,但是支撑压力分布可通过改变流体入口的相对高度来调节,以改变静压轴承中的局部流体膜厚度。
    • 5. 发明授权
    • Polishing pad for a linear polisher and method for forming
    • 线性抛光机用抛光垫及成型方法
    • US06422929B1
    • 2002-07-23
    • US09541070
    • 2000-03-31
    • Syun-Ming JangYing-Ho Chen
    • Syun-Ming JangYing-Ho Chen
    • B24B2100
    • B24B37/24B24B21/04B24B37/26B24D18/0063
    • A polishing pad for use in a linear polisher, and more specifically, for a linear chemical mechanical polishing apparatus that has improved polishing uniformity is described. The polishing pad is provided with a top surface for engaging a wafer surface to be polished. The top surface has a center portion and two oppositely situated edge portions. The polishing pad is further provided with a multiplicity of voids situated in the top surface of the pad body such that the top surface has a void-to-surface ratio that is greater in the two edge portions than in the center portion of the top surface. The present invention novel polishing pad provides a more uniform polishing across a wafer surface, together with an improved planarity after polishing.
    • 描述了一种用于线性抛光机的抛光垫,更具体地说,涉及具有改善的抛光均匀性的线性化学机械抛光装置。 抛光垫设置有用于接合要抛光的晶片表面的顶表面。 顶表面具有中心部分和两个相对设置的边缘部分。 抛光垫还设置有位于衬垫主体的顶表面中的多个空隙,使得顶表面在两个边缘部分中的空隙与表面之比大于顶表面的中心部分 。 本发明的新型抛光垫在晶片表面上提供更均匀的抛光以及抛光后的改进的平面度。
    • 7. 发明授权
    • Use of zeta potential during chemical mechanical polishing for end point detection
    • 化学机械抛光期间使用ζ电位进行终点检测
    • US06325706B1
    • 2001-12-04
    • US09182570
    • 1998-10-29
    • Wilbur C. KrusellAndrew J. NagengastAnil K. Pant
    • Wilbur C. KrusellAndrew J. NagengastAnil K. Pant
    • B24B2100
    • B24B37/013B24B21/08B24B49/16G01N1/32H01L21/3212H01L21/76807
    • A technique for utilizing a sensor to monitor fluid pressure from a fluid bearing located under a polishing pad to detect a polishing end point. A sensor is located at the leading edge of a fluid bearing of a linear polisher, which is utilized to perform chemical-mechanical polishing on a semiconductor wafer. The sensor monitors the fluid pressure to detect a change in the fluid pressure during polishing, which change corresponds to a change in the shear force when the polishing transitions from one material layer to the next. In order to ensure that there is a noticeable difference in the shear force variation at the polishing end point, a slurry having a particular pH level is selected. The pH level ensures that the zeta potential changes noticeably from one material to the next, so as to induce a change in the shear force, which is detected by a change in the fluid pressure.
    • 一种利用传感器来监测来自位于抛光垫下方的流体轴承的流体压力以检测抛光终点的技术。 传感器位于线性抛光机的流体轴承的前缘,用于在半导体晶片上执行化学机械抛光。 传感器监测流体压力以检测抛光期间的流体压力的变化,该变化对应于当抛光从一个材料层转移到下一个材料层时的剪切力的变化。 为了确保在抛光终点处的剪切力变化存在显着的差异,选择具有特定pH值的浆料。 pH值确保ζ电位从一种材料明显变化到另一种材料,从而引起由流体压力变化所检测的剪切力的变化。
    • 8. 发明授权
    • Sander having adjustable sander member
    • 砂光机具有可调砂轮部件
    • US06283841B1
    • 2001-09-04
    • US09556159
    • 2000-04-21
    • Tian Wang Wang
    • Tian Wang Wang
    • B24B2100
    • B23Q37/002B24B21/00B24B27/0084B24B41/068
    • A sander includes a base having a platform for supporting a work piece. A casing is rotatably secured to the base at a pivot shaft and has a plate for supporting a sander member. A lock device may secure the casing and the sander member to the base at any selected angular positions. The casing has two rotatable barrels for supporting the sander member. A motor is secured to the casing and secured to one of the barrels for driving the sander member via the barrels. The barrels may be adjusted relative to each other to tighten the sander member.
    • 砂光机包括具有用于支撑工件的平台的底座。 壳体在枢轴处可旋转地固定到基座,并且具有用于支撑砂光构件的板。 锁定装置可以在任何选定的角度位置将壳体和砂光机构件固定到基座。 壳体具有用于支撑砂光机构件的两个可旋转的滚筒。 马达被固定到壳体并固定到一个滚筒中,用于通过滚筒驱动砂光机构件。 可以相对于彼此调节桶以收紧砂光机构件。