会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明授权
    • Method for minimizing false detection of states in flash memory devices
    • 用于最小化闪速存储器件中的状态的错误检测的方法
    • US07283398B1
    • 2007-10-16
    • US10838962
    • 2004-05-04
    • Yue-Song HeRichard FastowTakao AkaogiWing LeungZhigang Wang
    • Yue-Song HeRichard FastowTakao AkaogiWing LeungZhigang Wang
    • G11C16/06
    • G11C16/0466G11C16/344G11C16/3445G11C16/3477
    • The present invention provides a method for determining program and erase states in flash memory devices. Specifically, one embodiment of the present invention discloses a method for minimizing false detection of states in an array of non-volatile floating gate memory cells. A plurality of word lines are arranged in a plurality of rows. A plurality of bit lines are arranged in a plurality of columns. The method begins by determining a selected bit line that is associated with a column of memory cells. Then, the method continues by biasing a group of word lines at a negative voltage. The group of word lines are electrically coupled to the associated memory cells. The application of negative voltage to the group of word lines limits leakage current contributions from the associated memory cells in the column of memory cells when performing a verify operation.
    • 本发明提供一种用于确定闪存设备中的程序和擦除状态的方法。 具体地,本发明的一个实施例公开了一种用于使非易失性浮动栅极存储单元的阵列中的状态的错误检测最小化的方法。 多个字线被布置成多行。 多个位线被布置在多个列中。 该方法通过确定与一列存储器单元相关联的所选位线开始。 然后,该方法通过在一个负电压下偏置一组字线来继续。 字线组电耦合到相关联的存储器单元。 当执行验证操作时,将负电压施加到字线组限制了来自存储器单元列中的相关联存储器单元的泄漏电流贡献。
    • 5. 发明授权
    • N-Gate/N-Substrate or P-Gate/P-Substrate capacitor to characterize polysilicon gate depletion evaluation
    • N栅极/ N基板或P栅极/ P基板电容器来表征多晶硅栅极耗尽评估
    • US06888157B1
    • 2005-05-03
    • US09917440
    • 2001-07-27
    • Zhigang WangNian YangYue-song He
    • Zhigang WangNian YangYue-song He
    • H01L23/544H01L23/58
    • H01L22/34H01L2924/0002H01L2924/00
    • A capacitor structure for characterizing polysilicon gate depletion effects of a particular semiconductor fabrication process. In one embodiment, an N-Gate/N-Substrate capacitor is fabricated with the semiconductor fabrication process which is being evaluated for its polysilicon gate depletion effects. The N-gate of capacitor structure is driven to depletion while the N-substrate is simultaneously driven to accumulation. Capacitance-voltage measurements are taken. Based on these CV measurements, the polysilicon depletion effects are then obtained for that particular semiconductor fabrication process. In another embodiment, a P-Gate/P-Substrate capacitor is fabricated with the semiconductor fabrication process. The gate of the P-Gate/P-Substrate capacitor is driven to depletion while the substrate is simultaneously driven to accumulation. Based on the CV measurements performed on the P-Gate/P-Substrate capacitor, the polysilicon depletion effects can be obtained for that particular semiconductor fabrication process. In a third embodiment, a capacitor structure device is used to evaluate the polysilicon gate depletion effects of a semiconductor fabrication process. Different voltages are selectively applied to the gate of either an N-Gate/N-Substrate capacitor or a P-Gate/P-Substrate capacitor while its capacitance is measured. Based on the CV measurements, the polysilicon gate depletion effects for that particular semiconductor fabrication process is characterized.
    • 用于表征特定半导体制造工艺的多晶硅栅极耗尽效应的电容器结构。 在一个实施例中,通过正在评估其多晶硅栅极耗尽效应的半导体制造工艺来制造N栅极/ N-衬底电容器。 驱动电容器结构的N栅极耗尽,同时驱动N衬底进行积累。 进行电容电压测量。 基于这些CV测量,然后获得针对该特定半导体制造工艺的多晶硅耗尽效应。 在另一个实施例中,通过半导体制造工艺制造P栅极/ P-基板电容器。 P栅极/ P基板电容器的栅极被驱动为耗尽,同时基板同时被驱动以累积。 基于在P型栅极/ P-基板电容器上执行的CV测量,可以获得针对该特定半导体制造工艺的多晶硅耗尽效应。 在第三实施例中,使用电容器结构器件来评估半导体制造工艺的多晶硅栅极耗尽效应。 在测量其电容时,不同的电压选择性地施加到N栅极/ N基板电容器或P栅极/ P基板电容器的栅极。 基于CV测量,对该特定半导体制造工艺的多晶硅栅极耗尽效应进行了表征。
    • 7. 发明授权
    • Structure for increasing drive current in a memory array and related method
    • 用于增加存储器阵列中的驱动电流的结构和相关方法
    • US06825526B1
    • 2004-11-30
    • US10759809
    • 2004-01-16
    • Yue-Song HeNian YangZhigang Wang
    • Yue-Song HeNian YangZhigang Wang
    • H01L29788
    • H01L27/11521H01L27/115
    • According to one exemplary embodiment, a memory array comprises first and second isolation regions situated in a substrate, where the first and second isolation regions are separated by a separation distance. The memory array further comprises a trench situated between the first and second isolation regions, where the trench defines trench sidewalls and a trench bottom in the substrate. The memory array further comprises a tunnel oxide layer situated between the first and second isolation regions, where the tunnel oxide layer is situated on the trench sidewalls and the trench bottom. According to this embodiment, the memory array further comprises a channel region situated underneath the tunnel oxide layer and extending along the trench sidewalls and the trench bottom, where the channel region has an effective channel width, where the effective channel width increases as a height of the trench sidewalls increases.
    • 根据一个示例性实施例,存储器阵列包括位于衬底中的第一和第二隔离区域,其中第一和第二隔离区域被分离距离。 存储器阵列还包括位于第一和第二隔离区之间的沟槽,其中沟槽限定衬底中的沟槽侧壁和沟底。 存储器阵列还包括位于第一和第二隔离区之间的隧道氧化物层,其中隧道氧化物层位于沟槽侧壁和沟槽底部。 根据该实施例,存储器阵列还包括位于隧道氧化物层下方并沿着沟槽侧壁和沟槽底部延伸的沟道区,其中沟道区具有有效沟道宽度,其中有效沟道宽度随着 沟槽侧壁增加。
    • 8. 发明授权
    • Efficient and accurate sensing circuit and technique for low voltage flash memory devices
    • 高效,准确的低压闪存器件感测电路和技术
    • US06898124B1
    • 2005-05-24
    • US10678446
    • 2003-10-03
    • Zhigang WangNian YangYue-Song He
    • Zhigang WangNian YangYue-Song He
    • G11C11/56G11C16/06G11C16/26
    • G11C16/26G11C11/5642
    • An exemplary sensing circuit comprises a first transistor connected to a first node, where a target memory cell has a drain capable of being connected to the first node through a selection circuit during a read operation involving the target memory cell. The sensing circuit further comprises a decouple circuit which is connected to the first transistor. The decouple circuit includes a second transistor having a gate coupled to a gate of the first transistor. The decouple circuit further has a decouple coefficient (N) greater than 1. The drain of the second transistor is connected at a second node to a reference voltage through a bias resistor. With the arrangement, the drain of the second transistor generates a sense amp input voltage at the second node such that the sense amp input voltage is decoupled from the first node.
    • 示例性感测电路包括连接到第一节点的第一晶体管,其中目标存储器单元具有能够在涉及目标存储器单元的读取操作期间通过选择电路连接到第一节点的漏极。 感测电路还包括连接到第一晶体管的去耦电路。 解耦电路包括具有耦合到第一晶体管的栅极的栅极的第二晶体管。 去耦电路还具有大于1的去耦系数(N)。第二晶体管的漏极通过偏置电阻器在第二节点连接到参考电压。 利用该布置,第二晶体管的漏极在第二节点处产生感测放大器输入电压,使得感测放大器输入电压与第一节点分离。
    • 10. 发明授权
    • Use of high-K dielectric material for ONO and tunnel oxide to improve floating gate flash memory coupling
    • 对于ONO和隧道氧化物使用高K介电材料来改善浮栅闪存耦合
    • US06617639B1
    • 2003-09-09
    • US10176594
    • 2002-06-21
    • Zhigang WangXin GuoYue-Song He
    • Zhigang WangXin GuoYue-Song He
    • H01L29788
    • H01L21/28194H01L21/28273H01L29/513H01L29/517H01L29/518H01L29/66825H01L29/7883
    • A floating gate flash memory device including a substrate comprising a source region, a drain region, and a channel region positioned therebetween; a floating gate electrode positioned above the channel region and separated from the channel region by a tunnel dielectric material layer; and a control gate electrode positioned above the floating gate electrode and separated from the floating gate electrode by an interpoly dielectric layer, the interpoly dielectric layer comprising a modified ONO structure having a bottom dielectric material layer adjacent to the floating gate electrode, a top dielectric material layer adjacent to the control gate electrode, and a center layer comprising a nitride and positioned between the bottom dielectric material layer and the top dielectric material layer, in which the tunnel dielectric material layer, and at least one of the bottom dielectric material layer and the top dielectric material layer, comprise a high-K dielectric material.
    • 一种浮栅闪存器件,包括:衬底,包括源极区,漏极区和位于其间的沟道区; 位于通道区域上方并通过隧道介电材料层与沟道区分离的浮栅电极; 以及控制栅电极,其位于所述浮置栅电极的上方,并且通过间隔电介质层与所述浮栅电极分离,所述互聚电介质层包括具有与所述浮栅电极相邻的底电介质材料层的修饰的ONO结构,顶介电材料 层,以及包括氮化物并位于底部电介质材料层和顶部电介质材料层之间的中心层,其中隧道电介质材料层和底部电介质材料层和底部电介质材料层中的至少一个 顶部介电材料层,包括高K电介质材料。