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    • 1. 发明授权
    • Method of manufacturing semiconductor device
    • 制造半导体器件的方法
    • US06544904B1
    • 2003-04-08
    • US10157882
    • 2002-05-31
    • Yuuki KamiuraHiroshi TobimatsuKouji OdaMahito SawadaKoji ShibataHiroyuki Kawata
    • Yuuki KamiuraHiroshi TobimatsuKouji OdaMahito SawadaKoji ShibataHiroyuki Kawata
    • H01L2131
    • H01L21/76802H01L21/31144H01L21/76832H01L24/05H01L2924/351H01L2924/00
    • A method of manufacturing a semiconductor device is provided, which prevents a polyimide film from coming unstuck from a film to be subjected to isotropic etching, and further prevents deposits adhered to respective side faces of the films from coming off, during a heat treatment for imidizing the polyimide film. Isotropic etching is performed on a silicon nitride film 4 using, as a mask, a polyimide film 5 having a predetermined pattern formed therein. Next, a heat treatment is carried out to imidize the polyimide film 5 prior to performing anisotropic etching on a silicon oxide film 3. During the heat treatment for imidizing the polyimide film 5, since deposits, which are to be generated by anisotropic etching, are not yet adhered to the respective side faces of the films, the polyimide film 5 does not come unstuck from the silicon nitride film 4. Further, the deposits which are adhered to the respective side face of the films after the heat treatment will not come off.
    • 提供一种制造半导体器件的方法,其防止聚酰亚胺膜从薄膜脱落以进行各向同性蚀刻,并且进一步防止在用于酰亚胺化的热处理期间粘附到膜的各个侧面的沉积物脱落 聚酰亚胺薄膜。 在氮化硅膜4上进行各向同性蚀刻,使用形成有预定图案的聚酰亚胺膜5作为掩模。 接下来,在对氧化硅膜3进行各向异性蚀刻之前,进行热处理以对聚酰亚胺膜5进行酰亚胺化。在酰亚胺化聚酰亚胺膜5的热处理中,由于通过各向异性蚀刻产生的沉积物为 还没有粘附到膜的各个侧面,聚酰亚胺膜5不会从氮化硅膜4脱落。此外,附着在热处理后的膜的相应侧面的沉积物将不会脱落 。